B320 FUJI | Alldatasheet
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3 AMP SURFACE MOUNT SCHOTTKY
e For surface mount applications ¢ Metal semiconductor junction with guard ring e Epitaxial construction e Low forward voltage drop Hf Outline Drawing e UL recognized 94V-O plastic material * Lead solderable per MIL-STD-202 Method 208 | SMC za: i ¢ Surge overload rating to 100A peak il 2451822) 220(5. 56) HB Mechanical Data pom . ci © Case: Molded plastic (ee) =p grata e Polarity: Indicated on cathode i : . -103(2.62) i ¢ Weight: 0.007 ounces, 0.21 grams ‘ream f = —) t = ==) 00824 ' ' 305(7.75) Dimensions in inches and (millimeters) i Maximum Ratings & Characteristics @ Ratings at 25° C ambient temperature unless otherwise specified @ Single phase, half wave, 60HZz, resistive or inductive load © For capacitive load, derate current by 20% |_Maximum DC Blocking Voltage | Voc | 20 [ 30 | 40 | so | 60 Maximum Average Forward Output Current fj 30 A (av) . 375" 9.5mm lead length @M-110°C Peak Forward Surge Current 8.3 ms Single Half-Sine-Wave 100 A Superimposed On Rated Load Maximum Reverse Current At Rated @ TA=25°C irk 05 mA DC Blocking Voltage per Bridge Element @Ta=100°C | 20 ma | 300 _ Typical Thermal Resistance** (See Note) 10 Maximum Thermal Resistance"*(See Note) 50 B50 125 |_Storage Temperature Range Tere [85 t0 +150 __[ | Note: *Measured at 1.0 MHZ and applied reverse voltage of 4.0V DC “Thermal resistance junction to lead/ambient measured on PC board 8mm? X (0.013mm thick) Collmer Semiconductor, Inc.