BTN6427N3 CYSTEKEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

CYStech Electronics Corp. Spec. No. : C214N3-A Issued Date : 2005.11.30 Revised Date : 2012.04.23 Page No. : 1/6 BTN6427N3 CYStek Product Specification General Purpose NPN Epitaxial Planar Transistor BTN6427N3

Description

  • The BTN6427N3 is a darlington amplifier transistor
  • Pb-free package. Equivalent Circuit Outline BTN6427N3 SOT-23 C B E B：Base C：Collector E：Emitter Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Collector-Base V oltage VCBO 100 V Collector-Emitter V oltage VCES 60 V Collector-Emitter V oltage VCEO 60 V Emitter-Base V oltage VEBO 12 V Collector Current IC 0.5 A Power Dissipation Pd 225 mW Junction Temperature Tj 150 °C Storage Temperature Tstg -55~+150 °C

CYStech Electronics Corp. Spec. No. : C214N3-A Issued Date : 2005.11.30 Revised Date : 2012.04.23 Page No. : 2/6 BTN6427N3 CYStek Product Specification Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 100 - - V IC=100μA BVCES 60 - - V IC=100μA, VBE=0V BVCEO 60 - - V IC=10mA BVEBO 12 - - V IE=10μA ICBO - - 50 nA VCB=80V IEBO - - 50 nA VEB=10V *VCE(sat) 1 - - 1.2 V IC=50mA, IB=0.5mA *VCE(sat) 2 - - 1.5 V IC=500mA, IB=0.5mA *VBE(sat) - - 2.0 V IC=500mA, IB=0.5mA *VBE(on) - - 1.75 V VCE=5V , IC=50mA *hFE 1 10K - 100K - VCE=5V , IC=10mA *hFE 2 20K - 200K - VCE=5V , IC=100mA *hFE 3 14K - 140K - VCE=5V , IC=500mA Cob - - 7 pF VCB=10V , f=100MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%

Ordering Information

Device Package Shipping Marking BTN6427N3 SOT-23 (Pb-free) 3000 pcs / Tape & Reel 1N

CYStech Electronics Corp. Spec. No. : C214N3-A Issued Date : 2005.11.30 Revised Date : 2012.04.23 Page No. : 3/6 BTN6427N3 CYStek Product Specification Characteristic Curves Current Gain vs Collector Current 1000 10000 100000 1 10 100 1000 Collector Current---IC(mA) Current Gain---HFE HFE@VCE=5V Saturation Voltage vs Collector Current 100 1000 10000 1 10 100 1000 Collector Current ---IC(mA) Saturation Voltage---(mV) VCE(SAT)@IC=1000IB Saturation Voltage vs Collector Current 1000 10000 1 10 100 1000 Collector Current ---IC(mA) Saturation Voltage---(mV) VBE(SAT)@IC=1000IB ON Voltage vs Collector Current 100 1000 10000 0.1 1 10 100 1000 Collector Current ---IC(mA) ON Voltage --- (mV) VBE(ON)@VCE=5V Power Derating Curve 100 150 200 250 0 50 100 150 200 Ambient Temperature ---Ta(℃ ) Power Dissipation---PD(mW)

CYStech Electronics Corp. Spec. No. : C214N3-A Issued Date : 2005.11.30 Revised Date : 2012.04.23 Page No. : 4/6 BTN6427N3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C214N3-A Issued Date : 2005.11.30 Revised Date : 2012.04.23 Page No. : 5/6 BTN6427N3 CYStek Product Specification Recommended wave soldering condition Soldering Time Product Peak Temperature Pb-free devices 5 +1/-1 seconds 260 +0/-5 °C Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 217°C 60-150 seconds 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C214N3-A Issued Date : 2005.11.30 Revised Date : 2012.04.23 Page No. : 6/6 BTN6427N3 CYStek Product Specification SOT-23 Dimension *: Typical Inches Millimeters Inches H JKD A L GV C B S Style: Pin 1.Base 2.Emitter 3.Collector Marking: TE 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 H 0.0005 0.0040 0.013 0.10 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.