BTC2881L3 CYSTEKEC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 7
Technical content
Features
- High breakdown voltage, BVCEO≥ 200V
- Large continuous collector current capability
- Low collector saturation voltage
- Pb-free lead plating and halogen-free package Symbol Outline Absolute Maximum Ratings (Ta=25°C) Parameter BTC2881L3 SOT-223 B:Base B C E C:Collector E:Emitter Symbol Limits Unit Collector-Base V oltage VCBO 300 V Collector-Emitter V oltage VCEO 200 V Emitter-Base V oltage VEBO 6 V Collector Current IC 1 A Base Current IB 0.2 A Power Dissipation @TA=25℃ 1 W Power Dissipation @TC=25℃ PD 6 W Operating Junction and Storage Temperature Range Tj ; Tstg 150 °C
Ordering Information
BTC2881L3 SOT-223 2500 pcs / Tape & Reel (Pb-free lead plating and halogen-free package)
CYStech Electronics Corp. Spec. No. : C316L3 Issued Date : 2010.12.29 Revised Date : 2011.01.03 Page No. : 2/7 BTC2881L3 CYStek Product Specification Thermal Data Parameter Symbol Value Unit Thermal Resistance, Junction-to-ambient, max Rth,j-a 125 °C/W Thermal Resistance, Junction-to-case, max Rth,j-c 20.8 °C/W Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 300 - - V IC=100μA BVCEO 200 - - V IC=1mA BVEBO 6 - - V IE=10μA ICBO - - 100 nA VCB=300V IEBO - - 100 nA VEB=6V *VCE(sat) - 0.17 0.4 V IC=500mA, IB=50mA *VCE(sat) - 0.37 0.6 V IC=700mA, IB=35mA *VBE(sat) - 0.85 1 V IC=500mA, IB=50mA *VBE(on) - 0.81 1 V VCE=5V , IC=500mA *hFE 1 120 - - - VCE=5V , IC=50mA *hFE 2 120 - 320 - VCE=5V , IC=100mA *hFE 3 30 - - - VCE=5V , IC=700mA fT - 120 - MHz VCE=5V , IC=100mA Cob - 8 15 pF VCB=10V , IE=0A,f=1MHz *Pulse Test: Pulse Width ≤300μs, Duty Cycle≤2% Recommended soldering footprint
CYStech Electronics Corp. Spec. No. : C316L3 Issued Date : 2010.12.29 Revised Date : 2011.01.03 Page No. : 3/7 BTC2881L3 CYStek Product Specification Typical Characteristics Emitter Grounded Output Characteristics 0.05 0.1 0.15 0.2 0.25 0123456 Collector-to-Emitter Voltage---VCE(V) Collector Current---IC(A) 200uA 300uA 400uA 500uA 1mA IB=100uA Emitter Grounded Output Characteristics 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0123456 Collector-to-Emitter Voltage---VCE(V) Collector Current---IC(A) 1mA 1.5mA 2mA 2.5mA 5mA IB=500uA Emitter Grounded Output Characteristics 0.2 0.4 0.6 0.8 0123456 Collector-to-Emitter Voltage---VCE(V) Collector Current---IC(A) IB=2mA 4mA 6mA 8mA 10mA 20mA Emitter Grounded Output Characteristics 0.2 0.4 0.6 0.8 1.2 012345 Collector-to-Emitter Voltage---VCE(V) Collector Current---IC(A) IB=5mA 10mA 15mA 20mA 50mA Current Gain vs Collector Current 100 1000 1 10 100 1000 Collector Current---IC(mA) Current Gain---HFE VCE=1V VCE=2V VCE=10V Saturation Voltage vs Collector Current 100 1000 1 10 100 1000 Collector Current---IC(mA) Saturation Voltage---(mV) IC=10IB VCESAT=20IB
CYStech Electronics Corp. Spec. No. : C316L3 Issued Date : 2010.12.29 Revised Date : 2011.01.03 Page No. : 4/7 BTC2881L3 CYStek Product Specification Typical Characteristics(Cont.) Saturation Voltage vs Collector Current 100 1000 10000 1 10 100 1000 Collector Current---IC(mA) Saturation Voltage---(mV) VBESAT@IC=10IB On Voltage vs Collector Current 100 1000 10000 1 10 100 1000 Collector Current---IC(mA) On Voltage---(mV) VCE=5V VCE=2V Transition Frequency vs Collector Current 100 1000 1 10 100 1000 Collector Current---IC(mA) Transition Frequency---fT(MHz) VCE=5V Typical Capacitance Characteristics 100 1000 0.1 1 10 100 Reverse-Biased Voltage---(V) Capacitance---(pF) Cib Cob fT=1MHz Power Derating Curve 0.2 0.4 0.6 0.8 1.2 0 50 100 150 200 Ambient Temperature---TA(℃) Power Dissipation---PD(W) Power Derating Curve 0 50 100 150 200 Case Temperature---TC(℃) Power Dissipation---PD(W)
CYStech Electronics Corp. Spec. No. : C316L3 Issued Date : 2010.12.29 Revised Date : 2011.01.03 Page No. : 5/7 BTC2881L3 CYStek Product Specification Reel Dimension Carrier Tape Dimension
CYStech Electronics Corp. Spec. No. : C316L3 Issued Date : 2010.12.29 Revised Date : 2011.01.03 Page No. : 6/7 BTC2881L3 CYStek Product Specification Recommended wave soldering condition Soldering Time Product Peak Temperature Pb-free devices 5 +1/-1 seconds 260 +0/-5 °C Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 217°C 60-150 seconds 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.
CYStech Electronics Corp. Spec. No. : C316L3 Issued Date : 2010.12.29 Revised Date : 2011.01.03 Page No. : 7/7 BTC2881L3 CYStek Product Specification SOT-223 Dimension *: Typical Inches Millimeters 3 2 1 F B A C D E G H a1 I Style: Pin 1.Base 2.Collector 3.Emitter Marking: 3-Lead SOT-223 Plastic Surface Mounted Package CYStek Package Code: L3 Date Code Device Name C2881 □□□□ D 0.0236 0.0315 0.60 0.80 a1 *13Po - *13o - E *0.0906 - *2.30 - a2 0 o 10 o 0 o 10 o F 0.2480 0.2638 6.30 6.70 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:
- Lead: Pure tin plated
- Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
- CYStek reserves the right to make changes to its products without notice.
- CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.