BLM21AG102SN1D

BLM21AG601SN1B MURATA1 | Alldatasheet

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Spec. No. JENF243A-0005AA-01 P.1/10 MURATA MFG.CO., LTD. Reference Only Chip Ferrite Bead BLM21□□□□□□N1□ Reference Specification 1. Scope This reference specification applies to Chip Ferrite Bead BLM21_□N Series. 2. Part Numbering (ex.) BL M 21 AG 121 S N 1 D 3. Rating (1)Product ID (7)Category (2)Type (8)Numbers of Circuit (3)Dimension (L×Ｗ) (9)Packaging (4)Characteristics D:Taping(φ180mm Reel, Paper Tape) L:Taping(φ180mm Reel, Plastic Tape) B:Bulk (5)Typical Impedance at 100MHz (6)Performance Customer Part Number MURATA Part Number Impedance (Ω) (at 100MHz,Under Standard Testing Condition) Rated Current (mA)(＊1) DC Resistance (Ω) max. Remark Initial Values Values After Testing Typical at 85°C at 125°C BLM21PG220SN1D 22±25％ 22 *1 6000 3300 0.009 0.018 For DC power line BLM21PG220SN1B BLM21PG300SN1D 20 min. 30 *1 4000 2300 0.014 0.028 BLM21PG300SN1B BLM21PG600SN1D 60±25％ 60 *1 3500 1900 0.02 0.04 BLM21PG600SN1B BLM21PG121SN1D 120±25％ 120 *1 3000 1550 0.03 0.06 BLM21PG121SN1B BLM21PG221SN1D 220±25％ 220 *1 2000 1250 0.045 0.09 BLM21PG221SN1B BLM21PG331SN1D 330±25％ 330 *1 1500 1000 0.07 0.14 BLM21PG331SN1B BLM21SN300SN1D 30±10Ω 30 *1 8500 6000 0.004 0.005 BLM21SN300SN1B BLM21SP700SN1D 70±25% 70 *1 6000 4000 0.009 0.012 BLM21SP700SN1B BLM21SP111SN1D 110±25% 110 *1 5000 3300 0.013 0.016 BLM21SP111SN1B BLM21SP181SN1D 180±25% 180 *1 4000 2600 0.020 0.025 BLM21SP181SN1B BLM21SP331SN1D 330±25% 330 *1 2800 1900 0.040 0.051 BLM21SP331SN1B BLM21SP471SN1D 470±25% 470 *1 2500 1700 0.050 0.063 BLM21SP471SN1B BLM21SP601SN1D 600±25% 600 *1 2300 1500 0.060 0.074 BLM21SP601SN1B BLM21SP102SN1D 1000±25% 1000 *1 1600 1100 0.120 0.144 BLM21SP102SN1B BLM21RK121SN1D 120±25% 120 200 0.15 0.25 For Digital Interface BLM21RK121SN1B BLM21RK221SN1D 220±25% 220 200 0.20 0.30 BLM21RK221SN1B BLM21RK471SN1D 470±25% 470 200 0.25 0.35 BLM21RK471SN1B BLM21RK601SN1D 600±25% 600 200 0.30 0.40 BLM21RK601SN1B BLM21RK102SN1D 1000±25% 1000 200 0.50 0.60 BLM21RK102SN1B

Spec. No. JENF243A-0005AA-01 P.2/10 MURATA MFG.CO., LTD. Reference Only Customer Part Number MURATA Part Number Impedance (Ω) (at 100MHz,Under Standard Testing Condition) Rated Current (mA) DC Resistance (Ω) max. Remark Initial Values Values After Testing Typical BLM21BB050SN1D 5±25％ 5 1000 0.02 0.04 For high speed signal line BLM21BB050SN1B BLM21BB600SN1D 60±25％ 60 800 0.13 0.23 BLM21BB600SN1B BLM21BB750SN1D 75±25％ 75 700 0.16 0.26 BLM21BB750SN1B BLM21BB121SN1D 120±25％ 120 600 0.19 0.29 BLM21BB121SN1B BLM21BD121SN1D 120±25％ 120 350 0.25 0.35 BLM21BD121SN1B BLM21BB151SZ1D 150±25％ 150 600 0.21 0.31 BLM21BB151SZ1B BLM21BD151SN1D 150±25％ 150 350 0.25 0.35 BLM21BD151SN1B BLM21BB201SN1D 200±25％ 200 500 0.26 0.36 BLM21BB201SN1B BLM21BB221SN1D 220±25％ 220 500 0.26 0.36 BLM21BB221SN1B BLM21BD221SN1D 220±25% 220 350 0.25 0.35 BLM21BD221SN1B BLM21BB331SN1D 330±25％ 330 400 0.33 0.43 BLM21BB331SN1B BLM21BD331SN1D 330±25% 330 300 0.3 0.4 BLM21BD331SN1B BLM21BD421SN1D 420±25% 420 300 0.3 0.4 BLM21BD421SN1B BLM21BB471SN1D 470±25％ 470 400 0.40 0.50 BLM21BB471SN1B BLM21BD471SN1D 470±25% 470 300 0.35 0.45 BLM21BD471SN1B BLM21BD601SN1D 600±25% 600 300 0.35 0.45 BLM21BD601SN1B BLM21BD751SN1D 750±25% 750 250 0.4 0.5 BLM21BD751SN1B BLM21BD102SN1D 1000±25% 1000 250 0.4 0.5 BLM21BD102SN1B BLM21BD152SN1D 1500±25% 1500 250 0.45 0.55 BLM21BD152SN1B BLM21BD182SN1D 1800±25% 1800 250 0.5 0.6 BLM21BD182SN1B BLM21BD222SN1L 1600 min. 2250 250 0.6 0.7 BLM21BD222SN1B BLM21BD222TN1D 2200±25% 2200 200 0.6 0.7 BLM21BD222TN1B BLM21BD272SN1L 2700±25% 2700 200 0.8 0.9 BLM21BD272SN1B Total page 3/16

Spec. No. JENF243A-0005AA-01 P.3/10 MURATA MFG.CO., LTD. Reference Only Customer Part Number MURATA Part Number Impedance (Ω) (at 100MHz,Under Standard Testing Condition) Rated Current (mA) DC Resistance (Ω) max. Remark Initial Values Values After Testing Typical BLM21AG121SN1D 120±25％ 120 1000 0.09 0.19 For general use BLM21AG121SN1B BLM21AG151SN1D 150±25％ 150 1000 0.09 0.19 BLM21AG151SN1B BLM21AG221SN1D 220±25％ 220 900 0.12 0.22 BLM21AG221SN1B BLM21AG331SN1D 330±25％ 330 800 0.15 0.25 BLM21AG331SN1B BLM21AG471SN1D 470±25％ 470 700 0.18 0.28 BLM21AG471SN1B BLM21AG601SN1D 600±25％ 600 700 0.2 0.3 BLM21AG601SN1B BLM21AG102SN1D 1000±25％ 1000 600 0.27 0.37 BLM21AG102SN1B

• Operating Temperature : -55°C to +125°C • Storage Temperature : -55°C to +125°C (Note)As for Rated current marked with *1, Rated Current is derated as right figure depending on the oper ating temperature. 4. Style and Dimensions ■ Equivalent Circuit ■ Unit Mass (Typical value) 0.010g 0.014g ( for 21BD222SN1□/21BD272SN1□) L W T E 2.0±0.2 1.25±0.2 0.85±0.2 0.5±0.2 for 21BD222SN1□ 21BD272SN1 □ 1.25±0.2 for 21BD272SN1□ 0.3±0.2 (in mm) 5. Marking No marking. 6.Standard Testing Conditions < Unless otherwise specified > < In case of doubt > Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH) Atmospheric pressure : 86kPa to 106kPa :Electrode L W E T Resistance element becomes dominant at high frequencies.() Operating Temperature (°C) x 85 125 Rated Current (A) Describe the Rated current as x[A] in case of more than 1A. 85℃ 125℃ Total page 3/16

Spec. No. JENF243A-0005AA-01 P.4/10 MURATA MFG.CO., LTD. Reference Only 7. Specifications 7-1.Electrical Performance No. Item Specification Test Method 7-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz Measuring Equipment : KEYSIGHT4291A or the equivalent Test Fixture : KEYSIGHT16192A or the equivalent 7-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter * Except resistance of the Substrate and Wire 7-2. Mechanical Performance No. Item Specification Test Method 7-2-1 Appearance and Dimensions Meet item 4. Visual Inspecti on and measured with Slide Calipers. 7-2-2 Bonding Strength Meet Table 1. Table 1 It shall be soldered on the substrate. Applying Force(F) : 9.8N Applying Time : 5s±1s Applied direction:Parallel to substrate 7-2-3 Bending Strength It shall be soldered on the substrate. Substrate: Glass-epoxy 100mm×40mm×1.6mm Deflection: 1.0mm Speed of Applying Force : 0.5mm/s Keeping Time : 30s 7-2-4 Vibration It shall be soldered on the substrate. Oscillation Frequency : 10Hz to 55Hz to 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 h) 7-2-5 Resistance to Soldering Heat Meet Table 2. Table 2 Appearance No damage Impedance Change (at 100MHz) Within ±30% (for BLM21SN Within ±50%) DC Resistance Meet item 3. Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 270°C±5°C Immersion Time : 10s±0.5s Immersion and emersion rates : 25mm/s Then measured after exposure in the room condition for 48h±4h. 7-2-6 Drop Products shall be no failure after tested. It shall be dropped on concrete or steel board. Method : free fall Height : 75cm Attitude from which the product is dropped : 3 direction The number of times : 3 times for each direction(Total 9 times) 7-2-7 Solderability The electrodes shall be at least 95% covered with new solder coating. Flux : Ethanol solution of rosin,25(wt)% Pre-Heating : 150°C±10°C, 60s～90s Solder : Sn-3.0Ag-0.5Cu Solder Temperature : 240°C±5°C Immersion Time : 4s±1s Immersion and emersion rates : 25mm/s 45mm R340 F Deflection 45mm Product Pressure jig Appearance No damage Impedance Change (at 100MHz) Within ±30% DC Resistance Meet item 3. R0.5 Ｆ Substrate Ｆ Side view

Spec. No. JENF243A-0005AA-01 P.5/10 MURATA MFG.CO., LTD. Reference Only 7-3. Environmental Performance It shall be soldered on the substrate. No. Item Specification Test Method 7-3-1 Temperature Cycle Meet Table 2. 1 cycle :1 step : -55 °C(+0 °C,-3 °C) / 30min±3min 2 step : Ordinary temp. / 10min to 15min 3 step : +125 °C(+3 °C,-0 °C) / 30min±3min 4 step : Ordinary temp. / 10min to 15min Total of 100 cycles Then measured after exposure in the room condition for 48h±4h. 7-3-2 Humidity Temperature : 40°C±2°C Humidity : 90%(RH) to 95%(RH) Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. 7-3-3 Heat Life Temperature : 125°C±3°C (in case of Rated current is more than 1A, do the test at : +85 °C±3°C) Applying Current : Rated Current Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. 7-3-4 Cold Resistance Temperature : -55°C±2°C Time : 1000h(+48h,-0h) Then measured after exposure in the room condition for 48h±4h. 8. Specification of Packaging 8-1. Appearance and Dimensions Part Number Type Appearance and Dimensions a Dimension of the Cavity is measured at the bottom side. BLM21 except 21BD222SN1L 21BD272SN1L 8mm- wide Paper tape 1.1 max. BLM21BD222SN1L BLM21BD272SN1L 8mm- wide Plastic tape 1.3 ±0.1 (in mm) Paper tape Plastic tape Taping Products shall be packaged in the cavity of the base tape of 8mm-wide, 4mm-pitch continuously and sealed by top tape and bottom tape. Products shall be packaged in the each embossed cavity of 8mm-wide, 4mm-pitch plastic tape continuously and sealed by cover tape. Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. Spliced point The base tape and t op tape have no spliced point. The cover tape has no spliced point. Cavity There shall not be burr in the cavity. － Missing components number Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 0.2±0.1 a Paper Tapeφ1.5 a Direction of feed 4.0±0.1 4.0±0.1 2.25±0.1 2.0±0.05 3.5±0.05 1.75±0.1 8.0±0.3 +0.1 1.45±0.1 Plastic Tape There are holes in the cavity of the Plastic tape φ1.0+0.3 Total page 6/16

Spec. No. JENF243A-0005AA-01 P.6/10 MURATA MFG.CO., LTD. Reference Only 8-2. Tape Strength (1)Pull Strength Paper tape Top tape 5N min. Bottom tape Plastic tape Plastic tape 5N min. Cover tape 10N min. (2) Peeling off force of Top tape･Cover tape Speed of Peeling off 300mm/min Peeling off force * Paper tape 0.1N to 0.6N Plastic tape 0.2N to 0.7N * Minimum value is typical.

• Case of Paper tape • Case of Plastic tape 8-3. Taping Condition (1) Standard quantity per reel Type Quantity per 180mm reel BLM21(except 21BD222SN1L/21B D272SN1L) 4000 pcs. / reel BLM21BD222SN1L/BLM21BD272SN1L 3000 pcs. / reel (2) There shall be leader-tape (cover tape/top tape and empty tape ) and trailer- tape(empty tape) as follows. (3) On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape for more than 5 pitch. (4) Marking for reel The following items shall be marked on a label and the label is stuck on the reel. (Customer part number, MURATA part number, Inspection number(∗1) , RoHS marking(∗2), Quantity, etc) ∗1) « Expression of Inspection No. » □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y ( △) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number (5) Outside package These reels shall be packed in the corrugated cardboard package and the following items shall be marked on a label and the label is stuck on the box. (Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,Quantity, etc) (6) Dimensions of reel and taping(leader-tape, trailer-tape) Top tape Bottom tape Base tape 165 to 180 degree F Cover tape Plastic tape 165 to 180 degree F

Spec. No. JENF243A-0005AA-01 P.7/10 MURATA MFG.CO., LTD. Reference Only 8-4. Specification of Outer Case Outer Case Dimensions (mm) Standard Reel Quantity in Outer Case (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. 9. ！ Caution 9-1. Surge current Excessive surge current (pulse current or rush current ) than specified rated current applied to the product may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise. Please contact us in advance in case of applying the surge current. 9-2. Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6 ) Disaster prevention / crime prevention equipment (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8 ) Transportation equipment (trains,ships,etc.) (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applicat ions of similar complexity and /or reliability requirements to the applications listed in the above 10. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 10-1. Land pattern designing

• Standard land dimensions < BLM21 series(except BLM21PG/BLM21S type) > (in mm) < For BLM21PG/BLM21S type > Type Rated Current (A) Land pad thickness and dimension d 18µm 35µm 70µm BLM21PG 1.5 1.25 1.25 1.25 2 1.25 1.25 1.25 3~4 2.4 1.25 1.25 6 6.4 3.3 1.65 BLM21S 1~8.5 - 6.8 3.4 (in mm) (in mm) *The excessive heat by land pads may cause deterioration at joint of products with substrate. Soldering a b c Flow 1.1 3.5 0.95 Reflow 1.2 2.4 1.25 Soldering a b c Flow 1.1 3.5 0.95 Reflow 1.2 2.4 1.25 W D Label H a b Chip Ferrite Bead Solder Resist Pattern c a b Chip Ferrite Bead Solder Resist Pattern dc

Spec. No. JENF243A-0005AA-01 P.8/10 MURATA MFG.CO., LTD. Reference Only 10-2. Soldering Conditions Products can be applied to reflow and flow soldering. (1) Flux, Solder Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. ) Do not use water-soluble flux. Solde r Use Sn-3.0Ag-0.5Cu solde r Standard thickness of solder paste : 100 µm to 200 μm (2) Soldering conditions

• Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 ℃ max. Also cooling into solvent after soldering s hould be in such a way that the temperature difference is limited to 100 ℃ max. Insufficient pre-heating may cause cracks on the ferri te, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. (3) soldering profile □Flow soldering profile Standard Profile Limit Profile Pre-heating 150 ℃、60s min. Heating 250 ℃、4～6s 265 ℃±3℃、5s max. Cycle of flow 2 times 2 times □Reflow soldering profile Standard Profile Limit Profile Pre-heating 150 ～180°C 、90s±30s Heating above 220°C 、30s～60s above 230°C 、60s max. Peak temperature 245 ±3°C 260°C,10s Cycle of reflow 2 times 2 times Limit Profile Standard Profile 90s±30s 230℃ 260℃ 245℃±3℃ 220℃ 30s～60s 60s max. 180 150 Temp. (s) (℃) Time. 250℃ Heating Time 150 Limit Profile Standard Profile (s)Time. Temp. (℃) 60s min. 265℃±3℃

Spec. No. JENF243A-0005AA-01 P.9/10 MURATA MFG.CO., LTD. Reference Only 10-3. Reworking with soldering iron

• Pre-heating: 150°C, 1 min • Soldering iron output: 80W max.
• Tip temperature: 350°C max. • Tip diameter:φ3mm max.
• Soldering time : 3(+1,-0) seconds. • Times : 2times max. Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the ferrite material due to the thermal shock. 10-4. Solder Volume Solder shall be used not to be exceed as shown below. 1/3T≦t≦T (T:Chip thickness) Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 10-5. Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subjected to the mechanical stress for board warpage. <Products direction> Products shall be located in the sideways direction (Length:a<b) to the mechanical stress. (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Recommendable Upper Limit t 〈Poor example〉 〈Good example〉 b a Total page Perforation Slit A B C D Screw Hole Recommended

Spec. No. JENF243A-0005AA-01 P.10/10 MURATA MFG.CO., LTD. Reference Only 10-6. Mounting density Add special attention to radiating heat of products when mounting the inductor near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 10-7. Operating Environment Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use. (1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 10-8. Resin coating The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. 10-9. Cleaning Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips or broken solder joints. Before starting your production process, test your cleaning equipment / process to insure it does not degrade this product. 10-10. Handling of a substrate After mounting products on a substrat e, do not apply any stress to the pr oduct caused by bending or twisting to the substrate when cropping the substr ate, inserting and removing a connecto r from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 10-11 Storage Conditions (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions

• Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity
• Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
• Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
• Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
• Avoid storing the product by itself bare (i.e.exposed directly to air). (3) Delivery Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 11. ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering.