BAS316 FOSHAN | Alldatasheet

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Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 1 / 7 SOD-323 塑封封装 硅半导体二极管。 Silicon Diode in a SOD-323 Plastic Package. 小信号二极管。 Small signal diode . 用于开关电路。 Switching diodes. PIN1:Cathode PIN2:Anode 放大及印章代码 / h FE Classifications & Marking 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g Marking A6H

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 2 / 7 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Repetitive peak reverse voltage VRRM 85 V Continuous forward current IF(AV)(Ts=90℃) 250 mA Non-repetitive peak forward current IFSM(1)(t=1S) 0.5 A IFSM(2)(t=1mS) 1.0 A Total power dissipation Ptot(Ts=90℃) 400 mW Thermal resistance from junction to soldering point RθJ-S 150 K/W Junction Temperature Tj 150 ℃ Storage Temperature Range Tstg -65~150 ℃ 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 Min 典型值 Typ 最大值 Max 单位 Unit Forward Voltage VF IF=1mA 715 mV IF=10mA 855 mV IF=50mA 1.0 V IF=150mA 1.25 V Reverse Current I R VR=25V 30 nA VR=75V 1.0 μA VR=25V T j=150℃ 30 μA VR=75V T j=150℃ 50 μA Diode capacitance Cd V R=0 f=1.0MHz 1.5 pF Reverse Recovery Time t rr IF=1R=10mA IR= 1 . 0 m A RL=100Ω 4.0 ns Forward recovery voltage Vfr I F=10mA T r=20ns 1.75 V 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 3 / 7 电参数曲线图 / Electrical Characteristic Curve

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 4 / 7 测试电路和波形 / Test circuit and waveforms.

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 5 / 7 外形尺寸图 / Package Dimensions

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 6 / 7 印章说明 / Marking Instructions 说明: A6: 为型号代码 H:  为公司代码 Note: A6: Product Type Code H: Company Code A6H

Rev.F Mar.-2016 DATA SHEET http://www.fsbrec.com 7 / 7 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明: N o t e : 1、预热温度 25~150℃,时间 60~90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2~10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度:260±5℃ 时间:10±1 sec. Temp.:260 ±5℃ Time:10 ±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / R E E L Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit :mm Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 SOD-323 3,000 10 30,000 8 240,000 7〞×8 180×120×180 385×257×392 使用说明 / N o t i c e s