BTM851 BUDDIES | Alldatasheet
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http://www.buddies-tech.com BTM851 DATASHEET BTM851 Bluetooth Module Data Sheet Document Type: Bluetooth Module Datasheet Document Version: V1.0 Release Date: March 14, 2012 Reproduction of this document, in part of in whole, by any means is prohibited without written permission from Buddies Technology Limited. The information co ntained herein is believed to be accurate as of the date of publication. However, Buddies Technolog y is not liable for any damages, including indirect or consequential from the use of software this document represents, or any reliance of the accuracy of this document. Buddies Technology rese rves the right to change the contents of this document at any time without notice. This document contains proprietary confidential trade secrets and may be subject to additional restrictions contained in the licensing agreement under which this document was obtained.
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Revision History
Date Version Description Author 2012-03-14 V1.0 /square6 First Release
http://www.buddies-tech.com BTM851 DATASHEET CONTENT 5. PHYSICAL
http://www.buddies-tech.com BTM851 DATASHEET 1. INTRODUCTION The BTM851 Bluetooth module is a perfect solution for Bluetooth Application. Depend on host profile application. it can realize distribution of audio, transfer of file & picture, control of remote device, and so on. It can be connected with any Bluetooth devices in an operating range. It is slim and light so the designers can have better flexibilities for the product shapes. The BTM851 Bluetooth module compile with Bluetooth specification version 4.0. It integrates RF, Baseband controller, antenna matching, etc and provides USB interface, programmable I/O, PCM etc. The detail information of BTM851 Bluetooth module is presented in this document below.
1.1 Block Diagram
+3V3 nRESET
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1.2 Features
/checkbld Small overall dimension(20mm x 13mm x 2mm) /checkbld Bluetooth Specification V4.0 /checkbld Class 2 and Class 3 support /checkbld Physical connection as SMD type /checkbld Built-in RF combo filter, Integrated 26M Crystal. /checkbld Support profile by Host. /checkbld No radio signal interference, support for 802.11 co-existence ※ Some features are optional for customization on demand.
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1.3 Application
/checkbld TV Set-top Boxes and Smart TV /checkbld Notebooks and Desktops /checkbld USB Bluetooth Dongle /checkbld Bluetooth Low Energy
http://www.buddies-tech.com BTM851 DATASHEET 2. GENERAL SPECIFICATION Bluetooth Specification Chip Set CSR 8510 Module ID BTM851 (8100) BT Standard Bluetooth ® V4.0 RF TX Output Power 4dBm (Class II) Sensitivity -86dBm@0.1%BER Frequency Band 2.402GHz~2.480GHz ISM Band Baseband Crystal OSC 26MHz Hopping 1600hops/sec, 1MHz channel space RF Input Impedance 50 ohms Major Interface /circle6 PCM : Output /circle6 USB : DP/DN /circle6 PIOs /circle6 Antenna Profile Support Profile by Host Power Supply Voltage 3.0V ~ 3.6V DC or 5.0V ~ 5.5V (Optional) Working Current 35mA typical, Depends on profiles Standby Current <1mA Operating Environment Temperature -40ºC to +85ºC Humidity 10%~90% Non-Condensing Environmental RoHS Compliant
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3.1 Pin Description
Pin# Pin Name Pad Type Description
1 NC NC NC
2 NC NC NC
3 NC NC NC
4 NC NC NC
5 GND Ground
6 NC NC NC
7 NC NC NC
8 NC NC NC
9 NC NC NC
+1V8 Power High-voltage linear regulator output (1.8V out) PCM_IN CMOS input, with weak internal pull-down Synchronous data input PCM_SYNC Bi-directional with weak internal pull-down Synchronous data sync
13 PCM_CLK
Bi-directional with weak internal pull-down Synchronous data clock
14 PCM_OUT
CMOS output, tri-state, with weak internal pull-down Synchronous data output SPI_SEL Input with weak internal pull-down High switches SPI/PCM lines to SPI, low switches SPI/PCM lines to PCM/PIO use. NC NC NC
17 VBUS
VDD/Low-voltage regulator output Analogue programmable input/ output line circuitry and 1.5V regulated output (from internal low-voltage regulator)
18 GND Ground
+3V3 Power Supply Positive supply for BT Module(5.0V~5.5V)
20 USB_DP Bi-directional
USB data plus with selectable internal 1.5k Ω pull-up resistor
21 USB_DN Bi-directional USB Data Minus
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22 NC NC NC
23 NC NC NC
24 NC NC NC
25 NC NC NC
CMOS input with weak internal pull-up Active LOW reset
27 GND Ground
PIO_4 Bi-directional with programmable strength internal pull-up/down Programmable input/output line PIO_3 Bi-directional with programmable strength internal pull-up/down Programmable input/output line 30 +3V3 Power Supply Positive supply for BT Module(3.0V~3.6V)
31 GND Ground
32 NC NC NC
33 NC NC NC
34 NC NC NC
35 NC NC NC
36 PIO_2
Bi-directional with programmable strength internal pull-up/down Programmable input/output line PIO_5 Bi-directional with programmable strength internal pull-up/down Programmable input/output line
38 PIO_1
Bi-directional with programmable strength internal pull-up/down Programmable input/output line
39 PIO_0
Bi-directional with programmable strength internal pull-up/down Programmable input/output line
40 NC NC NC
41 NC NC NC
42 NC NC NC
43 NC NC NC
44 GND Ground
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45 GND Ground
46 RF_IO
47 GND Ground
http://www.buddies-tech.com BTM851 DATASHEET 4. REFERENCE SCHEMATIC Figure 5
http://www.buddies-tech.com BTM851 DATASHEET 5. PHYSICAL INTERFACE
5.1 Power Supply
The transient response of the regulator is importan t. If the power rails of the module are supplied from an external voltage source, the trans ient response of any regulator used should be 20 µs or less.
5.2 Reset
The module may be reset from several sources: NRESET pin, power-on reset, a UART break character or via a software configured watchdog timer. The NRESET pin is an active low reset and is intern ally filtered using the internal low frequency clock oscillator. A reset will be perform ed between 1.5 and 4.0ms following RESETB being active. It is recommended that RESETB be applied for a period greater than 5ms. At reset the digital I/O pins are set to inputs for bi-directional pins and outputs are tri-state. The PIOs have weak pull-ups.
5.3 Audio Interfaces
5.3.1 PCM
The audio pulse code modulation (PCM) interface sup ports continuous transmission and reception of PCM encoded audio data over Bluetooth. Pulse Code Modulation (PCM) is a standard method us ed to digitize audio (particularly voice) for transmission over digital communication channels. Through its PCM interface, BTM851 provides hardware support for continual tran smission and reception of PCM data, thus reducing processor overhead for wireless headset applications. BTM851offers a bi-directional digital audio interface that route s directly into the baseband layer of the on-chip firmware. It does not pass through the HCI protocol layer. Hardware on BTM851 allows the data to be sent to and received from a SCO connection. Up to three SCO connections can be supported by the PCM interface at any time.
5.4 RF Interface
The module integrates a balun filter. The user can connect a 50ohms antenna directly to the RF port.
5.5 General Purpose Analog IO
The general purpose analog IOs can be configured as ADC inputs by software. Do not connect them if not use.
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5.6 General Purpose Digital IO
There are nine general purpose digital IOs defined in the module. All these GPIOs can be configured by software to realize various functions, such as button controls, LED displays or interrupt signals to host controller, etc. Do not connect them if not use.
5.7 Serial Interfaces
5.7.1 USB
There is a full speed (12M bits/s) USB interface fo r communicating with other compatible digital devices. The module acts as a US B peripheral, responding to request from a master host controller, such as a PC. The module features an internal USB pull-up resistor. This pulls the USB_DP pin weakly high when module is ready to enumerate. It signals to the USB master that it is a full speed (12Mbit/s) USB device. The USB internal pull- up is implemented as a current source, and is compliant with section7.1.5 of the U SB specification v1.2. The internal pull-up pulls USB_DP high to at least 2.8V when loa ded with a 15k Ω ±5% pull-down resistor (in the hub/host) when VDD =3.1V. This presents a The venin resistance to the host of at least 900 Ω. Alternatively, an external 1.5k Ω pull-up resistor can be placed between a PIO line and DP on the USB cable.
5.7.2 SPI
The synchronous serial port interface (SPI) can be used for system debugging. It can also be used for in-system programming for the flash memory within the module. SPI interface uses the SPI_MOSI, SPI_MISO, SPI_CSB and SPI_CLK pi ns. Testing points for the SPI interface are reserved on board in case that the fi rmware shall be updated during manufacture. The module operates as a slave and thus SPI_MISO is an output of the module. SPI_MISO is not in high-impedance state when SPI_CS B is pulled high. Instead, the module outputs 0 if the processor is running and 1 if it is stopped. Thus the module should NOT be connected in a multi-slave arrangemen t by simple parallel connection of slave SPI_MISO lines. Figure 6
http://www.buddies-tech.com BTM851 DATASHEET 6. ELECTRICAL CHARACTERISTIC
6.1 Absolute Maximum Rating
Storage Temperature -40 +150 °C Operating Temperature -40 +105 °C PIO/AIO Voltage -0.4 +3.6 V +3V3 Voltage -0.4 +3.6 V USB_DP/USB_DN Voltage -0.4 +3.6 V Other Terminal Voltages except RF -0.4 3V3+0.4 V
6.2 Recommended Operating Conditions
Operating Condition Min Typical Max Unit Operating Temperature Range -40 -- +85 °C +3V3 Voltage +3.0 +3.3 +3.6 V
6.3 Input/output Terminal Characteristics
6.3.1 Digital Terminals
Supply Voltage Levels Min Typical Ma x Unit Input Voltage Levels VIL input logic level low -0.3 - +0.25x3V3 V VIH input logic level high 0.625*3V3 - 3V3+0.3 V Output Voltage Levels VOL output logic level low, lOL = 4.0mA - - 0.125 V VOH output logic level high, l OH = -4.0mA 0.75x3V3 - 0.625x3V3 V Input and Tri-state Current Ii input leakage current at Vin=+3V3 or 0V -100 0 100 nA Ioz tri-state output leakage current at Vo=+3V3 or 0V -100 0 100 nA With strong pull-up -100 -40 -10 µA With strong pull-down 10 40 100 µA With weak pull-up -5 -1.0 -0.2 µA With weak pull-down 0.2 +1.0 5.0 µA I/O pad leakage current -1 0 +1 µA Table 1 Table 2
http://www.buddies-tech.com BTM851 DATASHEET CI Input Capacitance 1.0 - 5.0 pF Resistive Strength Rpuw weak pull-up strength at +3V3-0.2V 500k - 2M Ω Rpdw weak pull-up strength at 0.2V 500k - 2M Ω Rpus strong pull-up strength at +3V3-0.2V 10k - 50k Ω Rpds strong pull-up strength at 0.2V 10k - 50k Ω
6.3.2 USB
USB Terminals Min Typical Max Unit Input Thres ho ld VIL input lo gic le vel l ow - - 0.3*3V3 V VIH input lo gic le vel high 0.7*3V3 - - V Input Leakage Current GND < VIN < +3V3 (a) -1 1 5 µA CI Inp ut capa cit ance 2.5 - 10 .0 pF Output Voltage Levels to Correc tly Terminated USB Cable VIL out put l og ic level low 0.0 - 0.2 V VIH ou tput l ogic level high 2.8 - +3V3 V
6.4 Power consumptions
Operating Co ndition Min Typical Max Unit Connected Idle (Sniff 1.28 secs) 0. 19 mA Connected with audio streaming mA Deep Sleep Idle mode uA Table 3 Table 4 Table 5
http://www.buddies-tech.com BTM851 DATASHEET 7. RECOMMENDED TEMPERATURE REFLOW PROFILE The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guida nce on solder reflow.
http://www.buddies-tech.com BTM851 DATASHEET 8. PACKAGING INFORMATION 1. BLUETOOTH ® Module: BTM851 2. Assembly 3. Dimension All rights are strictly reserved. Any portion of this paper shall not be reproduced, copied, or translated to any other forms without permission from Buddies Technology Limited.