BLM31PG330SN1L MURATA1 | Alldatasheet

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S p e c . N o . J E N F 2 4 3 A - 0 0 0 6 Z - 0 1 P . 1 / 9 MURATA MFG.CO., LTD. Reference Only Chip Ferrite Bead BLM31□□□□□SN1□ Reference Specification 1. Scope This reference specification applies to Chip Ferrite Bead BLM31_SN Series. 2. Part Numbering ( e x . ) B L M 3 1 P G 6 0 1 S N 1 L ( 1 ) P r o d u c t I D ( 6 ) P e r f o r m a n c e ( 2 ) T y p e ( 7 ) C a t e g o r y (3)Dimension (L×Ｗ) (8)Numbers of Circuit ( 4 ) C h a r a c t e r i s t i c s ( 9 ) P a c k a g i n g ( L : T a p i n g / B : B u l k ) (5)Typical Impedance at 100MHz 3. Rating Customer Part Number MURATA Part Number Impedance (Ω) (at 100MHz, Under Standard T e s t i n g C o n d i t i o n ) Rated Current (mA) (Note1) DC Resistance (Ω) max. Remark at 85°C at 125°C Initial Values Values After Testing BLM31PG330SN1L 33±25% 6000 3500 0.009 0.018 For DC power line BLM31PG330SN1B BLM31PG500SN1L 35 min. 3500 2300 0.015 0.03 BLM31PG500SN1B BLM31PG121SN1L 120±25% 3500 2000 0.02 0.04 BLM31PG121SN1B BLM31PG391SN1L 390±25% 2000 1250 0.05 0.10 BLM31PG391SN1B BLM31PG601SN1L 600±25% 1500 1000 0.08 0.16 BLM31PG601SN1B BLM31SN500SN1L 50±25% 12000 10000 0.0016 0.0021 BLM31SN500SN1B

  • Operating Temperature: -55°C to +125°C • Storage Temperature: -55°C to +125°C （Note1）Rated Current is derated as right figure depending on the operating temperature. 4. Style and Dimensions ■ Equivalent Circuit ■ Unit Mass (Typical value) Operating Temperature (°C) x 85 125 Rated Current (A) Describe the Rated current as x[A] in case of more than 1A. 85℃ 125℃ Resistance element becomes dominant at high frequencies.() 0.025 g :E l e c t r o d e 3.2±0.2 1.6±0.2 0.7±0.3 1.1±0.2 (in mm)

S p e c . N o . J E N F 2 4 3 A - 0 0 0 6 Z - 0 1 P . 2 / 9 MURATA MFG.CO., LTD. Reference Only 5.Marking No marking. 6. Standard Testing Conditions < Unless otherwise specified > < In case of doubt > Temperature : Ordinary Temp. (15 °C to 35 ° C ) T e m p e r a t u r e : 2 0 ° C ± 2 ° C Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH) A t m o s p h e r i c p r e s s u r e : 8 6 k P a t o 1 0 6 k P a 7. Specifications 7-1. Electrical Performance No. Item Specification Test Method 7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent 7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter *Except resistance of the Substrate and Wire 7-2. Mechanical Performance No. Item Specification Test Method 7-2-1 Appearance and Dimensions Meet item 4. Visual Inspection and measured with Slide Calipers. 7-2-2 Bonding Strength Meet Table 1. Table 1 It shall be soldered on the substrate. Applying Force(F) : 9.8N Applying Time : 5s±1s Applied direction:Parallel to substrate 7-2-3 Bending Strength It shall be soldered on the substrate. Substrate: Glass-epoxy 100mm×40mm×1.6mm Deflection: 1.0mm Speed of Applying Force : 0.5mm/s Keeping Time : 30s Appearance No damage Impedance Change (at 100MHz) Within ±30% DC Resistance Meet item 3. 45mm R340 F Deflection 45mm Product Pressure jig R0.5 Ｆ Substrate Ｆ Side view

S p e c . N o . J E N F 2 4 3 A - 0 0 0 6 Z - 0 1 P . 3 / 9 MURATA MFG.CO., LTD. Reference Only No. Item Specification Test Method 7-2-4 Vibration Meet Table 1. It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) 7-2-5 Resistance to Soldering Heat Meet Table 2. Table 2 Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270°C±5°C Immersion Time : 10s±0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 48h±4h. 7-2-6 Drop Products shall be no failure after tested. It shall be dropped on concrete or steel board. Method : free fall Height : 75cm Attitude from which the product is dropped : 3 direction The number of times : 3 times for each direction ( T o t a l 9 t i m e s ) 7-2-7 Solderability The electrodes shall be at least 95% covered with new solder coating. Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 4s±1s Immersion and emersion rates : 25mm/s 7-3. Environmental Performance It shall be soldered on the substrate. No. Item Specification Test Method 7-3-1 Temperature Cycle Meet Table 2. 1 cycle: 1 step: -55 °C(+0 °C,-3 °C) / 30min±3min 2 step: Ordinary temp. / 10min to 15min 3 step: +125 °C(+3 °C,-0 °C) / 30min±3min 4 step: Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48h±4h. 7-3-2 Humidity Temperature : 40°C±2°C Humidity : 90%(RH) to 95%(RH) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. 7-3-3 Heat Life Temperature : 85°C±3°C Applying Current : Rated Current Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. 7-3-4 Cold Resistance Temperature : -55±2°C Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. Appearance No damage Impedance Change (at 100MHz) Within ±30% (for BLM31SN within ±50%) DC Resistance Meet item 3.

S p e c . N o . J E N F 2 4 3 A - 0 0 0 6 Z - 0 1 P . 4 / 9 MURATA MFG.CO., LTD. Reference Only 8. Specification of Packaging 8-1. Appearance and Dimensions (8mm-wide plastic tape) *Dimension of the Cavity is measured at the bottom side. (1) Taping Products shall be packaged in the each embossed cavity of 8mm-wide, 4mm-pitch and plastic tape continuously and sealed by cover tape. (2) Sprocket hole : The sprocket holes are to the right as the tape is pulled toward the user. (3) Spliced point : The cover tape has no spliced point. (4) Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 8-2. Tape Strength (1)Pull Strength Plastic tape 5N min. Cover tape 10N min. (2) Peeling off force of Cover tape 0.2N to 0.7N (Minimum value is typical.) *Speed of Peeling off:300mm/min 8-3. Taping Condition (1) Standard quantity per reel Quantity per 180mm reel : 3000 pcs. / reel (2) There shall be leader-tape (cover tape only and empty tape ) and trailer- tape (empty tape) as follows. (3) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number (∗1), RoHS marking (∗2) , Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× ( 1 ) ( 2 ) ( 3 ) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y ( △) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (4) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking ( ∗2), Quantity, etc) 165 to 180 degree F Cover tape Plastic tape 0.2±0.1φ1.5 Direction of feed 4.0±0.1 4.0±0.1 3.5±0.1 2.0±0.05 3.5±0.05 1.75±0.1 8.0±0.3 +0.1 1.9±0.1 φ1.0+0.3 1.3±0.1 (in mm) 1.3±0.1

S p e c . N o . J E N F 2 4 3 A - 0 0 0 6 Z - 0 1 P . 5 / 9 MURATA MFG.CO., LTD. Reference Only (5) Dimensions of reel and taping (leader-tape, trailer-tape) 8-4. Specification of Outer Case Outer Case Dimensions (mm) Standard Reel Quantity in Outer Case (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. 9. ！ Caution 9-1. Surge current Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1)Aircraft equipment (6)D isaster prevention / crime prevention equipment (2)Aerospace equipment (7)Traffic signal equipment (3)Undersea equipment (8)Trans portation equipment (vehicles,trains,ships,etc.) (4)Power plant control equipment (9) Data-processing equipment (5)Medical equipment (10)Applications of similar complexity and /or reliability requirements t o t h e a p p l i c a t i o n s l i s t e d i n t h e a b o v e 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1. Land pattern designing

  • Standard land dimensions (Flow and Reflow soldering) Type Rated Current (A) Land pad thickness and dimension d 18µm 35µm 70µm BLM31PG 1.5/2 1.8 1.8 1.8 3.5 2.4 1.8 1.8 6 6.4 3.3 1.8 BLM31SN 10～12 - 9.8 4.9 (in mm) *The excessive heat by land pads may cause deterioration at joint of products with substrate. Type Soldering a b c BLM31PG BLM31SN Flow 2.4 4.7 1.2 Reflow 2.0 4.3 1.8 W D Label H a b Chip Ferrite Bead Solder Resist Pattern dc

S p e c . N o . J E N F 2 4 3 A - 0 0 0 6 Z - 0 1 P . 6 / 9 MURATA MFG.CO., LTD. Reference Only

  • Land dimensions on Flow soldering for 2.5mm pitch mounting *As for BLM31PG type, taking land pad thickness and rated current into account. a b c d e (in mm) *The pattern shall be designed to above drawing to prevent causing the solder bridge when products are mounted by 2.5mm pitch flow soldering. 10-2. Soldering Conditions Products can be applied to reflow and flow soldering. ( 1 ) F l u x , S o l d e r Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solder Use Sn-3.0Ag-0.5Cu solder Standard thickness of solder paste : 100 µm to 200 μm (2) Soldering conditions
  • Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 ℃ max. Also cooling into solvent after soldering shou ld be in such a way that the temperature difference is limited to 100 ℃ max. Insufficient pre-heating may cause cracks on the ferrit e, resulting in the deterioration of product quality.
  • Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. (3) soldering profile □Flow soldering profile Standard Profile Limit Profile Pre-heating 150°C 、60s min. Heating 250°C 、4～6s 265°C ±3°C、5s max. Cycle of flow 2 times 2 times 250℃ Heating Time 150 Limit Profile Standard Profile (s)Time. Temp. (℃) 60s min. 265℃±3℃ d ea b c a b d e c e e 2.5mm pitch Chip Ferrite Bead Solder Resist Pattern

S p e c . N o . J E N F 2 4 3 A - 0 0 0 6 Z - 0 1 P . 7 / 9 MURATA MFG.CO., LTD. Reference Only □Reflow soldering profile Standard Profile Limit Profile Pre-heating 150 ～180°C 、90s±30s Heating above 220°C 、30s～60s above 230°C 、60s max. Peak temperature 245 ±3°C 260°C,10s Cycle of reflow 2 times 2 times 10-3. Reworking with soldering iron

  • Pre-heating: 150°C, 1 min • Soldering iron output: 80W max.
  • Tip temperature: 350°C max. • Tip diameter:φ3mm max.
  • Soldering time : 3(+1,-0) seconds. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 10-4. Solder Volume Solder shall be used not to be exceed as shown below. 1/3T≦t≦T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 10-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage. <Products direction> Products shall be located in the sideways direction (Length:a<b) to the mechanical stress. Recommendable Upper Limit t 〈Poor example〉 〈Good example〉 b a Limit Profile Standard Profile 90s±30s 230℃ 260℃ 245℃±3℃ 220℃ 30s～60s 60s max. 180 150 Temp. (s) (℃) Time.

S p e c . N o . J E N F 2 4 3 A - 0 0 0 6 Z - 0 1 P . 8 / 9 MURATA MFG.CO., LTD. Reference Only (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 10-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc (the sea breeze, Cl 2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. Perforation Slit A B C D Screw Hole Recommended

S p e c . N o . J E N F 2 4 3 A - 0 0 0 6 Z - 0 1 P . 9 / 9 MURATA MFG.CO., LTD. Reference Only 10-9. Cleaning Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Before starting your production proce ss, test your cleaning equipment / process to insure it does not degrade this product. 10-10. Handling of a substrate After mounting products on a substrate, do not apply any stre ss to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11. Storage Conditions (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions

  • Products should be stored the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity
  • Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
  • Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
  • Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
  • Avoid storing the product by itself bare (i.e.exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are s ubject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering.