BTM41 BUDDIES | Alldatasheet
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http://www.buddies –tech.com BTM41 DATASHEET BTM41 Bluetooth Module Data Sheet Document Type: Bluetooth Module Datasheet Document Version: V1.0 Release Date: March 14, 2012 Reproduction of this document, in part of in whole, by any means is prohibited without written permission from Buddies Technology Limited. The information co ntained herein is believed to be accurate as of the date of publication. However, Buddies Technolog y is not liable for any damages, including indirect or consequential from the use of software this document represents, or any reliance of the accuracy of this document. Buddies Technology reser ves the right to change the contents of this document at any time without notice. This document contains proprietary confidential trade secrets and may be subject to additional restrictions contained in the licensing agreement under which this document was obtained.
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Revision History
Date Version Description Author 2012-03-14 V1.0 /square6 First Release
http://www.buddies –tech.com BTM41 DATASHEET CONTENT 5. PHYSICAL 5.1 P
5.2 A UDIO
http://www.buddies –tech.com BTM41 DATASHEET 1. INTRODUCTION The BTM41 Bluetooth ® module is a perfect solution for data transmission applications, such as sensors and controllers for cable replacement . It can be connected with any Bluetooth ® devices in an operating range. It is slim and light so the designers can have better flexibilities for the product shapes. The BTM41 Bluetooth ® module complies with Bluetooth ® specification version 2.1. It supports HSP ,HFP ,PBAP ,OPP ,SPP , profiles. It integrates RF Baseband controller, antenna, etc. and provide UART interface, programma ble I/O, stereo speaker output, microphone input, etc. The detail information of BTM41 Bluetooth ® module is presented in this document below.
1.1 Block Diagram
+3V3
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1.2 Features
/checkbld Small overall dimension(25.8mm x 13.2mm x 2mm) /checkbld Bluetooth Specification V2.1 /checkbld Class 2 and Class 3 support /checkbld Physical connection as SMD type /checkbld Built-in RF combo filter, Integrated 26M Crystal. /checkbld Supports up to 8 Mbits on module flash memory. /checkbld Support active inquire BT device and pairing. /checkbld Support HSP, HFP, OPP, SPP, PBAP, profile. /checkbld Support customizable PIN code and device name. /checkbld Support pairing up to 8 Bluetooth ® device. /checkbld No radio signal interference, support for 802.11 co-existence ※ Some features are optional for customization on demand.
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1.3 Application
/checkbld Automobile hands-free applications /checkbld Hands-Free Car Kits for embedded Car audio systems /checkbld Industrial sensors and controls /checkbld Measurement and monitoring systems
http://www.buddies –tech.com BTM41 DATASHEET 2. GENERAL SPECIFICATION Bluetooth Specification Chip Set CSR BC4-External Module ID BTM41 BT Standard Bluetooth ® V2.1 + EDR specification RF TX Output Power 4dBm (Class II) Sensitivity -86dBm@0.1%BER Frequency Band 2.402GHz~2.480GHz ISM Band Baseband Crystal OSC 26MHz Hopping 1600hops/sec, 1MHz channel space RF Input Impedance 50 ohms Major Interface /circle6 Microphone : Input (Differential) /circle6 Speaker : Output (Differential) /circle6 PCM : Output /circle6 UART : Tx/Rx /circle6 USB : DP/DN /circle6 PIOs /circle6 Antenna Profile HSP, HFP, PBAP, OPP,SPP…….. de tai led prof il es depends on the fir mware Power Supply Voltage 3.0V ~ 3.6V DC Working Current 35mA typical, Depends on profiles Standby Current <1mA Operating Environment Temperature -40ºC to +85ºC Humidity 10%~90% Non-Condensing Environmental RoHS Compliant
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3.1 Pin Description
Pin# Pin Name Pad Type Description
1 GND Ground Digital Ground
SPI_CSB Input with weak internal pull-up Chip select for Serial Peripheral Interface (SPI),active low
3 PIO_2
Bi-directional with programmable strength internal pull-up/down Programmable input/output line PIO_3 Bi-directional with programmable strength internal pull-up/down Programmable input/output line
5 RESETB
CMOS input with weak internal pull-up Active LOW reset
6 SPI_CLK
Input with weak internal pull-down SPI clock
7 PCM_CLK
Bi-directional with weak internal pull-down Synchronous data clock
8 PCM_SYNC Bi-directional with weak internal
PCM_IN CMOS input, with weak internal pull-down Synchronous data input PCM_OUT CMOS output, tri-state, with weak internal pull-down Synchronous data output +3V3 Power Supply Positive supply for BT Module(3.0V~3.6V) GND Ground Digital Ground AIO_0 Bi-directional VDD/Low-voltage regulator output Analogue programmable input/ output line circuitry and 1.5V regulated output (from internal low-voltage regulator) GND Ground Digital Ground PIO_11 Bi-directional with programmable strength internal pull-up/down Programmable input/output line PIO_5 Bi-directional with programmable strength internal pull-up/down Programmable input/output line
17 PIO_4
Bi-directional with programmable strength internal pull-up/down Programmable input/output line PIO_6 Bi-directional with programmable strength internal pull-up/down Programmable input/output line GND Ground Digital Ground
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20 AIO_1
VDD/Low-voltage regulator output Analogue programmable input/ output line circuitry and 1.5V regulated output (from internal low-voltage regulator)
21 UART_RX
CMOS input with weak internal pull-down UART data input
22 UART_TX
Bi-directional CMOS output, tri-state, with weak internal pull-up UART data output UART_RTS Bi-directional CMOS output, tri-state, with weak internal pull-up UART request to send active low UART_CTS CMOS input with weak internal pull-down UART clear to send active low USB_DP Bi-directional USB data plus with selectable internal 1.5k Ω pull-up resistor
26 USB_DN Bi-directional
27 PIO_1
Bi-directional with programmable strength internal pull-up/down Programmable input/output line PIO_0 Bi-directional with programmable strength internal pull-up/down Programmable input/output line PIO_9 Bi-directional with programmable strength internal pull-up/down Programmable input/output line
30 PIO_10
Bi-directional with programmable strength internal pull-up/down Programmable input/output line
31 SPI_MISO
CMOS output, tri-state, with weak internal pull-down SPI data output SPI_MOSI CMOS input, with weak internal pull-down SPI data input
http://www.buddies –tech.com BTM41 DATASHEET 4. REFERENCE SCHEMATIC Figure 5
http://www.buddies –tech.com BTM41 DATASHEET 5. PHYSICAL INTERFACE
5.1 Power Supply
The transient response of the regulator is importan t. If the power rails of the module are supplied from an external voltage source, the trans ient response of any regulator used should be 20 µs or less.
5.2 Audio Interfaces
5.2.1 PCM
The audio pulse code modulation (PCM) interface sup ports continuous transmission and reception of PCM encoded audio data over Bluetooth. Pulse Code Modulation (PCM) is a standard method us ed to digitize audio (particularly voice) for transmission over digital communication channels. Through its PCM interface, BTM41 provide hardware support for continual trans mission and reception of PCM data, thus reducing processor overhead for wireless headset applications.BTM41offers a bi-directional digital audio interface that routes directly into the baseband layer of the on-chip firmware. It does not pass through the HCI protocol layer. Hardware on BTM41 allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any time.
5.3 RF Interface
The module integrates a balun filter. The user can connect a 50ohms antenna directly to the RF port.
5.4 General Purpose Analog IO
The general purpose analog IOs can be configured as ADC inputs by software. Do not connect them if not use.
5.5 General Purpose Digital IO
There are nine general purpose digital IOs defined in the module. All these GPIOs can be configured by software to realize various functions, such as button controls, LED displays or interrupt signals to host controller, etc. Do not connect them if not use.
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5.6 Serial Interfaces
5.6.1 UART
This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. When the module is connected to another digital dev ice, UART_RX and UART_TX transfer data between the two devices. The remainin g two signals, UART_CTS and UART_RTS, can be used to implement RS232 hardware f low control where both are active low indicators.
5.6.2 USB
There is a full speed (12M bits/s) USB interface fo r communicating with other compatible digital devices. The module acts as a US B peripheral, responding to request from a master host controller, such as a PC. The module features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when module is ready to enumerate. It signals to the USB master that it is a full speed (12Mbit/s) USB device. The USB internal pull- up is implemented as a current source, and is compliant with section7.1.5 of the U SB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V when loa ded with a 15k Ω ±5% pull-down resistor (in the hub/host) when VDD =3.1V. This presents a The venin resistance to the host of at least 900 Ω. Alternatively, an external 1.5k Ω pull-up resistor can be placed between a PIO line and DP on the USB cable.
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5.6.3 SPI
The synchronous serial port interface (SPI) can be used for system debugging. It can also be used for in-system programming for the flash memory within the module. SPI interface uses the SPI_MOSI, SPI_MISO, SPI_CSB and SPI_CLK pi ns. Testing points for the SPI interface are reserved on board in case that the fi rmware shall be updated during manufacture. The module operates as a slave and thus SPI_MISO is an output of the module. SPI_MISO is not in high-impedance state when SPI_CS B is pulled high. Instead, the module outputs 0 if the processor is running and 1 if it is stopped. Thus the module should NOT be connected in a multi-slave arrangemen t by simple parallel connection of slave SPI_MISO lines. Figure 6
http://www.buddies –tech.com BTM41 DATASHEET 6. ELECTRICAL CHARACTERISTIC
6.1 Absolute Maximum Rating
Storage Temperature -40 +150 °C Operating Temperature -40 +105 °C PIO/AIO Voltage -0.4 +3.6 V +3V3 Voltage -0.4 +3.6 V USB_DP/USB_DN Voltage -0.4 +3.6 V Other Terminal Voltages except RF -0.4 3V3+0.4 V
6.2 Recommended Operating Conditions
Operating Condition Min Typical Max Unit Operating Temperature Range -40 -- +85 °C +3V3 Voltage +3.0 +3.3 +3.6 V
6.3 Input/output Terminal Characteristics
6.3.1 Digital Terminals
Supply Voltage Levels Min Typical Max Unit Input Voltage Levels VIL input logic level low -0.3 - +0.25x3V3 V VIH input logic level high 0.625*3V3 - 3V3+0.3 V Output Voltage Levels VOL output logic level low, lOL = 4.0mA - - 0.125 V VOH output logic level high, l OH = -4.0mA 0.75x3V3 - 0.625x3V3 V Input and Tri-state Current Ii input leakage current at Vin=+3V3 or 0V -100 0 100 nA Ioz tri-state output leakage current at Vo=+3V3 or 0V -100 0 100 nA With strong pull-up -100 -40 -10 µA With strong pull-down 10 40 100 µA With weak pull-up -5 -1.0 -0.2 µA With weak pull-down 0.2 +1.0 5.0 µA I/O pad leakage current -1 0 +1 µA Table 1 Table 2
http://www.buddies –tech.com BTM41 DATASHEET CI Input Capacitance 1.0 - 5.0 pF Resistive Strength Rpuw weak pull-up strength at +3V3-0.2V 500k - 2M Ω Rpdw weak pull-up strength at 0.2V 500k - 2M Ω Rpus strong pull-up strength at +3V3-0.2V 10k - 50k Ω Rpds strong pull-up strength at 0.2V 10k - 50k Ω
6.3.2 USB
USB Terminals Min Typical Max Unit Input Thres ho ld VIL input lo gic le vel l ow - - 0.3*3V3 V VIH input lo gic le vel high 0.7*3V3 - - V Input Leakage Current GND < VIN < +3V3 (a) -1 1 5 µA CI Inp ut capa cit ance 2.5 - 10 .0 pF Output Voltage Levels to Correc tly Terminated USB Cable VIL out put l og ic level low 0.0 - 0.2 V VIH ou tput l ogic level high 2.8 - +3 V3 V
6.4 Power consumptions
Operating Condition Min Typical Max Unit Connected Idle (Sniff 1.28 secs) 0. 19 mA Connected with audio streaming mA Deep Sleep Idle mode uA Table 3 Table 4 Table 5
http://www.buddies –tech.com BTM41 DATASHEET 7. RECOMMENDED TEMPERATURE REFLOW PROFILE The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guida nce on solder reflow.
http://www.buddies –tech.com BTM41 DATASHEET 8. PACKAGING INFORMATION 1. BLUETOOTH ® Module: BTM41 2. Assembly 3. Dimension All rights are strictly reserved. Any portion of this paper shall not be reproduced, copied, or translated to any other forms without permission from Buddies Technology Limited.