B1412

2SB1412 FOSHAN | Alldatasheet

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R e v . E M a y . - 2 0 1 6 DATA SHEET http://www.fsbrec.com 1 / 6 TO-252 塑封封装 PNP 半导体三极管。Silicon PNP transistor in a TO-252 Plastic Package. 饱和压降低,极好的直流电流增益特性，与 2SD2118 互补。 Low VCE(sat),excellent DC current gain characteristics, complements the 2SD2118. 用于中功率放大。 Medium power amplifier applications. PIN1：Base PIN 2,4 ：Collector PIN 3 ：Emitter 放大及印章代码 / h FE Classifications & Marking 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g hFE Classifications Symbol P Q R hFE Range 82～180 120 ～270 180 ～390 2 1

R e v . E M a y . - 2 0 1 6 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO -30 V Collector to Emitter Voltage VCEO -20 V Emitter to Base Voltage V EBO -6.0 V Collector Current - Continuous I C -5 A Peak Collector Current – Continuous I CM -10 A Collector Power Dissipation P C 1.0 W Collector Power Dissipation* *PC(Tc=25℃) 10 W Junction Temperature Tj 150 ℃ Storage Temperature Range Tstg -55～150 ℃ *mounted On40×40×0.7mm ceramic board. 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 Min 典型值 Typ 最大值 Max 单位 Unit Collector to Base Breakdown Voltage VCBO IC=-50μA IE=0 -30 V Collector to Emitter Breakdown Voltage VCEO IC=-1.0mA IB=0 -20 V Emitter to Base Breakdown Voltage V EBO IE=-50μA IC=0 -6.0 V Collector Cut-Off Current I CBO V CB=-20V IE=0 -0.5 μA Emitter Cut-Off Current I EBO V EB=-5.0V IC=0 -0.5 μA DC Current Gain h FE V CE=-2.0V IC=-0.5A 82 390 Collector to Emitter Saturation Voltage* *VCE(sat) IC=-4.0A IB=-0.1A -1.0 V Transition Frequency f T VCE=-6.0V IC=-50mA f=30MHz 120 MHz Collector output capacitance C ob VCB=-20V IE=0 f=1.0MHz 60 pF *:measured using pulse current. *:脉冲测试 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)

R e v . E M a y . - 2 0 1 6 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve

R e v . E M a y . - 2 0 1 6 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions

R e v . E M a y . - 2 0 1 6 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions 说明： BR： 为公司代码 B1412：  为型号代码 P :   为 h FE 分档代码 Note: BR:   Company Code B1412:  Product Type. P:  h FE Classifications Symbol **:  Lot No. Code, code change with Lot No. BR ** B1412 P

R e v . E M a y . - 2 0 1 6 DATA SHEET http://www.fsbrec.com 6 / 6 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 时间：10±1 sec. Temp.:260±5 ℃ Time:10±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / R E E L Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 TO-252 2,500 2 5,000 5 25,000 13〞×16 360×360×50 385×257×392 套管包装 / T U B E Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm Units/Tube 只/套管 Tubes/Inner Box 套管/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Tube 套管 Inner Box 盒 Outer Box 箱 TO-251/252 75 48 3,600 5 18,000 526×20.5×5.25 555×164×50 575×290×180 使用说明 / N o t i c e s