BSS84KS3 CYSTEKEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 8

Technical content

Features

  • Low gate charge
  • Excellent thermal and electrical capabilities
  • Pb-free lead plating and halogen-free package Equivalent Circuit Outline

Ordering Information

(Pb-free lead plating & halogen-free package) 3000 pcs / Tape & Reel SOT-323 BSS84KS3 G：Gate S：Source D：Drain D S G

CYStech Electronics Corp. Spec. No. : C465S3 Issued Date : 2012.05.19 Revised Date : 2013.09.09 Page No. : 2/ 8 BSS84KS3 CYStek Product Specification Absolute Maximum Ratings (Tj=25°C, unless otherwise noted) Parameter Symbol Limits Unit Drain-Source V oltage VDS -50 V Gate-Source V oltage VGS ±20 V Continuous Drain Current @ TA=25°C, VGS=-5V ID -170 mA Pulsed Drain Current (Note 1) IDM -520 mA Maximum Power Dissipation @ TA=25℃ (Note 2) PD 350 mW Thermal Resistance, Junction-to-Ambient (Note 2) Rth,ja 360 °C/W Operating Junction and Storage Temperature Range Tj, Tstg -55~+150 °C Note : 1. Pulse width≤ 10μs, duty cycle≤2%. 2. Surface mounted on 1 in² copper pad of FR-4 board, t≤5s. Electrical Characteristics (Tj=25°C, unless otherwise specified) Symbol Min. Typ. Max. Unit Test Conditions Static BVDSS -50 - - V VGS=0V , ID=-250μA VGS(th) -1 -1.4 -2 V VDS=VGS, ID=-1mA GFS 80 - - mS VDS=-10V , ID=-100mA IGSS - - ±10 μA VGS=±20V , VDS=0 - - -1 VDS=-50V , VGS=0 IDSS - - -25 VDS=-50V , VGS=0, Tj=125°C - 5 8 VGS=-10V , ID=-100mA - 6 10 VGS=-5V , ID=-100mA - - 12 VGS=-4V , ID=-10mA *RDS(ON) - - 32 Ω VGS=-2.5V , ID=-1mA Dynamic Ciss - 25 - Coss - 7 - Crss - 2 - pF VDS=-5V , VGS=0, f=1MHz *td(ON) - 2.5 - *tr - 2 - *td(OFF) - 7.3 - *tf - 3 - ns VDS=-15V , ID=-100mA, VGS=-5V , RG=3.3Ω *Qg - 1.2 - nC VDS=-40V , ID=-500mA, VGS=-5V Source-Drain Diode *IS - - -130 *ISM - - -520 mA *VSD - -0.85 -1.2 V VGS=0V , IS=-130mA *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2%

CYStech Electronics Corp. Spec. No. : C465S3 Issued Date : 2012.05.19 Revised Date : 2013.09.09 Page No. : 3/ 8 BSS84KS3 CYStek Product Specification Typical Characteristics Typical Output Characteristics 100 200 300 400 500 600 0123456789 1 0 DS, Drain-Source Voltage(V) -ID, Drain Current (mA) -VGS=2.5V -VGS=3V -VGS=2V -VGS=3.5V -VGS=4V -VGS=4.5V -VGS=5V Brekdown Voltage vs Ambient Temperature 0.6 0.8 1.2 1.4 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) -BVDSS, Normalized Drain-Source Breakdown Voltage ID=-250μA, VGS=0V Static Drain-Source On-State resistance vs Drain Current 0.001 0.01 0.1 1 -ID, Drain Current(A) RDS(on), Static Drain-Source On-State Resistance(Ω) -VGS=10V -VGS=5V -VGS=3V Reverse Drain Current vs Source-Drain Voltage 0.2 0.4 0.6 0.8 1.2 -IDR, Reverse Drain Current (A) -VSD, Source-Drain Voltage(V) Tj=25°C Tj=150°C VGS=0V Static Drain-Source On-State Resistance vs Gate-Source Voltage 02468 1 0 Drain-Source On-State Resistance vs Junction Tempearture 0.4 0.6 0.8 1.2 1.4 1.6 1.8 -60 -20 20 60 100 140 180 Tj, Junction Temperature(°C) RDS(ON), Normalized Static Drain- Source On-State Resistance VGS=-5V, ID=-100mA VGS=-10V, ID=-100mA -VGS, Gate-Source Voltage(V) RDS(ON), Static Drain-Source On- State Resistance(Ω) ID=-100mA ID=-30mA

CYStech Electronics Corp. Spec. No. : C465S3 Issued Date : 2012.05.19 Revised Date : 2013.09.09 Page No. : 4/ 8 BSS84KS3 CYStek Product Specification Typical Characteristics(Cont.) Capacitance vs Drain-to-Source Voltage 100 0.1 1 10 100 -VDS, Drain-Source Voltage(V) Capacitance---(pF) Coss Ciss Crss Threshold Voltage vs Junction Tempearture 0.4 0.6 0.8 1.2 1.4 1.6 -60 -40 -20 0 20 40 60 80 100 120 140 160 Tj, Junction Temperature(°C) -VGS(th), Normalized Threshold Voltage ID=-250μA Single Pulse Power Rating, Junction to Ambient (Note on page 1) 0.001 0.01 0.1 1 10 100 Pulse Width(s) Power (W) TJ(MAX)=150°C TA=25°C RθJA=360°C/W Gate Charge Characteristics Qg, Total Gate Charge(nC) -VGS, Gate-Source Voltage(V) VDS=-40V ID=-500mA Maximum Safe Operating Area 0.001 0.01 0.1 0.01 0.1 1 10 100 -VDS, Drain-Source Voltage(V) -ID, Drain Current (A) DC 10ms 100m 100μs TA=25°C, Tj=150°C, VGS=-5V, RθJA=360°C/W Single Pulse Maximum Drain Current vs JunctionTemperature 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) -ID, Maximum Drain Current(A) TA=25°C, VGS=-5V, RθJA=360°C/W

CYStech Electronics Corp. Spec. No. : C465S3 Issued Date : 2012.05.19 Revised Date : 2013.09.09 Page No. : 5/ 8 BSS84KS3 CYStek Product Specification Typical Characteristics(Cont.) Typical Transfer Characteristics 100 200 300 400 500 600 0123456 -VGS, Gate-Source Voltage(V) -ID, Drain Current (mA) -VDS=10V Power Derating Curve 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0 20 40 60 80 100 120 140 160 TA, Ambient Temperature(℃) PD, Power Dissipation(W) Surface mounted on FR-4 board of 1 in²copper pad Transient Thermal Response Curves 0.001 0.01 0.1 t1, Square Wave Pulse Duration(s) Normalized Transient Thermal Resistance Single Pulse 0.01 0.02 0.05 0.1 0.2 D=0.5 1.RθJA(t)=r(t)*RθJA 2.Duty Factor, D=t1/t2 3.TJM-TC=PDM*ZθJC(t) 4.RθJA=360°C/W

CYStech Electronics Corp. Spec. No. : C465S3 Issued Date : 2012.05.19 Revised Date : 2013.09.09 Page No. : 6/ 8 BSS84KS3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C465S3 Issued Date : 2012.05.19 Revised Date : 2013.09.09 Page No. : 7/ 8 BSS84KS3 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C465S3 Issued Date : 2012.05.19 Revised Date : 2013.09.09 Page No. : 8/ 8 BSS84KS3 CYStek Product Specification SOT-323 Dimension Millimeters Marking: TEPD □□ Date Code 3-Lead SOT-323 Plastic Surface Mounted Package CYStek Package Code: S3 Style: Pin 1.Gate 2.Source 3.Drain D 2.000 2.200 0.079 0.087 θ 0° 8° 0° 8° E 1.150 1.350 0.045 0.053 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.