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http://www.buddies-tech.com BTM311 DATASHEET BTM311 Bluetooth Module Data Sheet Document Type: Bluetooth Module Datasheet Document Version: V1.01 Release Date: April 20, 2012 Reproduction of this document, in part of in whole, by any means is prohibited without written permission from Buddies Technology Limited. The information co ntained herein is believed to be accurate as of the date of publication. However, Buddies Technolog y is not liable for any damages, including indirect or consequential from the use of software this document represents, or any reliance of the accuracy of this document. Buddies Technology reser ves the right to change the contents of this document at any time without notice. This document contains proprietary confidential trade secrets and may be subject to additional restrictions contained in the licensing agreement under which this document was obtained.
http://www.buddies-tech.com BTM311 DATASHEET
Revision History
Date Version Description Author 2012-03-14 V1.0 /square6 First Release
http://www.buddies-tech.com BTM311 DATASHEET CONTENT
http://www.buddies-tech.com BTM311 DATASHEET 1. INTRODUCTION The BTM311 Bluetooth ® module is a perfect solution for enhanced audio ap plications, such as stereo headphones and high performance auto mobile handsfree. It can be connected with any Bluetooth ® devices in an operating range. It is slim and light so the designers can have better flexibilities for the product shapes. The BTM311 Bluetooth ® module complies with Bluetooth ® specification version 2.1. It supports HSP , HFP , A2DP , AVRCP , PBAP ,SPP ,… profiles. It integrates RF Baseband controller, antenna,… etc. and provide UART interfa ce, programmable I/O, stereo speaker output, microphone input,… etc. The detail information of BTM311 Bluetooth ® module is presented in this document below.
1.1 Block Diagram
+3V3 PCM BlueCore3 -MM
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1.2 Features
/checkbld Small overall dimension(13mm x 20mm x 2mm) /checkbld Bluetooth Specification V2.1 /checkbld Class 2 and Class 3 support /checkbld Physical connection as SMD type /checkbld DSP Co-Processor 16-bit Internal Stereo CODEC with -95dB SNR for DAC. /checkbld High quality stereo audio (sample rate up to 44.1KHz) /checkbld Built-in RF combo filter, Integrated 26M Crystal. /checkbld Supports up to 8 Mbits on module flash memory. /checkbld Support active inquire BT device and pairing. /checkbld Support HSP, HFP, A2DP, AVRCP, OPP, SPP, PBAP, SYNC, PB-Sync for Nokia, PB-Sync For Samsung profile. /checkbld Support active inquire BT device and pairing. /checkbld Support customizable PIN code and device name. /checkbld Support pairing up to 8 Bluetooth ® device. /checkbld Compatible with CSR cVc software echo cancellation solution. /checkbld No radio signal interference, support for 802.11 co-existence ※ Some features are optional for customization on demand.
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1.3 Application
/checkbld Automobile hands-free applications /checkbld Hands-Free Car Kits for embedded Car audio systems /checkbld Bluetooth Audio source gateway and data gateways for PND systems /checkbld High Quality Stereo Bluetooth Headsets /checkbld High Quality Mono Bluetooth Headsets /checkbld Bluetooth Speakers /checkbld Industrial sensors and controls /checkbld Measurement and monitoring systems
http://www.buddies-tech.com BTM311 DATASHEET 2. GENERAL SPECIFICATION Bluetooth Specification Chip Set CSR BC03-MultiMedia External Module ID BTM311 BT Standard Bluetooth ® V2.1 + EDR specification RF TX Output Power 4dBm (Class II) Sensitivity -86dBm@0.1%BER Frequency Band 2.402GHz~2.480GHz ISM Band Baseband Crystal OSC 26MHz Hopping 1600hops/sec, 1MHz channel space RF Input Impedance 50 ohms Major Interface /circle6 Microphone : Input (Differential) /circle6 Speaker : Output (Differential) /circle6 PCM : Output /circle6 UART : Tx/Rx /circle6 USB : DP/DN /circle6 PIOs /circle6 Antenna Profile HSP, HFP, A2DP, AVRCP, PBAP, …….. de tai led prof il es depends on the fir mware Voice Processor 32MIPS Kalimba with cVc support Power Supply Voltage 3.0V ~ 3.6V DC Working Current 35mA typical,Depends on profiles Standby Current <1mA Operating Environment Temperature -40ºC to +85ºC Humidity 10%~90% Non-Condensing Environmental RoHS Compliant
http://www.buddies-tech.com BTM311 DATASHEET 3. PHYSICAL CHARACTERISTIC
3.1 Pin Description
Pin# Pin Name Pad Type Description
1 SPK_A_N Analogue Speaker output negative, left
Dimension: Top View: Figure 2 Figure 3 Figure 4 Pin Definition:
http://www.buddies-tech.com BTM311 DATASHEET SPK_A_P Analogue Speaker output positive, left
3 SPK_B_N Analogue Speaker output negative, right
SPK_B_P Analogue Speaker output positive, right
5 GND Ground
6 MIC_A_P Analogue
Microphone input positive, left
7 MIC_A_N Analogue Microphone input negative, left
8 MIC_B_P Analogue
Microphone input positive, right
9 MIC_B_N Analogue Microphone input negative, right
+1V8 Power High-voltage linear regulator output (1.8V out) PCM_IN CMOS input, with weak internal pull-down Synchronous data input PCM_SYNC Bi-directional with weak internal pull-down Synchronous data sync
13 PCM_CLK
Bi-directional with weak internal pull-down Synchronous data clock
14 PCM_OUT
CMOS output, tri-state, with weak internal pull-down Synchronous data output AIO_0 Bi-directional VDD/Low-voltage regulator output Analogue programmable input/ output line circuitry and 1.5V regulated output (from internal low-voltage regulator) AIO_1 Bi-directional VDD/Low-voltage regulator output Analogue programmable input/ output line circuitry and 1.5V regulated output (from internal low-voltage regulator)
17 AIO_3
VDD/Low-voltage regulator output Analogue programmable input/ output line circuitry and 1.5V regulated output (from internal low-voltage regulator)
18 GND Ground
+3V3 Power Supply Positive supply for BT Module(3.0V~3.6V)
20 USB_DP Bi-directional
USB data plus with selectable internal 1.5k Ω pull-up resistor
21 USB_DN Bi-directional
UART_RTS Bi-directional CMOS output, tri-state, with weak internal pull-up UART request to send active low UART_CTS CMOS input with weak internal UART clear to send active low
http://www.buddies-tech.com BTM311 DATASHEET pull-down
24 UART_TX
Bi-directional CMOS output, tri-state, with weak internal pull-up UART data output
25 UART_RX
CMOS input with weak internal pull-down UART data input
26 RESET
CMOS input with weak internal pull-up Active LOW reset
27 GND Ground
PIO_6 Bi-directional with programmable strength internal pull-up/down Programmable input/output line PIO_4 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 30 +3V3 Power Supply Positive supply for BT Module(3.0V~3.6V)
31 GND Ground
SPI_MISO CMOS output, tri-state, with weak internal pull-down SPI data output SPI_CSB Input with weak internal pull-up Chip select for Serial Peripheral Interface (SPI),active low SPI_CLK Input with weak internal pull-down SPI clock SPI_MOSI CMOS input, with weak internal pull-down SPI data input
36 PIO_5
Bi-directional with programmable strength internal pull-up/down Programmable input/output line PIO_9 Bi-directional with programmable strength internal pull-up/down Programmable input/output line
38 PIO_1
Bi-directional with programmable strength internal pull-up/down Programmable input/output line
39 PIO_3
Bi-directional with programmable strength internal pull-up/down Programmable input/output line
40 PIO_11
Bi-directional with programmable strength internal pull-up/down Programmable input/output line
41 PIO_10
Bi-directional with programmable strength internal pull-up/down Programmable input/output line
42 PIO_2
Bi-directional with programmable strength internal pull-up/down Programmable input/output line
43 PIO_0
Bi-directional with programmable strength internal pull-up/down Programmable input/output line
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44 GND Ground
45 GND Ground
46 RF_IO
47 GND Ground
http://www.buddies-tech.com BTM311 DATASHEET 4. REFERENCE SCHEMATIC Figure 5
http://www.buddies-tech.com BTM311 DATASHEET 5. PHYSICAL INTERFACE
5.1 Power Supply
The transient response of the regulator is importan t. If the power rails of the module are supplied from an external voltage source, the trans ient response of any regulator used should be 20 µs or less.
5.2 Audio Interfaces
Audio interface as following features: /square6 Mono analogue input for voice band and audio band /square6 Stereo and mono analogue output for voice band and audio band The stereo audio CODEC uses a fully differential ar chitecture in the analogue signal path, which results in low noise sensitivity and good pow er supply rejection while effectively doubling the signal amplitude. It uses a minimum of external components.The module features a differential stereo audio output interfaces.
5.2.1 ADC
The ADC consists of a second order Digma Delta converter as show in Figure 6. Figure 6
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5.2.2 ADC Sample Rate Selection and Warping
ADC supports the following sample rates: 8kHz, 11.025kHz, 16kHz, 22.05kHz, 24kHz, 32kHz,44.1kHz. One of the main concerns for stereo wireless music applications is the ability to keep sampl rates forthe CODECs at both ends of the wireless li nk in synchronization. A VM function adjusts the sample rate using a ‘warping’ function to tune the sample rate to the required value. The ADC warp function allows the sample r ate to be changed by +/-3%, in steps of 1/2 17, or 7.6ppm. The warp function preserves the s ignal quality – the distortion introduced when warping the sample rate is negligible.
5.2.3 ADC Gain
The ADC contains two gain stages for each channel, an analogue and a digital gain stage.
5.2.4 DAC
The DAC contains two second order Sigma Delta conve rters allowing two separate channels that are identical in functionality as show in Figure 6.
5.2.5 DAC Sample Rate Selection and W arping
Each DAC supports the following sample rates: 8kHz, 11.025kHz, 16kHz, 22.05kHz, 24kHz, 32kHz,44.1kHz, 48kHz. One of the main concerns for the DAC used in stereo wireless music applications is the ability to keep sampl rates for the CODECs at both ends of the wireless link in synchronization. A VM functio n adjusts the sample rate using a ‘warping’ function to tune the sample rate to the r equired value. The ADC warp function allows the sample rate to be changed by +/ -3%, in steps of 1/2 17, or 7.6ppm. The warp function preserves the signal quality – th e distortion introduced when warping the sample rate is negligible.
5.2.6 DAC Gain
The DAC contains two gain stages for each channel, a digital and an analogue gain stage.
5.2.7 Mono Operation
Mono operation is single channel operation of the s tereo CODEC. The left channel represents the single mono channel for audio i n and audio out. In mono operation the right channel is auxiliary mono channel that may be used in dual mono channel operation.
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5.2.8 Audio Input Stage
The audio input stage of the module consists of a low noise input amplifier, which receives its analogue input signal from pins MIC_A_P and MIC _A_N to a second–order ∑-∆ ADC that outputs a 4Mbit/sec single-bit stream into the digital circuitry. The input can be configured to be either single ended or fully diffe rential. It can be programmed for either microphone or line input and has a 3-bit digital ga in setting of the input-amplifier in 3dB steps to optimize it for the use of different microphones.
5.2.9 Microphone Input
Check the reference design in Figure 5 for the microphone input design.
5.2.10 Audio Output Stage
The output digital circuitry converts the signal from 16-bit per sample, linear PCM of variable sampling frequency to a 2Mbits/sec multi-bit stream, which is fed into the analogue output circuitry. The output circuit comprises a digital to analogue converter with gain setting and output amplifier.Its class-AB output-stage is capable of driving a signal on both channels of up to 2V pk-pk- differential into a load of 16 Ω. The output is available as a differential signal between SPK_A_P and SPK_A_N for the left channel; a nd between SPK_B_P and SPK_B_N for the right channel. The output is capabl e of driving a speaker directly if its impedance is at least 8Ω if only one channel is connected or an external regulator is used. The gain of the output stage is controlled by a 3-b it programmable resistive divider, which sets the gain in steps of approximately 3dB. The multi-bit stream from the digital circuitry is low pass filtered by a second order bi-quad filter with a pole at 20kHz. The signal is then amplified in the fully differential output stage, which has a gain bandwidth of typical ly 1MHz.
5.2.11 PCM
The audio pulse code modulation (PCM) interface sup ports continuous transmission and reception of PCM encoded audio data over Bluetooth. Pulse Code Modulation (PCM) is a standard method us ed to digitize audio (particularly voice) for transmission over digital communication channels.Through its PCM interface, BTM51 provide hardware support for continual trans mission and reception of PCM data, thus reducing processor overhead for wireless headset applications. BTM311offers a bi-directional digital audio interface that route s directly into the baseband layer of the on-chip firmware. It does not pass through the HCI protocol layer.
http://www.buddies-tech.com BTM311 DATASHEET Hardware on BTM311 allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any time.
5.3 RF Interface
The module integrates a balun filter. The user can connect a 50ohms antenna directly to the RF port.
5.4 General Purpose Analog IO
The general purpose analog IOs can be configured as ADC inputs by software. Do not connect them if not use.
5.5 General Purpose Digital IO
There are nine general purpose digital IOs defined in the module. All these GPIOs can be configured by software to realize various functions, such as button controls, LED displays or interrupt signals to host controller, etc. Do not connect them if not use.
5.6 Serial Interfaces
5.6.1 UART
This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. When the module is connected to another digital dev ice,UART_RX and UART_TX transfer data between the two devices. The remainin g two signals, UART_CTS and UART_RTS, can be used to implement RS232 hardware f low control where both are active low indicators.
5.6.2 USB
There is a full speed (12M bits/s) USB interface fo r communicating with other compatible digital devices. The module acts as a US B peripheral, responding to request from a master host controller, such as a PC. The module features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when module is ready to enumerate. It signals to the USB master that it is a full speed (12Mbit/s) USB device. The USB internal pull- up is implemented as a current source, and is compliant with section7.1.5 of the U SB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V when loa ded with a 15k Ω ±5% pull-down resistor (in the hub/host) when VDD =3.1V. This presents a Thevenin resistance to the host of at least 900 Ω. Alternatively, an external 1.5kΩ pull-up resistor can be placed between a PIO line and DP on the USB cable.
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5.6.3 SPI
The synchronous serial port interface (SPI) can be used for system debugging. It can also be used for in-system programming for the flash memory within the module. SPI interface uses the SPI_MOSI, SPI_MISO, SPI_CSB and SPI_CLK pi ns. Testing points for the SPI interface are reserved on board in case that the fi rmware shall be updated during manufacture. The module operates as a slave and thus SPI_MISO is an output of the module. SPI_MISO is not in high-impedance state when SPI_CS B is pulled high. Instead, the module outputs 0 if the processor is running and 1 if it is stopped. Thus the module should NOT be connected in a multi-slave arrangeme nt by simple parallel connection of slave SPI_MISO lines. Figure 7
http://www.buddies-tech.com BTM311 DATASHEET 6. ELECTRICAL CHARACTERISTIC
6.1 Absolute Maximum Rating
Storage Temperature -40 +150 °C Operating Temperature -40 +105 °C PIO/AIO Voltage -0.4 +3.6 V +3V3 Voltage -0.4 +3.6 V USB_DP/USB_DN Voltage -0.4 +3.6 V Other Terminal Voltages except RF -0.4 3V3+0.4 V
6.2 Recommended Operating Conditions
Operating Condition Min Typical Max Unit Operating Temperature Range -40 -- +85 °C +3V3 Voltage +3.0 +3.3 +3.6 V
6.3 Input/output Terminal Characteristics
6.3.1 Digital Terminals
Suppl y Voltage Levels Min Typical Max Unit Input Voltage Levels VIL input logic level low -0.3 - +0.25x3V3 V VIH input logic level high 0.625*3V3 - 3V3+0.3 V Output Voltage Levels VOL output logic level low, lOL = 4.0mA - - 0.125 V VOH output logic level high, l OH = -4.0mA 0.75x3V3 - 0.625x3V3 V Input and Tri-state Current Ii input leakage current at Vin=+3V3 or 0V -100 0 100 nA Ioz tri-state output leakage current at Vo=+3V3 or 0V -100 0 100 nA With strong pull-up -100 -40 -10 µA With strong pull-down 10 40 100 µA With weak pull-up -5 -1.0 -0.2 µA With weak pull-down 0. +1. 5.0 µA I/O pad leakage current -1 0 +1 µA CI Input Capacitance 1. - 5.0 pF Resistive Strength Table 1 Table 2
http://www.buddies-tech.com BTM311 DATASHEET Rpuw weak pull-up strength at +3V3-0.2V 500k - 2M Ω Rpdw weak pull-up strength at 0.2V 500k - 2M Ω Rpus strong pull-up strength at +3V3-0.2V 10k - 50k Ω Rpds strong pull-up strength at 0.2V 10k - 50k Ω
6.3.2 USB
USB Terminals Min Typical Max Unit Input Thres ho ld VIL input lo gic le vel l ow - - 0.3*3V3 V VIH input lo gic le vel hig h 0.7*3V3 - - V Input Leakage Current GND < VIN < +3V3 (a) -1 1 5 µA CI Inp ut capa cit ance 2.5 - 10 .0 pF Output Voltage Levels to Correc tly Terminated USB Cable VIL out put l og ic level low 0.0 - 0.2 V VIH ou tput l ogic level high 2.8 - +3V3 V
6.3.3 Internal CODEC - Analogue to Digital Convert er
Paramet er Min Typical Max Unit Res olution - - 16 Bits Inp ut Sa mple Rate 8 - 44 .1 kHz Signal / Noise, fin=1kHz, BW=20Hz->20kHz A- Weighted THD+N<1% 150mV Vpk-pk Fsa mple = 8kHz - 82 - dB Fsa mple = 11.025kHz - 81 - dB Fsa mple = 16kHz - 80 - dB Fsa mple = 22 .05kHz - 79 - dB Fsa mple = 32kHz - 79 - dB Fsa mple = 44 .1k Hz - 78 - dB Digi tal Gain -24 - 21 .5 dB
6.3.4 Internal CODEC - Digital to Analogue Convert er
Paramet er Min Typical Max Unit Res olution - - 16 Bits Output Sa mple Rate, Fsa mple 8 - 48 kHz Signal / Noise, fin=1kHz, BW=20Hz- >20kHz A-Weighted THD+N<0.01% 0dBFS signal Load -100k Ω Fsa mple = 8kHz - 95 - dB Fsa mple = 11 .025kHz - 95 - dB Fsa mple = 16kHz - 95 - dB Fsa mple = 22 .05kHz - 95 - dB Fsa mple = 32kHz - 95 - dB Table 3 Table 4 Table 5
http://www.buddies-tech.com BTM311 DATASHEET Fsa mple = 44kHz - 95 - dB Fsa mple = 48kHz - 95 - dB Digi tal Gain -24 - 21 .5 dB Gain Reso luti on 1/ 32 dB
6.3.5 Microphone Input
Microphone Input Min Typical Max Unit Inp ut fu ll scale at maxi mum ga in - 4 - mV rms Inp ut fu ll scale at mini mum gi an(differ ent ial) 800 - mV rms Gain -3 - 42 dB Gain re solutio n - 3 - dB Distort ion at 1 kHz - - -74 dB 3dB B andw idth - 20 kHz Inp ut impeda nce - 6 kΩ THD+N (micro phone input)@30 mV r ms in put - 0. 04 - % Table 6 Table 7
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6.3.6 Speaker Output
Speaker Driver Min Typical Max Unit Out put volt ag e fu ll sc ale swing (differential) - 750 - mV r ms THD+N 10 0kΩ load - - 0.01% % THD+N 16 Ω load - - 0.1% % SNR(Load=16Ω, 0dBFS input relative to digit al sile nce) dB
6.4 Power consumptions
Operating Condition Min Typical Max Unit Connected Idle (Sniff 1.28 secs) 0. 19 mA Connected with audio streaming mA Deep Sleep Idle mode uA Table 8 Table 9
http://www.buddies-tech.com BTM311 DATASHEET 7. RECOMMENDED TEMPERATURE REFLOW PROFILE The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guida nce on solder reflow.
http://www.buddies-tech.com BTM311 DATASHEET 8. PACKAGING INFORMATION 1. BLUETOOTH ® Module: BTM311 2. Assembly 3. Dimension All rights are strictly reserved. Any portion of this paper shall not be reproduced, copied, or translated to any other forms without permission from Buddies Technology Limited.