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[v1-01] 2015-May-12 Document Feedback AS5147P 14-Bit On-Axis Magnetic Rotary Position Sensor with 12-Bit Binary Incremental Pulse Count and for 28krpm High Speed Capability The AS5147P is a high-resolution rotary position sensor for high speed (up to 28krpm) angle measurement over a full 360 degree range. This new position sensor is equipped with a revolutionary integrated dynamic angle error compensation (DAEC™) with almost 0 latency. The robust design of the device suppresses the influence of any homogenous external stray magnetic field. A standard 4-wire SPI serial interface allows a host microcontroller to read 14-bit absolute angle position data fr om the AS5147P and to program non-volatile settings without a dedicated programmer. Incremental movements are indicated on a set of ABI signals with a maximum resolution of 4096 steps / 1024 pulses per revolution. The resolution of ABI signal is programmable to 4096 steps / 1024 pulses per revolution, 2048steps / 512 pulses per revolution or 1024steps / 256 pulses per revolution. Brushless DC (BLDC) motors are controlled through a standard UVW commutation interface with a programmable number of pole pairs from 1 to 7. The ab solute angle position is also provided as PWM-encoded output signal The AS5147P supports embedded self-diagnostics including magnetic field strength too high, magnetic field strength too low or lost magnet, and other related diagnostic features. The product is defined as SEooC (Safety Element out of Context) according ISO26262 including FM EDA, safety manual and third party qualification. The AS5147P is available as a single die in a compact 14-pin TSSOP package. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of this device are listed below: Figure 1: Added Value of Using the AS5147P Benefits Features High speed application Up to 28krpm Easy to use – saving costs on DSP DAE C™ Dynamic angle error compensation General Description
Document Feedback [v1-01] 2015-May-12 AS5147P − General Description
Applications
The AS5147P has been designed to support BLDC motor commutation for the most challenging automotive applications (AEC-Q100 grade 0 au tomotive qualified) such as electric power steering (EPS), tr ansmission (gearbox, actuator), pump, brake (actuator) and starter & alternator. Block Diagram The functional blocks of this device for reference are shown below: Figure 2: AS5147P Block Diagram Good resolution for motor & position control 14-bit core resolution Versatile choice of the interface Independent output interfaces: SPI, ABI, UVW, PWM No programmer needed (via SPI command) Zero position, configuration programmable Supports safety challenging applications Self-Diagnostics Lower system costs (no shielding) Immune to external stray field Benefits Features VDD3V3 A/D Volatile Memory SPI LDO AS5147P VDD GND CSn MOSI SCL MISO I/PWM A B W / PWM U V Analog Front-End UWVATAN (CORDIC) AGC OTP INTERPOLATOR Hall Sensors PWM Decoder Selectable on I or W ABI Dynamic Angle Error Compensation
[v1-01] 2015-May-12 Document Feedback AS5147P − Pin Assignment Figure 3: TSSOP-14 Pin Assignment Figure 4: Pin Description Pin Number Pin Name Pin Type Description
1 CSn Digital input SPI chip select (active low)
2C L K D i g i t a l i n p u t S P I c l o c k
3 MISO Digital output SPI master data input, slave output
4 MOSI Digital input SPI master data output, slave input
5 Test Test pin (connect to ground)
6 B Digital output Incremental signal B
7 A Digital output Incremental signal A
B A I / PWM GND VDD3V VDD U V W / PWM
Document Feedback [v1-01] 2015-May-12 AS5147P − Pin Assignment Note(s) and/or Footnote(s): 1. Floating state of a digital input is not allowed. 2. If SPI is not used, a Pull up resistor on CSn is required. 3. If SPI is not used, a Pull down re sistor on CLK and MOSI is required. 4. If SPI is not used, the pin MISO can be left open. 5. If ABI, UVW or PWM is not used, the pins can be left open.
8 W/PWM Digital output Commutation signal W or PWM-encoded output
9 V Digital output Commutation signal V
10 U Digital output Commutation signal U
11 VDD Power supply 5V power supply voltage for on-chip regulator
12 VDD3V3 Power supply 3.3V on-chip low-dropout (LDO) output. Requires an external decoupling capacitor (1μF)
13 GND Power supply Ground
14 I Digital output Incremental signal I (index) or PWM
Pin Number Pin Name Pin Type Description
[v1-01] 2015-May-12 Document Feedback AS5147P − Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Electrical Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units Note VDD5 DC supply voltage at VDD pin -0.3 7.0 V VDD3 DC supply voltage at VDD3V3 pin -0.3 5.0 V VSS DC supply voltage at GND pin -0.3 0.3 V Vin Input pin voltage VDD+0.3 V Iscr Input current (latch-up immunity) -100 100 mA Norm: AEC-Q100-004 ESD Electrostatic discharge ±2 kV Norm: AEC-Q100-002 Pt Total power dissipation (all supplies and outputs) 150 mW Ta5V0 Ambient temperature 5V0 -40 150 °C In the 5.0V power supply mode only Ta3V3 Ambient temperature 3V3 -40 125 °C In the 3.3V power supply mode if NOISESET = 0 TaProg Programming Temperature 5 45 °C Programming @ Roomtemperature (25°C ± 20°C) Tstrg Storage temperature -55 150 °C Tbody Package body temperature 260 °C Norm: IPC/JEDEC J-STD-020 RHNC Relative Humidity non-condensing 58 5% MSL Moisture sensitivity level 3 Represents a maximum floor lifetime of 168h Absolute Maximum Ratings
Document Feedback [v1-01] 2015-May-12 AS5147P − Electrical Characteristics All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. Figure 6:
Electrical Characteristics
Symbol Parameter Conditions Min Typ Max Units VDD Positive supply voltage 5.0V operation mode 4.5 5.0 5.5 V VDD3V3 Positive supply voltage 3.3V operation mode; only from -40 to 125°C 3.0 3.3 3.6 V VDD3V3_150 Positive supply voltage 3.3V operation mode; only from -40 to 150°C (3V150°C Bit has to be set) 3.0 3.3 3.6 V VDD_Burn Positive supply voltage Supply voltage required for programming in 3.3V operation 3.3 3.5 V V REG Regulated Voltage Voltage at VDD3V3 pin if VDD ≠ VDD3V3 3.2 3.4 3.6 V VporON Internal POR-ON level 3V operation. Pin VDD5 & VDD3 shorted 2.3 2.85 V V porOFF Internal POR-OFF level 3V operation. Pin VDD5 & VDD3 shorted 2.05 2.65 V V porh Internal POR hysteresis 150 300 mV IDD Supply current 15 mA VIH High-level input voltage 0.7 × VDD V VIL Low-level input voltage 0.3 × VDD V VOH High-level output voltage VDD - 0.5 V VOL Low-level output voltage VSS + 0.4 V I_Out Current on digital output 1m A C_L Capacitive load on digital output 50 pf
Document Feedback [v1-01] 2015-May-12 AS5147P − Timing Characteristics Reference magnet: N35H, 8mm diameter; 3mm thickness Figure 9: Timing Specifications ON_PWM RMS output noise (1 sigma) on PWM interface Orthogonal component for the magnetic field within the specified range (Bz) 0.068 degree t delay System propagation delay –core Reading angle via SPI 90 110 μs tdelay_ DAEC Residual system propagation delay after dynamic angle error correction. At ABI, UVW and SPI 1.5 1.9 μs t sampl Sampling rate Refresh rate at SPI 202 222 247 ns DAE1700 Dynamic angle error At 1700 RPM constant speed 0.02 degree DAEmax Dynamic angle error At 28000 RPM constant speed 0.36 degree DAEacc Dynamic angle error at constant acceleration (25krad/s²) 25k radians/s² constant acceleration 0.175 degree MS Maximum speed 28000 RPM Symbol Parameter Conditions Min Typ Max Units tpon Power-on time Not tested, guaranteed by design. Time between VDD > VDDporON and the first valid outcome 10 ms Symbol Parameter Conditions Min Typ Max Units Timing Characteristics
[v1-01] 2015-May-12 Document Feedback AS5147P − Detailed Description The AS5147P is a Hall-effect magnetic sensor using a CMOS technology. The Hall sensors convert the magnetic field component perpendicular to the surface of the chip into a voltage. The signals from the Hall sensors are amplified and filtered by the analog front-end (AFE) before being converted by the analog-to-digital converter (ADC). The output of the ADC is processed by the hardwired CORDIC (coordinate rotation digital computer) block to compute the angle and magnitude of the magnetic vector. The in tensity of the magnetic field (magnitude) is used by the automatic gain control (AGC) to adjust the amplification level for compensation of the temperature and magnetic field variations. The AS5147P generates continuo usly the angle information, which can be requested by the different interfaces of the device. The internal 14-bit resolution is available by reading a register through the SPI interface. The resolution on the ABI output can be programmed for 10, 11 or 12 bits. The Dynamic Angle Error Compensation block corrects the calculated angle for latency using a linear prediction calculation algorithm. At constant rotation speed the latency time is internally compensated by the AS5147P , reducing the dynamic angle error at the SPI, ABI and UVW outputs. The AS5147P allows selecting between a UVW output interface and a PWM-encoded interface on the W pin. At higher speeds, the interpolator fills in missing ABI pulses and generates the UVW signals with no loss of resolution. The non-volatile settings in the AS5147P can be programmed through the SPI interface without any dedicated programmer. The AS5147P can support high speed application up to 28krpm. Detailed Description
[v1-01] 2015-May-12 Document Feedback AS5147P − Detailed Description Dynamic Angle Error Compensation The AS5147P uses 4 integrated Hall sensors which produce a voltage proportional to the orthogonal component of the magnetic field to the die. These voltage signals are amplified, filtered, and converted into the digital domain to allow the CORDIC digital block to calculate the angle of the magnetic vector. Propagation of these signals through the analog front-end and digital back-end generates a fixed delay between the time of measurement and the availability of the measured angle at the outputs. This la tency generates a dynamic angle error represented by the product of the angular speed ( ω)and the system propagation delay ( t delay ): DAE = ω x tdelay The dynamic angle compensation block calculates the current magnet rotation speed ( ω) and multiplies it with the system propagation delay ( tdelay ) to determine the correction angle to reduce this error. At constant speed, the residual system propagation delay is tdelay_DAEC . The angle represented on the PWM interface is not compensated by the Dynamic Angle Error Compensation algorithm. it is also possible to disable the Dynamic Angle Error Compensation with the DAECDIS setting. Disabling the Dynamic Angle Error Compensati on gives a noise benefit of 0.016 degree rms.This setting can be advantageous for low speed (under 100 RPM) respectively static positioning applications. (EQ1)
Document Feedback [v1-01] 2015-May-12 AS5147P − Detailed Description SPI Interface (Slave) The SPI interface is used by a host microcontroller (master) to read or write the volatile memory as well as to program the non-volatile OTP registers. The AS5147P SPI only supports slave operation mode. It communicates at clock rates up to 10 MHz. The AS5147P SPI uses mode=1 (CPOL=0, CPHA=1) to exchange data. As shown in Figure 12 , a data transfer starts with the falling edge of CSn (SCL is low). The AS5147P samples MOSI data on the falling edge of SCL. SPI commands are executed at the end of the frame (rising edge of CSn). The bit order is MSB first. Data is protected by parity. SPI Timing The AS5147P SPI timing is shown in Figure 12 . Figure 12: SPI Timing Diagram CSn (Input) CLK (Input) MOSI (Input) MISO (Output) tclktL tMOSI tMISO tOZ tOZ tH tCSn tclkLtclkH Data[15] Data[15] Data[14] Data[14] Data[0] Data[0]
[v1-01] 2015-May-12 Document Feedback AS5147P − Detailed Description Figure 13: SPI Timing SPI Transaction An SPI transaction consists of a 16-bit command frame followed by a 16-bit data frame. Figure 14 shows the structure of the command frame. Figure 14: SPI Command Frame To increase the reliability of communication over the SPI, an even parity bit ( PARC) must be generated and sent. A wrong setting of the parity bit causes the PARERR bit in the error flag register to be set. The parity bit is calculated from the 16-bit command frame. The 16-bit command specifies whether the transaction is a read or a write and the address. Figure 15 shows the read data frame. Parameter Description Min Max Units tL Time between CSn falling edge and CLK rising edge 350 ns tclk Serial clock period 100 ns tclkL Low period of serial clock 50 ns tclkH High period of serial clock 50 ns tH Time between last falling edge of CLK and rising edge of CSn tclk/2 ns tCSn High time of CSn between two transmissions 350 ns tMOSI Data input valid to falling clock edge 20 ns tMISO CLK edge to data output valid 51 ns tOZ Release bus time after CS rising edge. 10 ns Bit Name Description
15 PARC Parity bit (even) calculated on the command frame
14 R/W 0: Write
1: Read 13:0 ADDR Address to read or write
Document Feedback [v1-01] 2015-May-12 AS5147P − Detailed Description Figure 15: SPI Read Data Frame The data is sent on the MISO pin. The parity bit PARD is calculated by the AS5147P for the 16-bit data frame. If an error is detected in the previous SPI command frame, the EF bit is set high. The SPI read is sampled on the rising edge of CSn and the data is transmitted on MISO with the next read command, as shown in Figure 16 . Figure 16: SPI Read Bit Name Description
15 PARD Parity bit (even) for the data frame
14 EF 0: No command frame error command occurred
1: Error occurred 13:0 DATA Data Read ADD[n] Read ADD[k] CSn Read ADD[p] Data ADD[n] Data ADD[p] Read ADD[m] Data ADD[k] Command CommandCommand Command Data Data Data MOSI MISO
[v1-01] 2015-May-12 Document Feedback AS5147P − Detailed Description Figure 17: SPI Write Data Frame The parity bit PARD must be calculated from the 16-bit data. In an SPI write transaction, the write command frame (e.g. Write ADD[n]) is followed by a data frame (e.g. DATA [x]). In addition to writing an address in the AS5147P , a write command frame causes the old contents of the addressed register (e.g. DATA [y]) to be sent on MISO in the follow ing frame. This is followed by the new contents of the addressed register (DATA [x]) as shown in Figure 19 . Figure 18: SPI Write Transaction Bit Name Description
15 PARD Parity bit (even)
13:0 DATA Data Write ADD[n] CSn MOSI MISO DATA (x) DATA (y) Write (ADDm) DATA (p) Next commandDATA (y) DATA (y)DATA (x) Command Command CommandData to write into ADD[n] Data content of ADD[n] New Data content of ADD[n] Data content of ADD[m] New Data content of ADD[m] Data to write into ADD[n]
[v1-01] 2015-May-12 Document Feedback AS5147P − Detailed Description ABI Incremental Interface The AS5147P can send the angle position to the host microcontroller through an incremental interface. This interface is available simultaneously with the other interfaces. By default, the incremental interface is set to work at the highest resolution (12 bits), which corresponds to 4096 steps per revolution or 1024 pulses per re volution (ppr). This resolution can be changed with the OTP bits ABIRES . The phase shift between the A and B signals indicates the rotation direction: clockwise (A leads, B follows) or counterclockwise (B leads, A follows) as viewed from above the magnet and AS5147P . The DIR bit can be used to invert the sense of the rotation direction. The IWIDTH setting programs the width of the index pulse from 3 LSB (default) to 1 LSB. Figure 32: ABI Signals at 11-Bit Resolution N =4096 for 12-Bit resolution, and N = 1024 for 10-bit resolution. The Figure 32 shows the ABI signal flow if the magnet rotates in clockwise direction, placing the magnet on the top of the AS5147P and looking at the magnet from the top (DIR=0). With the bit DIR, it is possible to invert the rotation direction. 01 23 4 5 6 7 8N-1N-2N-3N-4N-5N-6 1234567 0 N-1 N-2 N-3 N-4 A B I N-7Steps Clockwise rotation Counter-clockwise rotation
[v1-01] 2015-May-12 Document Feedback AS5147P − Detailed Description PWM The PWM can be enabled with th e bit setting PWMon. The PWM encoded signal is displayed on the pin W or the pin I. The bit setting UVW_ABI defines which output is used as PWM. The PWM output consists of a frame of 4119 PWM clock periods, as shown in Figure 34 . The PWM frame has the following sections:
- 12 PWM Clocks for INIT
- 4 PWM Clocks for Error detection
- 4095 PWM clock periods of data
- 8 PWM clock periods low The angle is represented in the data part of the frame with a 12-bit resolution. One PWM clock period represents 0.088 degree and has a typical duration of 444 ns. If the embedded diagnostic of the AS5147P detects any error the PWM interface displays only 12 clock periods high (0.3% duty-cycle). Figure 34: Pulse Width Modulation Encoded Signal time 4095 4094 4093 4092 4091 4090 4089 data 8 clock pulse low 12 clock pulses Init Init Error_n 4 clock pulses Error_n
12 PWM Clocks INIT –> High
4 PWM Error –> Low if error occurs
Document Feedback [v1-01] 2015-May-12 AS5147P − Detailed Description Hysteresis The hysteresis can be programmed in the HYS bits of the SETTINGS2 register. The hysteresis can be 1, 2, or 3 LSB bits, in which the LSB is defined by the ABI resolution setting ( ABIRES ). Figure 35: Hysteresis Settings Automatic Gain Control (AGC) and CORDIC Magnitude The AS5147P uses AGC to compensate for variations in the magnetic field strength due to changes of temperature, air gap between the chip and the magnet, and demagnetization of the magnet. The automatic gain control value can be read in the AGC field of the DIAAGC register. Within the specified input magnetic field strength ( Bz), the Automatic Gain Control keeps the CORDIC magnitude value ( MAG) constant. Below the minimum input magnetic field strength, the CORDIC magnitude decreases and the MAGL bit is set. Diagnostic Features The AS5147P supports embedded self-diagnostics. MAGL: magnetic field strength too high, set if AGC = 0x00 . This indicates the non-linearity error may be increased. MAGH: magnetic field strength too low, set high if AGC = 0xFF . This indicates the output noise of the measured angle may be increased. COF: CORDIC overflow. This indicates the measured angle is not reliable. LF: offset compensation completed. At power-up, an internal offset compensation procedure is started, and this bit is set when the procedure is completed. HYS Hysteresis Related to 11 Bit ABI Resolution 00 3 01 2 10 1 11 0
[v1-01] 2015-May-12 Document Feedback AS5147P − Detailed Description LF Error / COF Error In case of an LF or COF error, all outputs are changing into a safe state: SPI Output: Informatio n in the DIAAGC (0x3FFC) register. The angle information is still valid. PWM Output: PWM Clock Period 13 - 16 of the first 16 PWM Clock Periods = low. Additional there is no angle information valid (all 4096 clock periods = low) ABI Output: The state of ABI is frozen to ABI = 111 UVW Output: The state of UVW is frozen to UVW = 000 MAGH Error /MAGL Error Default diagnostic setting for MAGH error /MAGL error: In case of a MAGH error or MAGL error, there is no safe state on the PWM,ABI or UVW outputs if comp_h_error_en= 0 & comp_h_error_en = 0. The device is operating with the performance as explained. The error flags can be read out with the DIAAGC (0x3FFC) register. Enhanced diagnosis setting for MAGH error / MAGL error: In case of a MAGH error or MAGL error, the PWM,ABI or UVW outputs are going into a safe state if comp_h_error_en= 1 & comp_h_error_en = 1. SPI Output: Informatio n in the DIAAGC (0x3FFC) register. The angle information is still valid, if the MAGH or MAGL error flag is on. PWM Output: PWM Clock Period 13 - 16 of the first 16 PWM Clock Periods = low. Additional there is no angle information valid (all 4096 clock periods = low) ABI Output: The state of ABI is frozen to ABI = 111 UVW Output: The state of UVW is frozen to UVW = 000 Important: When comp_(h/l)_error_en is enabled a marginal magnetic field input can cause toggling of MAGH or MAGL which will lead to toggling of the ABI/UVW outputs between operational mode and failure mode.
Document Feedback [v1-01] 2015-May-12 AS5147P − Application Information Burn and Verification of the OTP Memory Step-by-step procedure to permanently program the non-volatile memory (OTP): Figure 36: Minimum Programming Diagram for the AS5147P in 5V Operation Note(s) and/or Footnote(s): 1. In terms of EMC and for remote applic ation, additional circuits are necessary.
Application Information
A B GND VDD3V VDD U V W VDD during programming 4.5 – 5.5V 1μF100nF Programmer VDD GND I 5V operation
Document Feedback [v1-01] 2015-May-12 AS5147P − Application Information The programming can either be performed in 5V operation using the internal LDO (1uF on regulator output pin), or in 3V Operation but using a supply voltage between 3.3V and 3.5V. 1. Power on cycle 2. Write the SETTINGS1 and SETTINGS2 registerswith the Custom settings for this application 3. Position the magnet at the desired zero position 4. Read out the measured angle from the ANGLE register 5. Write ANGLE [5:0] into the ZPOSL register and ANGLE [13:6] into the ZPOSM register 6. Read reg(0x0016) to reg(0x0019) → Read register step1 7. Comparison of written content (settings and angle) with content of read register step1 8. If point 7 is correct, enable OTP read / write by setting PROGEN = 1 in the PROG register 9. Start the OTP burn procedure by setting PROGOTP = 1 in the PROG register 10. Read the PROG register until it reads 0x0000 (Programming procedure complete) 11. Clear the memory content writing 0x00 in the whole non-volatile memory 12. Enable OTP read / write by setting PROGEN = 1 in the PROG register 13. Set the PROGVER = 1 to set the Guard band for the guard band test (1). 14. Refresh the non-volatile memory content with the OTP content by setting OTPREF = 1 15. Read reg(0x0016) to reg(0x0019) → Read register step2 16. Comparison of written content (settings and angle) with content of read register step2. Mandatory: guard band test 17. New power on cycle, if point 16 is correct. If point 16 fails, the test with the guard band test 1 was not successful and the device is incorrectly programmed. A reprogramming is not allowed! 18. Read reg(0x0016) to reg(0x0019) → Read register step3 19. Comparision of written content (settings and angle) with content of read register step3. 20. If point 19 is correct, the progra mming was successful. If point 19 fails, device is inco rrectly programmed. A reprogramming is not allowed 1. Guard band test: Restricted to temperature range: 25 °C ± 20 °C Right after the programming procedure (max. 1 hour with same Conditions 25°C ± 20 °C) Same VDD voltage The guard band test is only for the verification of the burned OTP fuses during the programming sequence. A use of the guard band in other cases is not allowed.
[v1-01] 2015-May-12 Document Feedback AS5147P − Application Information Figure 39: OTP Memory Burn and Verification Flowchart correct START Write reg(0x0018) Write reg(0x0019) Set the magnet to the zero position Write Reg(0x0017(5:0))= reg(0x3FFF(5:0)) Reg(0x0016(7:0))= reg(0x3FFF(13:6)) Read Reg(0x0016) Reg(0x0017) Reg(0x0018) Reg(0x0019) Write Reg(0x0003)=0x08 Write Reg(0x0016)=0x00 Reg(0x0017)=0x00 Reg(0x0018=0x00 Reg(0x0019)=0x00 Power-on cycle Read Reg(0x0016) Reg(0x0017) Reg(0x0018) Reg(0x0016) Write Reg(0x0003)=0x40 Verify 2 correct Read ANGLE Write Angle into ZPOSL and ZPOSM Read reg(0x3FFF) Read Register step 1 Comparison of written content (settings and angle) with content of Read Register step 1 Unlock OTParea for read/write (PROGEN=1) Read OTP_CTRL Set Guardband Refresh memory with OTP content Read Register step 2 Comparison of written content (settings and angle) with content of Read Register step 2 Mandatory Guardband-Test Read Register step 3 Verify 1 Clear memory Start OTP burning procedure (PROGOTP=1) Power on cycle AS5147P Settings Position of the magnet to the zero position Write Reg(0x0003)=0x01 Write Reg(0x0003)=0x08 Read Reg(0x0003) Reg(0x0003)=0x00 NO OTP burning procedure complete if Reg(0x0003) =0x00 YES Unlock OTParea for read/write (PROGEN=1) Write Reg(0003)=0x04 Read Reg(0x0016) Reg(0x0017) Reg(0x0018) Reg(0x0016) Guardbandtest fails. Wrong programming. Reprogramming not allowed Not correct Verify 3 Comparison of written content (settings and angle) with content of Read Register step 3 END Wrong programming Reprogramming not allowed Not correct END Correct programming and verification correct Not correct
Document Feedback [v1-01] 2015-May-12 AS5147P − Application Information Figure 40: Minimum Circuit Diagram for the AS5147P Note(s) and/or Footnote(s): 1. In terms of EMC and for remote applic ation, additional circuits are necessary. AS5147P CSn CLK MISO MOSI TEST A B GND VDD3V VDD U V W 4.5 – 5.5V 1µF100nF MCU VDD GND I
[v1-01] 2015-May-12 Document Feedback AS5147P − Package Drawings & Markings The axis of the magnet must be aligned over the center of the package. Figure 41: Package Outline Drawing Note(s) and/or Footnote(s): 1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994. 2. All dimensions are in millimeters. Angles are in degrees. 3. N is the total number of terminals. Package Drawings & Markings Symbol Min Nom Max A- - 1 . 2 0 A1 0.05 - 0.15 A2 0.80 1.00 1.05 b 0.19 - 0.30 c 0.09 - 0.20 D 4.90 5.00 5.10 E - 6.40 BSC - E1 4.30 4.40 4.50 e - 0.65 BSC - L 0.45 0.60 0.75 L1 - 1.00 REF - Symbol Min Nom Max R0 . 0 9 - - R1 0.09 - - S0 . 2 0 - - Θ10 º - 8 º Θ2- 1 2 R E F - Θ3- 1 2 R E F - aaa - 0.10 - bbb - 0.10 - ccc - 0.05 - ddd - 0.20 - N1 4 Green RoHS
[v1-01] 2015-May-12 Document Feedback AS5147P − Mechanical Data Figure 44: Angle Detection by Default (no zero position programmed) Mechanical Data AS5147P AS5147P AS5147PAS51147P S N AS5147PAS5147P
0 Deg 90 Deg
180 Deg
270 Deg
Document Feedback [v1-01] 2015-May-12 AS5147P − Mechanical Data Figure 45: DIe Placement and Hall Array Position Note(s) and/or Footnote(s): 1. Dimensions are in mm. 2. The Hall array center is located in the center of the IC package. Hall array radius is 1.1mm. 3. Die thickness is 203μm nominal. Hall radius 2.130±0.235 3.200±0.235 0.306±0.100 0.694±0.150 0.236±0.100
[v1-01] 2015-May-12 Document Feedback AS5147P − Ordering & Contact Information Figure 46:
Ordering Information
Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Ordering Code Package Marking Delivery Form Delivery Quantity AS5147P-HTST TSSOP-14 AS5147P 13” Tape & Reel in dry pack 4500 AS5147P-HTSM TSSOP-14 AS5147P 7” Tape & Reel in dry pack 500 Ordering & Contact Information
Document Feedback [v1-01] 2015-May-12 AS5147P − RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specif ied lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are unde rway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to prov ide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. RoHS Compliant & ams Green Statement
[v1-01] 2015-May-12 Document Feedback AS5147P − Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appe aring in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding th e information set forth herein. ams AG reserves the right to ch ange specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications , such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any th ird party shall arise or flow out of ams AG rendering of technical or other services. Copyrights & Disclaimer
Document Feedback [v1-01] 2015-May-12 AS5147P − Document Status Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Document Status
[v1-01] 2015-May-12 Document Feedback AS5147P − Revision Information Note(s) and/or Footnote(s): 1. Page and figure numbers for the previous version may diff er from page and figure numbers in the current revision. 2. Correction of typographical er rors is not explicitly mentioned. Changes from 1-00 (2014-Oct-31) to current revision 1-01 (2015-May-12) Page Updated Figure 1 1 Updated notes under Figure 4 3 Updated Figure 8 7 Updated Figure 9 8 Updated text under Detailed Description 9 Updated Figure 12 12 Updated text under Non-Volatile Registers (OTP) 18 Updated text under PWM & Figure 34 23 Updated Figure 44 (Angle Detection by Default) 33 Added Figure 45 (Die Placement and Hall Array Position) & notes under it 34 Revision Information
Document Feedback [v1-01] 2015-May-12 AS5147P − Content Guide
1 General Description
1 Key Benefits & Features
2 Applications
2 Block Diagram
3 Pin Assignment
5A b s o l u t e M a x i m u m R a t i n g s