BAP64-05W CYSTEKEC | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

Features

  • High voltage, current controlled
  • RF resistor for RF attenuators and switches
  • Low diode capacitance
  • Low diode forward resistance
  • Low series inductance
  • For applications up to 3GHz
  • For attenuators and switches Equivalent Circuit Outline SOT-323 A2 A1 K1, K2 1. Anode 1 2. Anode 2 3. Cathode 1 / Cathode 2 Absolute Maximum Ratings (Ta=25°C)
  • Maximum Temperatures
  • Maximum Power Dissipation
  • Maximum V oltages and Currents (Ta=25°C)

CYStech Electronics Corp. Spec. No. : C481S3 Issued Date : 2010.05.17 Revised Date : 2012.07.17 Page No. : 2/6 BAP64-05W CYStek Product Specification Characteristics (Ta=25°C) Characteristic Symbol Condition Min Typ Max Unit VR=175V - - 10 Reverse V oltage Leakage Current IR VR=20V - - 1 μA Forward V oltage VF IF=50mA - - 1.1 V VR=0V , f=1MHz - 0.52 - VR=1V , f=1MHz - 0.37 - Diode Capacitance CD VR=20V , f=1MHz - 0.23 0.35 pF IF=0.5mA, f=100MHz - 20 40 IF=1mA, f=100MHz - 10 20 IF=10mA, f=100MHz - 2 3.8 Diode Forward Resistance rD IF=100mA, f=100MHz - 0.7 1.35 Ω Charge Carrier Life Time τL when switched from IF=10mA to IR=6mA;RL= 100Ω, measured at IR=3mA - 1.55 - μs Series Inductance Ls IF=100mA, f=100MHz - 1.4 - nH

Ordering Information

Device Package Shipping Marking BAP64-05W SOT-323 (Pb-free) 3000 pcs / Tape & Reel 5W

CYStech Electronics Corp. Spec. No. : C481S3 Issued Date : 2010.05.17 Revised Date : 2012.07.17 Page No. : 3/6 BAP64-05W CYStek Product Specification Typical Characteristics

CYStech Electronics Corp. Spec. No. : C481S3 Issued Date : 2010.05.17 Revised Date : 2012.07.17 Page No. : 4/6 BAP64-05W CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C481S3 Issued Date : 2010.05.17 Revised Date : 2012.07.17 Page No. : 5/6 BAP64-05W CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C481S3 Issued Date : 2010.05.17 Revised Date : 2012.07.17 Page No. : 6/6 BAP64-05W CYStek Product Specification SOT-323 Dimension *: Typical Inches Millimeters Inches Millimeters DIM Min. Max. Min. Max. Marking: TE5W 3-Lead SOT-323 Plastic Surface Mounted Package CYStek Package Code: S3 Style : Pin 1. A1 2.A2 3. K1,K2 He E A Q Lp e bp D W B v A Z detail Z A C θ 0 12 scale mm DIM Min. Max. Min. Max. e 0.0472 0.0551 1.20 1.40 θ 0° 10° 0° 10° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: Pure tin plated.
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.