BLD122D FOSHAN | Alldatasheet

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Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 1 / 6 TO-92 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a TO-92 Plastic Package. 耐压高，快速转换。 High Voltage Capability High Speed Switching. 主要用于节能灯、日光灯电子镇流器及其它开关、振荡电路。 High frequency electronic lighting ballast applications,converters, inverters, switching regulators, etc. PIN1：Base PIN 2 ：Collector PIN 3 ：Emitter 放大及印章代码 / hFE Classifications & Marking 见印章说明。See Marking Instructions. 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g 1 2 3

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO 600 V Collector to Emitter Voltage VCEO 400 V Emitter to Base Voltage V EBO 9.0 V Collector Current - Continuous I C 1.3 A Collector Power Dissipation P C 1.0 W Junction Temperature Tj 150 ℃ Storage Temperature Range Tstg -55～150 ℃ 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 Min 典型值 Typ 最大值 Max 单位 Unit Collector to Base Voltage V CBO IC=1mA I E=0 600 V Collector-Emitter Voltage V CEO IC=10mA I B=0 400 V Emitter-Base Voltage V EBO IE=1mA I C=0 9.0 V Collector Cut-Off Current I CBO V CB=600V I E=0 0.1 mA Collector cut-off current ICEO V CE=400V I B=0 0.1 mA Emitter Base Cut-Off Current I EBO V EB=9.0V I C=0 0.1 mA DC Current Gain hFE(1) V CE=5V I C=200mA 10 40 hFE(2) V CE=5V I C=1mA 7 hFE(3) V CE=5V I C=1.2A 5 Collector to Emitter Saturation Voltage VCE(sat)(1) IC=500mA I b=100mA 0.5 V VCE(sat)(2) IC=1.0A I b=500mA 0.6 V Base to Emitter Saturation Voltage V BE(sat) IC=500mA I b=100mA 1.2 V Fall time t f VCE=5V I C=0.25A (UI9600) 0.8 μS Storage time t s 3.5 μS Transition Frequency f T VCE=10V I C=0.1A f=1MHz 5 MHz 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve S O A ( D C ) P C-TC hFE-Ic h FE-Ic Vces-IC Vbes-IC tS- T a h FE-Ta

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions 说明： 122D：  为型号代码 Note: BR: Company Code. 122D: Product Type. **: Lot No. Code,code change with Lot No. BR ** 122D

Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 6 / 6 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：270±5℃ 时间：10±1 sec. Temp:270±5 ℃ Time:10±1 sec 包装规格 / Packaging SPEC. 散件包装 / B U L K Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm3) Units/Bag 只/袋 Bags/Inner Box 袋/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Bag 袋 Inner Box 盒 Outer Box 箱 TO-92 1,000 10 10,000 5 50,000 135×190 237×172×102 560×245×195 1,000 10 10,000 10 100,000 135×190 237×172×102 560×245×375 编带包装 / A M M O Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm3) Units/tape 只/纸带 Tape/Inner Box 纸带/盒 Rows/Inner Box 纸带层/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Inner Box 盒 Outer Box 箱 TO-92 3,000 1 120 10 30,000 328×230×42 小箱 480×346×235， 大箱 547×407×268 使用说明 / N o t i c e s