BSP123 INFINEON | Alldatasheet

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Technical content

Rev. 1.0 BSP123 SIPMOSÒ Small-Signal-Transistor Product Summary VDS 100 V RDS(on) 6 Ω ID 0.37 A Feature

  • N-Channel
  • Enhancement mode
  • Logic Level
  • dv/dt rated SOT223 Marking BSP123 Type Package Ordering Code Tape and Reel Information BSP123 SOT223 Q67000-S306 E6327: 1000 pcs/reel Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter Symbol Value Unit Continuous drain current TA=25°C TA=70°C ID 0.37 0.3 A Pulsed drain current TA=25°C ID puls 1.48 Reverse diode dv/dt IS=0.37A, VDS=80V, di/dt=200A/µs, Tjmax=150°C dv/dt 6 kV/µs Gate source voltage VGS ±20 V ESD Sensitivity (HBM) as per MIL-STD 883 Class 1 Power dissipation TA=25°C Ptot 1.79 W Operating and storage temperature Tj , Tstg -55... +150 °C IEC climatic category; DIN IEC 68-1 55/150/56

Rev. 1.0 BSP123 Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Characteristics Thermal resistance, junction - soldering point (Pin 4) RthJS - 15 25 K/W SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 1) RthJA 100 115 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Static Characteristics Drain-source breakdown voltage VGS=0, ID=250µA V(BR)DSS 100 - - V Gate threshold voltage, VGS = VDS ID=50µA VGS(th) 0.8 1.4 1.8 Zero gate voltage drain current VDS=100V, VGS=0, Tj=25°C VDS=100V, VGS=0, Tj=150°C IDSS 0.01 µA Gate-source leakage current VGS=20V, VDS=0 IGSS - - 10 nA Drain-source on-state resistance VGS=2.8V, ID=15mA RDS(on) - 14 30 Ω Drain-source on-state resistance VGS=4.5V, ID=0.3A RDS(on) - 4.8 10 Drain-source on-state resistance VGS=10V, ID=0.37A RDS(on) - 3.5 6 1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (single layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air.

Rev. 1.0 BSP123 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Conditions Values Unit min. typ. max. Dynamic Characteristics Transconductance gfs VDS≥ 2*ID*RDS(on)max, ID=0.3A 0.13 0.27 - S Input capacitance Ciss VGS=0, VDS=25V, f=1MHz - 56 70 pF Output capacitance Coss - 9 11.3 Reverse transfer capacitance Crss - 3.5 4.4 Turn-on delay time td(on) VDD=50V, VGS=10V, ID=0.37A, RG=6Ω - 3.3 5 ns Rise time tr - 3.2 4.8 Turn-off delay time td(off) - 8.7 13 Fall time tf - 9.4 14 Gate Charge Characteristics Gate to source charge Qgs VDD=80V, ID=0.37A - 0.09 0.13 nC Gate to drain charge Qgd - 0.8 1.2 Gate charge total Qg VDD=80V, ID=0.37A, VGS=0 to 10V - 1.6 2.4 Gate plateau voltage V(plateau) VDD=80V, ID = 0.37 A - 3.61 - V Reverse Diode Inverse diode continuous forward current IS TA=25°C - - 0.37 A Inv. diode direct current, pulsed ISM - - 1.48 Inverse diode forward voltage VSD VGS=0, IF = IS - 0.9 1.2 V Reverse recovery time trr VR=50V, IF=lS, diF/dt=100A/µs - 52.7 79 ns Reverse recovery charge Qrr - 17.8 27 nC

Rev. 1.0 BSP123

1 Power dissipation

Ptot = f (TA) 0 20 40 60 80 100 120 °C 160 TA 0.2 0.4 0.6 0.8 1.2 1.4 1.6 W

1.9 BSP123

2 Drain current

ID = f (TA) parameter: VGS≥ 10 V 0 20 40 60 80 100 120 °C 160 TA 0.04 0.08 0.12 0.16 0.2 0.24 0.28 0.32 A

0.4 BSP123

3 Safe operating area

ID = f ( VDS ) parameter : D = 0 , TA = 25 °C 10 0 10 1 10 2 10 3 V VDS -2 10 -1 10 0 10 1 10 A BSP123 ID R DS(on) V DS / I D DC tp = 21.0ms

4 Transient thermal impedance

ZthJA = f (tp) parameter : D = tp/T 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 3 s tp -3 10 -2 10 -1 10 0 10 1 10 2 10 3 10 K/W BSP123 ZthJA single pulse 0.01 0.02 0.05 0.10 0.20 D = 0.50

Rev. 1.0 BSP123 5 Typ. output characteristic ID = f (VDS) parameter: Tj = 25 °C, VGS 0 0.5 1 1.5 2 2.5 3 3.5 4 V 5 VDS 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 A 0.7 ID 10V 4.5V 4.1V 3.9V 3.7V 3.5V 3.1V 2.9V 2.3V 6 Typ. drain-source on resistance RDS(on) = f (ID) parameter: Tj = 25 °C, VGS ID Ω RDS(on) 2.3V 2.9V 3.1V 3.5V 3.7V 3.9V 4.1V 4.5V 5.0V 10V 7 Typ. transfer characteristics ID= f ( VGS ); VDS≥ 2 x ID x RDS(on)max parameter: Tj = 25 °C 0 0.5 1 1.5 2 2.5 3 3.5 4 V 5 VGS 0.1 0.2 0.3 0.4 0.5 A 0.7 ID 8 Typ. forward transconductance gfs = f(ID) parameter: Tj = 25 °C ID 0.05 0.1 0.15 0.2 0.25 0.3 S 0.4 gfs

Rev. 1.0 BSP123

9 Drain-source on-state resistance

RDS(on) = f (Tj) parameter : ID = 0.37 A, VGS = 10 V -60 -20 20 60 100 °C 180 Tj Ω

24 BSP123

RDS(on) typ 98% 10 Typ. gate threshold voltage VGS(th) = f (Tj) parameter: VGS = VDS; ID =50µA -60 -20 20 60 100 °C 160 Tj 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 V 2.2 VGS(th) typ. 98% 11 Typ. capacitances C = f (VDS) parameter: VGS=0, f=1 MHz, Tj = 25 °C 0 4 8 12 16 20 24 28 V 36 VDS 0 10 1 10 2 10 3 10 pF C Crss Ciss Coss 12 Forward character. of reverse diode IF = f (VSD) parameter: Tj VSD -2 10 -1 10 0 10 1 10 A BSP123 IF Tj = 25 °C typ Tj = 25 °C (98%) Tj = 150 °C typ Tj = 150 °C (98%)

Rev. 1.0 BSP123 13 Typ. gate charge VGS = f (QG); parameter: VDS , ID = 0.37 A pulsed, Tj = 25 °C QG V

16 BSP123

0.2 VDS max

0.5 VDS max

0.8 VDS max

14 Drain-source breakdown voltage

V(BR)DSS = f (Tj) -60 -20 20 60 100 °C 180 Tj 100 102 104 106 108 110 112 114 V 120 BSP123 V(BR)DSS

Rev. 1.0 BSP123 Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.