BSS138 FOSHAN | Alldatasheet

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Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 1 / 6 SOT-23 塑封封装 N 沟道 MOS 场效应管。N-CHANNEL MOSFET in a SOT-23 Plastic Package. 输出电阻小、性能高；SOT-23 封装，利于设计安装。 Low RDS(on),rugged and reliable, compact industry standard SOT-23 surface mount package. 用于小电流伺服马达控制、功率 MOSFET 的门电压驱动及其它开关电路。 Low current applications such as small servo moto r control, power MOSFET gate drivers, and other switching applications. 内部等效电路 / Equivalent Circuit PIN1：S PIN 2 ：G PIN 3 ：D 印章代码 / M a r k i n g 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 引脚排列 / P i n n i n g Marking HSS

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Drain-Source Voltage V DSS 50 V Gate-Source Voltage VGSS ±20 V Drain Current – Continuous I D 220 mA Peak Drain Current I DM 880 mA Power Dissipation P D 360 mW Thermal Resistance, Junction-to-Ambient RθJA 350 /W ℃ Storage Temperature Range Tstg -55～150 ℃ 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 Min 典型值 Typ 最大值 Max 单位 Unit Zero Gate Voltage Drain Current IDSS(1) V GS=0 V DS=50V 0.5 μA IDSS(2) V GS=0 V DS=30V 0.1 μA Gate–Body Leakage. I GSS V DS=0V V GS=±20 ±100 nA Gate Threshold Voltage V GS(th) V DS=VGS I D=1.0mA 0.8 1.3 1.5 V Static Drain–Source On–Resistance RDS(on)(1) VGS=10V I D=220mA 0.7 3.5 Ω RDS(on)(2) VGS=4.5V I D=220mA 1.0 6.0 Ω Forward Transconductance g FS V DS=10V I D=220mA 0.12 0.5 S Drain–Source Diode Forward Voltage VSD VGS=0V I S=440mA 0.8 1.4 V Gate Resistance R G V GS=15mV f=1.0MHZ 9 Ω Turn–On Delay Time t d(on) VDD=30V I D=290mA VGS=10V R GEN=25Ω 2.5 5 ns Turn–On Rise Time t r 9 18 ns Turn–Off Delay Time t d(off) 20 36 ns Turn–Off Fall Time t f 7 14 ns 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions 说明： H： 为公司代码 SS： 为型号代码 Note: H: Company Code. SS: Product Type. HSS

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 6 / 6 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 时间：10±1 sec. Temp.:260 ±5℃ Time:10 ±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / R E E L Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 SOT-23 3,000 10 30,000 8 240,000 7〞×8 180×120×180 385×257×392 使用说明 / N o t i c e s