BF820 FOSHAN | Alldatasheet
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R e v . F A p r . - 2 0 1 7 DATA SHEET http://www.fsbrec.com 1 / 6 SOT-23 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a SOT-23 Plastic Package. 电流小，电压高。 Low current, high voltage. 用于电话机等专业的通迅设备。 Telephony and professional communication equipment. PIN1：Base PIN 2 ：Emitter PIN 3 ：Collector 放大及印章代码 / h FE Classifications & Marking 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / Pinning hFE Range >50 Marking H1V
R e v . F A p r . - 2 0 1 7 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO 300 V Collector to Emitter Voltage VCEO 300 V Emitter to Base Voltage V EBO 5.0 V Collector Current - Continuous I C 50 mA Peak Collector Current - Continuous I CM 100 mA Base Current I B 50 mA Collector Power Dissipation P C 250 mW Junction Temperature Tj 150 ℃ Storage Temperature Range Tstg -55～150 ℃ 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 Min 典型值 Typ 最大值 Max 单位 Unit Collector to Base Breakdown Voltage VCBO IC=100μA IE=0 300 V Collector to Emitter Breakdown Voltage VCEO IC=1.0mA IB=0 300 V Emitter to Base Breakdown Voltage VEBO IE=100μA IC=0 5.0 V Collector Cut-Off Current I CBO V CB=200V IE=0 0.01 μA Emitter Cut-Off Current I EBO V EB=5.0V IC=0 0.05 μA DC Current Gain h FE V CE=20V IC=25mA 50 Collector to Emitter Saturation Voltage VCE(sat) I C=30mA IB=5.0mA 0.6 V Feedback Capacitance C re VCB=30V IE=0 f=1.0MHz 1.6 pF Transition Frequency f T VCE=10V IC=10mA f=100MHz 60 MHz *pulse test: pulse width≤300μS,duty cycle≤2.0%. 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)
R e v . F A p r . - 2 0 1 7 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve
R e v . F A p r . - 2 0 1 7 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions
R e v . F A p r . - 2 0 1 7 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions 说明： H： 为公司代码 1V： 为型号代码 Note: H: Company Code. 1V: Product Type Code. H1V
R e v . F A p r . - 2 0 1 7 DATA SHEET http://www.fsbrec.com 6 / 6 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 时间：10±1 sec. Temp.:260±5 ℃ Time:10±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / R E E L Units 包装数量 Dimension 包装尺寸 (unit ：mm ) Package Type 封装形式 Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 SOT-23 3,000 10 30,000 6 180,000 7〞×8 180×120×180 390×385×205 使用说明 / Notices