BAS21

BAS21-03WE6327 INFINEON | Alldatasheet

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Technical content

BAS21... Silicon Switching Diode

• For high-speed switching applications
• High breakdown voltage
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101 BAS21 BAS21-03W BAS21U /G33 /G31 /G32 /G31 /G44 /G31 /G32 /G33 /G34 /G35 /G36 /G44 /G32 /G44 /G33 /G31 /G32 Type Package Configuration Marking BAS21 BAS21-03W BAS21U SOT23 SOD323 SC74 single single parallel triple JSs D JSs Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage VR 200 V Peak reverse voltage VRM 250 Forward current IF 250 mA Peak forward current IFM 625 Peak forward current IFM 625 mA Surge forward current, t = 10 µs IFS 4 A Non-repetitive peak surge forward current IFSM - Total power dissipation BAS21, TS ≤ 70°C BAS21-03W, TS ≤ 124°C BAS21U, TS ≤ 122°C Ptot 350 250 250 mW Junction temperature Tj 150 °C Storage temperature Tstg -65 ... 150 1Pb-containing package may be available upon special request

BAS21... Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) BAS21 BAS21-03W BAS21U RthJS ≤ 230 ≤ 105 ≤ 110 K/W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Breakdown voltage I(BR) = 100 µA V(BR) 250 - - V Reverse current V R = 200 V VR = 200 V, TA = 150 °C IR 0.1 100 µA Forward voltage IF = 100 mA IF = 200 mA VF 1.25 V AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz CT - - 5 pF Reverse recovery time IF = 30 mA, IR = 30 mA, measured at IR = 3mA, RL = 100 Ω trr - - 50 ns Test circuit for reverse recovery time EHN00018 OscillographΙF D.U.T. Puls generator: tp = 1µs, D = 0.05 tr = 0.6ns, Ri = 50Ω Oscillograph: R = 50Ω , tr = 0.35ns, C ≤ 1pF 1For calculation of RthJA please refer to Application Note Thermal Resistance

BAS21... Reverse current IR = ƒ (TA) VR = 200V 10 0 50 100 150 BAS 19...21 EHB00027 µ TA ΙR max typ. A 10-1 101 10 2 Forward Voltage VF = ƒ (TA) IF = Parameter 0.00 BAS 19...21 EHB00029 TA VF 0.5 1.0 V 1.5 50 100 150 FΙ = 625 mA mA250 100 mA 10 mA Forward current IF = ƒ (VF) 0.00 EHB00028BAS 19...21 Ι V F F 100 200 300 400 500 600 700 mA 800 0.5 1.0 V 1.5 Forward current IF = ƒ (TS) BAS21-03W 0 15 30 45 60 75 90 105 120 °C 150 TS 100 150 200 mA 300 IF

BAS21... Forward current IF = ƒ (TS) BAS21U 0 15 30 45 60 75 90 105 120 °C 150 TS 100 150 mA 250 IF Permissible Puls Load RthJS = ƒ (tp) BAS21 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tP -1 10 0 10 1 10 2 10 3 10 RthJS D = 0.5 0.2 0.1 0.05 0.02 0.01 0.005 Permissible Pulse Load IFmax/ IFDC = ƒ (tp) BAS21 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tP 0 10 1 10 2 10 IFmax/IFDC D = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 Permissible Puls Load RthJS = ƒ (tp) BAS21-03W 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tP -1 10 0 10 1 10 2 10 3 10 K/WRthJS D=0.5 0.2 0.1 0.05 0.02 0.01 0.005

BAS21... Permissible Pulse Load IFmax/ IFDC = ƒ (tp) BAS21-03W 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tP 0 10 1 10 2 10 IFmax/IFDC D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 Permissible Pulse Load IFmax/ IFDC = ƒ (tp) BAS21U 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tP 0 10 1 10 2 10 IFmax/IFDC D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 Permissible Puls Load RthJS = ƒ (tp) BAS21U 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tP -1 10 0 10 1 10 2 10 3 10 K/WRthJS D=0.5 0.2 0.1 0.05 0.02 0.01 0.005

BAS21...Package SC74 Package Outline Foot Print Standard Packing 0.5 0.95 1.9 2.9 546 321 1.1 MAX. (0.35) (2.25) ±0.22.9 B 0.2 +0.1 -0.050.35Pin 1 marking M B 6x 0.95 1.9 0.15-0.06 +0.1 1.6 10˚ MAX.A ±0.1 2.5 0.25 10˚ MAX. ±0.1 ±0.1 A0.2 M 0.1 MAX. 2.7 3.15Pin 1 marking 0.2 1.15 Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel For symmetric types no defined Pin 1 orientation in reel. Manufacturer 2005, June Date code (Y ear/Month) BCW66H Type code Pin 1 marking Laser marking Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible.

BAS21...Package SOD323 Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel BAR63-03W Type code Cathode marking Laser marking 0.80.8 0.6 1.7 marking Cathode ±0.22.5 0.25 0.3 -0.05 M A +0.1 +0.2 1.25-0.1 +0.05 -0.2 1.7 0.3 0.15-0.06 +0.1 0±0.05 +0.2 -0.1 A 0.9+0.2 -0.1 ±0.150.45 0.24 2.9 1.35 0.65Cathode marking

BAS21...Package SOT23 Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel EH s BCW66 Type code Pin 1 0.8 0.9 0.91.3 0.8 1.2

0.25 M BC

1.9 -0.05 +0.10.4 ±0.12.9 0.95 C B 0...8˚ 0.2 A 0.1 MAX. 1.3 ±0.1 10˚ MAX. M 2.4 ±0.15 ±0.11 A 0.15 MIN. 1) Lead width can be 0.6 max. in dambar area 3.15 2.65 2.13 0.9 0.2 1.15Pin 1 Manufacturer 2005, June Date code (YM)

BAS21... Edition 2006-02-01 Published by Infineon Technologies AG

81726 München, Germany

© Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.