4N60 WXDH | Alldatasheet
Document overview
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Technical content
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4 Electrical Characteristics
4.1 Absolute Maximum Rating(Tc=25℃,unless otherwise noted)
/B4N60/D4N60 F4N60 MaximumDrian-SourceDCVoltage VDS 600 V MaximumGate-Drain Voltage VGS ±30 V DrainCurrent(continuous) ID(T=25℃) (T=100℃) 4 A 2.5 A DrainCurrent(Pulsed)(Note1) IDM 16 A Single PulseAvalancheEnergy(Note5) EAS 250 mJ PeakDiode Recovery dv/dt(Note6) dv/dt 5 V/ns TotalDissipation Ta=25℃ Ptot 2 2 W TC=25℃ Ptot 75 30 W JunctionTemperature Tj 150 ℃ storageTemperature Tstg -55~150 ℃ MaximumTemperatureforsoldering TL 300 ℃
4.2 Thermal Characteristics
/B4N60/D4N60 F4N60 ThermalResistanceJunction toCase-sink RthJC 1.67 4.17 ℃/W ThermalResistanceJunction toAmbient RthJA 62.5 62.5 ℃/W
1 Description
These N-channel Enhanced VDMOSFETs, is obtained by the self-aligned planar technology which reduce the conduction loss, improve switching performance and enhance the avalanche energy. Which accords with the RoHSstandard.
2 Features
- FastSwitching
- ESDImprovedCapability
- LowONResistance(Rdson≤2.5Ω)
- LowGate Charge(Typical Data:14.5nC)
- LowReverseTransferCapacitances(Typical:4pF)
- 100% SinglePulseAvalancheEnergyTest
- 100% ΔVDS Test
3 Applications
- usedinvarious powerswitching circuitforsystem miniaturization andhigher efficiency.
- Powerswitch circuitof electronballastand adaptor. VDSS=600V RDS(on) (TYP)=2.1Ω ID=4A TO-220C TO-220F TO-262 TO-263 TO-252B TO-251B
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4.3 Electrical Characteristics(Tc=25℃,unlessotherwise noted)
Parameter Symbol TestCondition Value UnitsMin Typ Max Off Characteristics Drain-source Breakdown Voltage BVDSS ID=250μA,VGS=0V 600 -- -- V Drain-to-Source Leakage Current IDSS VDS=600V,VGS=0V,TC=25℃ -- -- 1 μA VDS=480V,VGS=0V,TC=125℃ -- -- 100 μA Gate-to-Source Forward Leakage IGSSF VGS=+30V -- -- 100 nA Gate-to-Source ReverseLeakage IGSSR VGS=-30V -- -- -100 nA On Characteristics(Note3) Gatethresholdvoltage VGS(th) VDS=VGS,ID=250μA 2 -- 4 V Drain-source on Resist ance RDS(on) VGS=10V,ID=2A -- 2.1 2.5 Ω Dynamic Characteristics(Note4) Forward Transfer cond uctance gfs VDS=15V,ID=2A -- 3.5 -- S InputCapacitance Ciss VGS=0V,VDS=25V,f=1.0MHz -- 590 -- pFOutput Capacitance Coss -- 55 -- Reverse Transfer Cap acitance Crss -- 4 -- Switching Characteristics(note4) Turn-on Delay Time td(on) ID=4A, VDD=300V, RG=10Ω -- 14 -- nSTurn-onRiseTime tr -- 15 -- Turn-off Delay Time td(off) -- 34 -- Turn-offFallTime tf -- 13 -- TotalGate Charge Qg ID=4A,VDD=480V,VGS=10V -- 14.5 -- nCGate-to-Source Charge Qgs -- 2.6 -- Gate-to-Drain(“Miller”)C harge Qgd -- 6.5 -- Drain-Source Diode Characteristics Diode Forward Voltage (Note 3) VFSD VGS=0V,IS=4A -- -- 1.5 V Diode Forward Current (Note 2) IS -- -- 4 A ReverseRecoveryTime trr TJ=25℃,IF=4A, dIF/dt=100A/μS,VGS=0V -- 250 -- nS Reverse Recovery Charge Qrr -- 1000 -- nC Reverse Recovery Current IRRM -- 8.03 -- A Notes: 1:Repetitiverating,pulsewidthlimitedbymaximumjunctiontemperature. 2:SurfacemountedonFR4Board,t≤10sec. 3:Pulsewidth≤ 300μs,dutycycle≤2%. 4:Guaranteedbydesign,notsubjecttoproduction. 5.L=10mH,ID=7.1A,VDD=50V,VGATE=650V,StartTJ=25℃. 6.ISD=4A,di/dt≤100A/μs,VDD≤BVDSS,StartTJ=25℃.
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5 Typical characteristics diagrams
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5 Typical characteristics diagrams(continues)
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6 Typical Test Circuit and Waveform
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6 Typical Test Circuit and Waveform(continues)
7 Product Names Rules
With2Digital,ForExample: 60onbehalfof600V, 06onbehalfof60v SpecialFunctionCode Eonbehalfofbuild-inESD NothingonbehalfofnotESD Packaging Code 220F: F 220: Nothing 251: B 252: D 262: I 263: E RatedCurrentCode With1-2Digital, ForExample: 4onbehalfof4A, 10onbehalfof10A, 08onbehalfof0.8A ChannelPolarityCode NonbehalfofNchannel PonbehalfofPchannel FXXNEXX
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8 Product Specifications and Packaging Models
ProductModel PackageType Mark Name RoHS Package Quantity 4N60 TO-220C 4N60 Pb-free Tube 1000/box F4N60 TO-220F F4N60 Pb-free Tube 1000/box B4N60 TO-251 B4N60 Pb-free Tube 1000/box D4N60 TO-252 D4N60 Pb-free Tape & Reel 2500/box I4N60 TO-262 I4N60 Pb-free Tube 1000/box E4N60 TO-263 E4N60 Pb-free Tape & Reel 800/box
9 Dimensions
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9 Dimensions(continues)
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10 Attentions
ROUM SemiconductorTechnology CO.,LTD.reserves theright tochangethe specificationwithout prior notice!Thecustomershould obtainthe latestversionofthe informationbefore makingthe orderandverify thatthe informationiscomplete and up todate. Itis the responsibility ofthe purchaserforany failure orfailure ofany semiconductorproduct under certain conditions.Itisthe responsibilityofthe purchasertocomply with safetystandards andto take safety measuresin the system designandmachinemanufacturing of Romaproducts in order to avoidpotentialrisk offailure.Injuryorpropertydamage. Productpromotion isendless,ourcompany willbe dedicated toprovidecustomerswith better products.
11 Appendix
Revision history: Date REV. Description Page 2017.05.14 1.0 Original