B220 FUJI | Alldatasheet
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2 AMP RFEACE MOUNT SCHOTTKY
e For surface mount applications ¢ Metal semiconductor junction with guard ring e Epitaxial construction . ¢ Low forward voltage drop HH Outline Drawing e UL recognized 94V-O plastic material e Lead solderable per MIL-STD-202 Method 208 SMB wna2y 7 m9) ¢ Surge overload rating to 50A peak it | a8 i Hi Mechanical Data 1 ; | — sg6g3 —4 © Case: Molded plastic ae ¢ Polarity: Indicated on cathode tT i[ e Weight: 0.003 ounces, 0.093 grams tmae RO BB | en Dimensions in inches and (millimeters) Hi Maximum Ratings & Characteristics © Ratings at 25° C ambient temperature unless otherwise specified © Single phase, half wave, 60Hz, resistive or inductive load © For capacitive load, derate current by 20% T8230 8240 [8250] 8260] Units | | Maximum Recurrent Peak Reverse Voltage | Varw | 20 | 30 «| 40 =| 50 | =O, SVC | Maximum RMS input Voltage | Ves | 14 ||| S| S| | Maximum DC BlockingVoltage | Voc [20 | aT 4 | TCC Maximum Average Forward Output Current la | .375" 9.5mm lead length @ T= 100°C “ | Peak Forward Surge Current | 8.3 ms Single Half-Sine-Wave A | Superimposed On Rated Load | Maximum Reverse Current At Rated @ Ta = 25°C 0.5 mA DC Blocking Voltage per Bridge Element @ Ta= 100°C 20 mA |_ Typical Junction Capacitance* (See Note) [Cy [209 | Maximum Thermal Resistance’*(SeeNotey [Romy | 0 SSSSC~«~ | Operating TemperatureRange Tt |B HSSCS~*C CY Note: *Measured at 1.0 MHZ and applied reverse voltage of 4.0V DC “Thermal resistance junction to lead, measured on PC board 5mm? X (0.013mm thick) Collmer Semiconductor, Inc.