AS5162 AMSCO | Alldatasheet
Document overview
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- PDF pages: 37
Technical content
Datasheet sections
- 1 General Description
- 2 Key Features
- 3 Benefits
- 4 Applications
- 5 Pin Assignments
- 5.1 Pin Descriptions
- 6 Absolute Maximum Ratings
- 7 Electrical Characteristics
- 7.1 Operating Conditions
- 7.2 Magnetic Input Specification
- 7.3 Electrical System Specifications
- 7.4 Timing Characteristics
- 7.5 Power Management - Supply Monitor
- 8 Detailed Description
- 8.1 Operation
- 8.1.1 VDD Voltage Monitor
- 8.2 Analog Output
- 8.2.1 Programming Parameters
- 8.2.2 Application Specific Angular Range Programming
- 8.2.3 Application Specific Programming of the Break Point
- 8.2.4 Full Scale Mode
- 8.2.5 Multiple Slope Output
- 8.2.6 Linearization of the Output
- 8.2.7 Resolution of Parameters
- 8.2.8 Analog Output Diagnostic Mode
- 8.2.9 Analog Output Driver Parameters
- 8.2.10 Noise Suppressor
- 8.2.11 Hysteresis Function
- 9 Application Information
- 9.1 Recommended Application Schematic
- 9.2 Programming the AS5162
- 9.2.1 UART Interface for Programming
- 9.2.2 Frame Organization
- 9.2.3 WRITE (Command Description)
- 9.2.4 READ (Command Description)
- 9.2.5 Baud-rate Automatic Detection
- 9.2.6 Baud-rate Manual Setting (optional)
- 9.3 OTP Programming Data
- 9.4 READ / WRITE Register Map
- 9.5 READ Only Register Map
- 9.6 Special Registers
- 9.7 Programming Procedure
- 10 Package Drawings and Markings
- 11 Ordering Information
www.ams.com high performance needs great design. Datasheet: AS5162 12-Bit Magnetic Angle Position Sensor Please be patient while we update our brand image as austriamicrosystems and TAOS are now ams.
1 General Description
class automotive protection features in a single device. the supply pins are protected against reverse polarity up to –20V. Figure 1. Typical Arrangement of AS5162 and magnet
2 Key Features
Small Pb-free package: SOIC 8.
3 B e n e f i t s
4 Applications
height level, pedal position sensing and contactless potentiometers.
Figure 2. AS5162 Block Diagram
5 Pin Assignments
Figure 3. SOIC-8 Pin Configuration
5.1 Pin Descriptions
Table 1. SOIC-8 Pin Descriptions 1 VDD Supply pin Positive supply pin. This pin is over voltage protected. multi purpose pin Test pin for fabrication. Connected to ground in the application board.
3 VDD3V3 AIO Output of the internal voltage regulator
4 GND Supply pin Ground pin. Connected to ground in the application. multi purpose pin Test pin for fabrication. Connected to ground in the application board. multi purpose pin Test pin for fabrication. Open in the application. 7S A I O Test pin for fabrication. Connected to OUT in the application board. multi purpose pin Output pin analog output. Over this pin the programming is possible.
6 Absolute Maximum Ratings
maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings
7 Electrical Characteristics
7.1 Operating Conditions
7.2 Magnetic Input Specification
TAMB = -40 to +150ºC, VDD = 4.5 to 5.5V (5V operation), unless otherwise noted. Table 3. Operating Conditions Table 4. Magnetic Input Specification magnet. Including Eccentricity.
7.3 Electrical Syst em Specifications
TAMB = -40 to +150ºC, VDD = 4.5 - 5.5V (5V operation), Magnetic Input Specification, unless otherwise noted. Figure 4. Power-up timing Diagram Table 5. Electrical System Specifications
7.4 Timing Characteristics
7.5 Power Management - Supply Monitor
Table 6. Timing Conditions Table 7. Power Management - Supply Monitor Conditions
Datasheet - Detailed Description www.ams.com Revision 1.3 9 - 36
8 Detailed Description
The AS5162 is manufactured in a CMOS process and uses a spinning current Hall technology for sensing the magnetic field distribution across the surface of the chip. The integrated Hall elements are placed around the center of the device and deliver a voltage representation of the magnetic field at the surface of the IC. Through Sigma-Delta Analog / Digital Conversion and Digital Signal-Processing (DSP) algorithms, the AS5162 provides accurate high-resolution absolute angular position information. For this purpose a Coordinate Rotation Digital Computer (CORDIC) calculates the angle and the magnitude of the Hall array signals. The DSP is also used to provide digital information at the outputs that indicate movements of the used magnet towards or away from the device’s surface. A small low cost diametrically magnetized (two-pole) standard magnet provides the angular position information. The AS5162 senses the orientation of the magnetic field and calculates a 14-bit binary code. This code is mapped to a programmable output characteristic in analog voltage format. This signal is available at the pin (OUT). The application angular region can be programmed in a user friendly way. The start angle position T1 and the end point T2 can be set and programmed according the mechanical range of the application with a resolution of 14 bits. In addition the T1Y and T2Y parameter can be set and programmed according the application. The transition point 0 to 360 degree can be shifted using the break point parameter BP. The voltage for clamping level low CLL and clamping level high CLH can be programmed with a resolution of 9 bits. Both levels are individually adjustable. Two additional linearization points can be used to improve the system linearity. These points C1 and C2 are programmable. The output parameters can be programmed in an OTP register. No additional voltage is required to program the AS5162. The setting may be overwritten at any time and will be reset to default when power is cycled. To make the setting permanent, the OTP register must be programmed by using a lock bit the content could be frozen for ever. The AS5162 is tolerant to magnet misalignment and unwanted external magnetic fields due to differential measurement technique and Hall sensor conditioning circuitry.
8.1 Operation
8.1.1 VDD Voltage Monitor
VDD Over Voltage Management. If the supply voltage at pin VDD exceeds the over-voltage upper threshold for longer than the detection time the output is turned off. When the over voltage event has passed and the voltage applied to pin VDD falls below the over-voltage lower threshold for longer than the recovery time the device enters the normal mode and the output is enabled. VDD Under Voltage Management. When the voltage applied to the VDD pin falls below the under-voltage lower threshold for longer than the detection time the output is turned off. When the voltage applied to the VDD pin exceeds the under-voltage upper threshold for longer than the detection time the device enters the normal mode and the output is enabled.
8.2 Analog Output
By default (after programmed CUST_LOCK OTP bit) the analog output mode is selected. The pin OUT provides an analog voltage that is proportional to the angle of the rotating magnet and ratiometric to the supply voltage VDD. It can source or sink currents up in normal operation. A short circuit protection is in place and will switch the output driver in high Z in case of an overload event. Due to an intelligent approach a permanent short circuit will not damage the device. This is also feasible in a high voltage condition up to 20 V and at the highest specified ambient temperature. After the digital signal processing (DSP) a 12-bit Digital-to-Analog converter and output stage provides the output signal. The DSP maps the application range to the output characteristic. An inversion of the slope is also programmable to allow inversion of the rotation direction. The reference voltage for the Digital-to-Analog converter (DAC) is taken from VDD. In this mode, the output voltage is ratiometric to the supply voltage. An on-chip diagnostic feature handles the error state at the output. Depending on the failure the output is in HiZ condition or is driven in the failure band. (see Table 9).
8.2.1 Programming Parameters
written into the AS5162 128 bit OTP memory.
8.2.2 Application Specific Angular Range Programming
CLL and CLH can be programmed independent from the T1 and T2 position and both levels can be separately adjusted. Figure 5. Programming of an Individual Application Range can be set independently form each other.
8.2.3 Application Specific Pr ogramming of the Break Point
such a case the default transition point must be shifted out of the application range. The parameter BP defines the new position. Figure 6. Individual Programming of the Break Point BP
8.2.4 Full Scale Mode
Figure 7. Full Scale Mode feasible due to saturation effects of the output stage transistors. The actual curve will be rounded towards the supply rails (as indicated Figure 7).
8.2.5 Multiple Slope Output
Figure 8. Two Slope Mode Figure 9. Four Slope Mode
8.2.6 Linearization of the Output
To improve the system linearity an additional 2 point linearization function is implemented in the AS5162. Figure 10. Linearization of the Output Characteristic
8.2.7 Resolution of Parameters
The programming parameters have a wide resolution of up to 14 bits. Table 8. Resolution of the Programming Parameters
8.2.8 Analog Output Diagnostic Mode
application related failures. For efficient use of diagnostics, it is recommended to program to clamping levels CLL and CLH.
8.2.9 Analog Output Driver Parameters
The output stage is configured in a push-pull output. Therefore it is possible to sink and source currents.
- This parameter will be finally defined after temperature characterisation.
- Design target for this value is reduced.
Table 9. Different Failure Cases of AS5162 Table 10. General Parameters for the Output Driver
8.2.10 Noise Suppressor
reduce the noise level down to 1 LSB peak to peak over different programing ranges. 4 possible configurations of the noise suppressor can be selected via the OTP bits FILTERCFG<1:0>.
8.2.11 Hysteresis Function
The hysteresis amplitude can be selected via the OTP bits HYSTSEL<1:0>.
9 Application Information
9.1 Recommended Application Schematic
Figure 12. Recommended Schematic in Pull-Down Configuration
Figure 13. Recommended Schematic in Pull-Up Configuration Table 11. External Components
9.2 Programming the AS5162
additional programming voltage is needed. The internal LDO provides the current for programming. regions are independently lockable by build in lock bits. a programmed bit from “1” to “0”, multiple OTP writes are possible, as long as only unprogrammed “0”-bits are programmed to “1”. if the user lock bit is not programmed. A standard half duplex UART protocol is used to exchange data with the device in the communication mode.
9.2.1 UART Interface for Programming
(optional). Every start bit is used for synchronisation. A time out function detects not complete commands and resets the AS5162 UART after the timeout period.
9.2.2 Frame Organization
AS5162 can operate in slave communication or master communication mode. In the slave communication mode the AS5162 receives the data. the frame format. The single communication line can be pulled down by the AS5162. Figure 14. General UART Frame Table 12. Bit Timing
frame and the command frame. Figure 15. Synchronization Frame Figure 16. Address and Command Frame parity error command is not executed.
- In case of Write command the request is followed by the frames containing the data to write.
- In case of Read command the communication direction will change and the AS5162 will answer with the frames containing the
Table 13. Possible Commands
6 R/Wn parstart stopAD
9.2.3 WRITE (Command Description)
Figure 17. Full Write Command Writing the AS5162 KEY in the fuse register (address 0x41) triggers the transfer of the data from the OTP RAM into the Poly Fuse cell. Writing the AS5162 KEY in the Pass2Func Register (address 0x60) forces the device into normal mode.
9.2.4 READ (Command Description)
Figure 18. Full Read Command
9.2.5 Baud-rate Automatic Detection
used after the synchronization byte to decode the following frame and to transmit the answer and it is stored in the BAUDREG register.
9.2.6 Baud-rate Manual Setting (optional)
Figure 19. Manual Baud-rate Setting Figure 20. Simple Read and Write
00 MSB
1 MSB
0 MSB
9.3 OTP Programming Data
Table 14. OTP Memory Map
2 CUSTID<0> 0
3 CUSTID<1> 0
4 CUSTID<2> 0
5 CUSTID<3> 0
6 CUSTID<4> 0
7 CUSTID<5> 0
0 CUSTID<6> 0
1 Y1LIN<0> 0 First linearization point (Y-axis)
0 CLL<0> 0
1 CLL<1> 0
2 CLL<2> 0
3 CLL<3> 0
4 CLL<4> 0
5 CLL<5> 0
6 CLL<6> 0
7 CLL<7> 0
0 CLL<8> 0
1 OFFSET<0> 0
2 OFFSET<1> 0
3 OFFSET<2> 0
4 OFFSET<3> 0
5 OFFSET<4> 0
6 OFFSET<5> 0
7 OFFSET<6> 0
0 OFFSET<7> 0
1 OFFSET<8> 0
2 OFFSET<9> 0
3 OFFSET<10> 0
4 OFFSET<11> 0
5 OFFSET<12> 0
6 OFFSET<13> 0
7 OFFSET<14> 0
0 OFFSET<15> 0
1 OFFSET<16> 0
2 OFFSET<17> 0
3 OFFSET<18> 0
4 OFFSET<19> 0
7 GAIN<10> 0
1 GAIN<12> 0
2 GAIN<13> 0
3 GAIN<14> 0
4 GAIN<15> 0
5 GAIN<16> 0
6 BP<0> 0
7 BP<1> 0
0 BP<2> 0
1 BP<3> 0
2 BP<4> 0
3 BP<5> 0
4 BP<6> 0
5 BP<7> 0
6 BP<8> 0
7 BP<9> 0
0 BP<10> 0
1 BP<11> 0
2 BP<12> 0
3 BP<13> 0
4 ANGLERNG 0
6 QUADEN<0> 0 Quadrant Mode Enable
7 QUADEN<1> 0
0 AIRGAPSEL 0 Magnetic input range extension
1 HYSTSEL<0> 0 Hysteresis selection
3 FILTERCFG<0> 0 Filter Configuration
5 Not used 0
6 Not used 0
7 Not used 0
7 CUST_LOCK 0 Lock bit for Customer Area
9.4 READ / WRITE Register Map
Table 15. Read / Write Registers
0 BAUDREG<0> 0
1 BAUDREG<1> 0
2 BAUDREG<2> 0
3 BAUDREG<3> 0
4 BAUDREG<4> 0
5 BAUDREG<5> 0
6 BAUDREG<6> 0
7 BAUDREG<7> 0
0 BAUDREG<8> 0
1 Not used 0
2 Not used 0
3 Not used 0
4 Not used 0
0 DAC12IN<8> 0
1 DAC12IN<9> 0
2 DAC12IN<10> 0
3 DAC12IN<11> 0
4 DAC12INSEL 0 DAC12 buffer selection
5 R1K10K<0> 0 Selection of the reference resistance
7 DSPRN 0 Resetn of the Digital Signal Processing
0 DAC12IN<0> 0
1 DAC12IN<1> 0
2 DAC12IN<2> 0
3 DAC12IN<3> 0
4 DAC12IN<4> 0
5 DAC12IN<5> 0
6 DAC12IN<6> 0
7 DAC12IN<7> 0
9.5 READ Only Register Map
Table 16. Read Only Registers
0 Not used 0 A read command returns 0
1 OFFSETFINISHED 0 Offset compensation finished
2 AGCFINISHED 0 AGC loop compensation finished
3 CORDICOVF 0 Overflow of the Cordic
4 AGCALARML 0 AGC loop saturation because of B field
5 AGCALARMH 0 AGC loop saturation because of B field
7 PARITY_ERR 0 UART parity error flag
0 CORDICOUT<0> 0
1 CORDICOUT<1> 0
2 CORDICOUT<2> 0
3 CORDICOUT<3> 0
4 CORDICOUT<4> 0
5 CORDICOUT<5> 0
6 CORDICOUT<6> 0
7 CORDICOUT<7> 0
0 CORDICOUT<8> 0
1 CORDICOUT<9> 0
2 CORDICOUT<10> 0
3 CORDICOUT<11> 0
4 CORDICOUT<12> 0
5 CORDICOUT<13> 0
6 Not used 0 A read command returns all data bits
2 DSPOUT<10> 0
3 DSPOUT<11> 0
0 AGCVALUE<0> 0
1 AGCVALUE<1> 0
2 AGCVALUE<2> 0
3 AGCVALUE<3> 0
4 AGCVALUE<4> 0
5 AGCVALUE<5> 0
6 AGCVALUE<6> 0
7 AGCVALUE<7> 0
0 Not used 0
9.6 Special Registers
Table 17. Special Registers
0 AS5162KEY<0> 0
1 AS5162KEY<1> 0
2 AS5162KEY<2> 0
3 AS5162KEY<3> 0
4 AS5162KEY<4> 0
5 AS5162KEY<5> 0
6 AS5162KEY<6> 0
7 AS5162KEY<7> 0
0 AS5162KEY<8> 0
1 AS5162KEY<9> 0
2 AS5162KEY<10> 0
3 AS5162KEY<11> 0
4 AS5162KEY<12> 0
5 AS5162KEY<13> 0
6 AS5162KEY<14> 0
7 AS5162KEY<15> 0
Datasheet - Application Information www.ams.com Revision 1.3 31 - 36
9.7 Programming Procedure
Pull-up on out pin VDD=5V Wait 10ms (after the startup time device enters communication mode) Write command: Trimming bits are written in the OTP RAM Read command: All the trimming bits are read back to check the correctness of the writing procedure. Write AS5162KEY in the Fuse register: The OTP RAM content is permanently transferred into the Poly Fuse cells. Wait 10 ms (fuse time) Write command, R1K_10K<1:0>=(11)b: Poly Fuse cells are downloaded into the RAM memory using a 10K resistance as reference. Wait 5 ms (download time) Read R1K_10K register, the expected value is 00b Write command, R1K_10K<1:0>=(11)b Read R1K_10K register, the expected value is (11)b. NB: Step11 and Step12 have to be consecutive. Read command: all the fused bits downloaded with 10K resistance are read back. Write command, R1K_10K=<1:0>=(10)b: Poly Fuse cells are downloaded into the RAM memory using a 1K resistance as reference. Wait 5 ms (download time) Read R1K_10K register, the expected value is (00)b Write command register, R1K_10K<1:0>=(10)b Read R1K_10K register, the expected value is (10)b NB: Step18 and Step19 have to be consecutive. Read command: All the fused bits downloaded with 1K resistance are read back. Check that read commands at Steps 5, 13 and 19 are matching Write AS5162KEY in the Pass2Func register: Device enters normal mode.
The device is available in a SOIC 8 - Lead 150 MIL Package. Figure 21. Package Drawings and Dimensions
- Dimensions and tolerancing confirm to ASME Y14.5M-1994.
- All dimensions are in miilimeters. Angles are in degrees.
Figure 22. Vertical Cross Section of SOIC-8
- Die thickness 356 μm nom.
- Adhesive thickness 20 ± 10 μm.
- Lead frame downest 200 ± 25 μm.
- Lead frame thickness 200 ± 8 μm.
Datasheet - Revision History www.ams.com Revision 1.3 34 - 36
Revision History
Note: Typos may not be explicitly mentioned under revision history. Revision Date Owner Description
1.0 Aug 23, 2012 REi Initial revision
1.1 Sep 13, 2012
Updated General Description, Applications, Figure 2, Table 7, Table 10 and Section 9.2.1
1.2 Oct 30, 2012 Updated Table 2
1.3 Oct 31, 2012 Updated Table 1, Table 2, Table 10, Figure 3, Figure 12 and Figure 13
The devices are available as the standard products shown in Table 18. Note: All products are RoHS compliant and ams green. Table 18. Ordering Information
www.ams.com Revision 1.3 36 - 36 Copyrights Copyright © 1997-2012, ams AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies. Disclaimer Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location. The information furnished here by ams AG is believed to be correct and accurate. However, ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. Contact Information Headquarters ams AG Tobelbaderstrasse 30 A-8141 Unterpremstaetten, Austria Tel : +43 (0) 3136 500 0 Fax : +43 (0) 3136 525 01 For Sales Offices, Distributors and Representatives, please visit: http://www.ams.com/contact