BAR40AN3 CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 7

Technical content

Features

  • Very small conduction losses
  • Low forward voltage drop
  • Small plastic SMD package
  • Pb-free package

Applications

  • Ultra high-speed switching
  • V oltage clamping
  • Protection circuits
  • Blocking diodes Pinning Outline Description Pin BAR40 BAR40A BAR40C BAR40S

1 A K1 A1 A1

2 NC K2 A2 K2

3 K A1,A2 K1,K2 K1,A1

N.C. 1 2 3 3 SOT-23 1 2 (1) BAR40 (2)BAR40A Marking: Type Marking Code BAR40 N3 JV3 BAR40AN3 B6 (3)BAR40C (4)BAR40S BAR40CN3 5C BAR40SN3 LD3 Diode configuration and symbol

CYStech Electronics Corp. Spec. No. : C302N3 Issued Date : 2011.06.27 Revised Date : 2012.02.07 Page No. : 2/7 BAR40N3/BAR40AN3/BAR40CN3/BAR40SN3 CYStek Product Specification Absolute Maximum Ratings

  • Maximum Temperatures
  • Maximum Power Dissipation
  • Maximum V oltages and Currents (Ta=25°C) Note: for double diodes, Ptot is the total power dissipation of both diodes. Characteristics (Ta=25°C) Characteristic Symbol Condition Min. Max. Unit Reverse Breakdown V oltage VBR IR=100μA 40 - V VF(1) IF=1mA - 320 mV Forward V oltage (Note 1) VF(2) IF=40mA - 500 mV VF(3) IF=100mA - 550 mV Reverse Leakage Current (Note 2) IR VR=30V , Tj=25℃ - 200 nA Diode Capacitance CD VR=1V , f=1MHz - 10 pF Reverse Recovery Time trr IF=IR=10mA RL=100Ω measured at IR=1mA - 5 ns Notes: 1.pulse test, tp=380μs,duty cycle<2%. 2.pulse test, tp=5ms,duty cycle<2%.

CYStech Electronics Corp. Spec. No. : C302N3 Issued Date : 2011.06.27 Revised Date : 2012.02.07 Page No. : 3/7 BAR40N3/BAR40AN3/BAR40CN3/BAR40SN3 CYStek Product Specification Characteristic Curves Forward Current & Forward Voltage 100 150 200 250 0 200 400 600 800 1000 Forward Voltage-VF (mV) Forward Current-IF (mA) Diode Capacitance & Reverse-Biased Voltage 100 0.1 1 10 100 Reverse Biased Voltage-VR (V) Diode Capacitance-Cd (pF)

CYStech Electronics Corp. Spec. No. : C302N3 Issued Date : 2011.06.27 Revised Date : 2012.02.07 Page No. : 4/7 BAR40N3/BAR40AN3/BAR40CN3/BAR40SN3 CYStek Product Specification Recommended wave soldering condition Soldering Time Product Peak Temperature Pb-free devices 5 +1/-1 seconds 260 +0/-5 °C Recommended temperature profile for IR reflow Pb-free Assembly Profile feature Sn-Pb eutectic Assembly Average ramp-up rate 3°C/second max. 3°C/second max. (Tsmax to Tp) Preheat 100°C 150°C −Temperature Min(TS min) −Temperature Max(TS max) 150°C 200°C −Time(ts min to ts max) 60-120 seconds 60-180 seconds Time maintained above: −Temperature (TL) 183°C 217°C − Time (tL) 60-150 seconds 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak 10-30 seconds 20-40 seconds temperature(tp) Ramp down rate 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Time 25 °C to peak temperature Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C302N3 Issued Date : 2011.06.27 Revised Date : 2012.02.07 Page No. : 5/7 BAR40N3/BAR40AN3/BAR40CN3/BAR40SN3 CYStek Product Specification Recommended Footprint Inches Millimeters DIM Typ Typ A 0.039 1.0 B 0.039 1.0 C 0.079 2.0 D 0.035 0.9 E 0.031 0.8

CYStech Electronics Corp. Spec. No. : C302N3 Issued Date : 2011.06.27 Revised Date : 2012.02.07 Page No. : 6/7 BAR40N3/BAR40AN3/BAR40CN3/BAR40SN3 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C302N3 Issued Date : 2011.06.27 Revised Date : 2012.02.07 Page No. : 7/7 BAR40N3/BAR40AN3/BAR40CN3/BAR40SN3 CYStek Product Specification SOT-23 Dimension H JKD A L GV C B S Marking: Diagram: L4_XXX 3-Lead SOT-23 Plastic Surface Mounted Package. CYStek Package Code: N3

  • BAR40 N3: Single Diode. (Marking Code JV3)
  • BAR40AN3: Common Anode. (Marking Code B6)
  • BAR40CN3: Common Cathode. (Marking Code 5C)
  • BAR40SN3: Series Connected. (Marking Code LD3) *: Typical H 0.0005 0.0040 0.013 0.10 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:
  • Lead: Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.