ASD723S2 CYSTEKEC | Alldatasheet

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CYStech Electronics Corp. Spec. No. : C343S2 Issued Date : 2009.03.17 Revised Date :2009.04.30 Page No. : 1/6 ASD723S2 CYStek Product Specification Advanced Schottky Barrier Diodes A S D 7 2 3 S 2 Features:

  • L o w t u r n - o n v o l t a g e
  • Fast switching
  • Pb-free package Mechanical data:
  • Case: Molded Plastic, JEDEC SOD-323.
  • Terminals : Pure tin plated, solderable per MIL-STD-750, method 2026.
  • Polarity: Indicated by cathode band
  • Mounting position: Any
  • Weight: 4.8mg (approximately) S y m b o l O u t l i n e SOD-323 ASD723S2 Absolute Maximum Ratings(Ta=25℃) Characteristics Symbol Value Unit Non-repetitive Peak Reverse Voltage VRM 30 V Forward Current IFM 200 mA Forward Surge Current @ 8.3ms single half sine-wave superimposed on rated load(JEDEC method) IFSM 1 A Power dissipation @ TC=25°C PD 250 mW Thermal Resistance, Junction to ambient RθJA 500 °C/W Capacitance between Terminals @ f=1MHz and applied 10VDC Reverse Voltage CT 15 pF Operating Junction and Storage Temperature Range Tj, Tstg -65 to +150 °C

CYStech Electronics Corp. Spec. No. : C343S2 Issued Date : 2009.03.17 Revised Date :2009.04.30 Page No. : 2/6 ASD723S2 CYStek Product Specification Electrical Characteristics ( TA=25°C, unless otherwise noted) Parameter Condition Symbol Min Typ Max Unit Reverse Breakdown IR=100μA VR 30 - - V IF = 2mA - 260 - IF = 15mA - 320 - IF = 100mA - 420 - *Forward V oltage IF = 200mA VF - 490 550 mV Reverse Current VR = 30V IR - - 5 μA *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%

Ordering Information

Device Package Shipping Marking ASD723S2 SOD-323 (Pb-free package) 3000 pcs / Tape & Reel S21 Moisture Sensitivity Level : conform to JEDEC level 1 Recommended Storage Condition: Temperature : ≤ 30 °C Humidity : ≤ 85% RH Floor Life : unlimited

CYStech Electronics Corp. Spec. No. : C343S2 Issued Date : 2009.03.17 Revised Date :2009.04.30 Page No. : 3/6 ASD723S2 CYStek Product Specification Characteristic Curves

CYStech Electronics Corp. Spec. No. : C343S2 Issued Date : 2009.03.17 Revised Date :2009.04.30 Page No. : 4/6 ASD723S2 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C343S2 Issued Date : 2009.03.17 Revised Date :2009.04.30 Page No. : 5/6 ASD723S2 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C343S2 Issued Date : 2009.03.17 Revised Date :2009.04.30 Page No. : 6/6 ASD723S2 CYStek Product Specification SOD-323 Dimension *: Typical Inches Millimeters Inches Millimeters DIM Min. Max. Min. Max. Marking:

5 HS21

CYStek Package Code: S2 Style: Pin 1.Cathode 2.Anode D A H J K C E B 1 2 DIM Min. Max. Min. Max. Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material:

  • Lead: 42 Alloy ;pure tin plated
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.