AS5147 AMSCO | Alldatasheet
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Technical content
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 1 AS5147 14-Bit On-Axis Magnetic Rotary Position Sensor with 11-bit Binary Incremental Pulse Count The AS5147 is a high-resolution rotary position sensor for fast absolute angle measurement over a full 360-degree range. This new position sensor is eq uipped with a revolutionary integrated dynamic angle error compensation (DAEC™) with almost 0 latency. The robust design of the device suppresses the influence of any homogenous external stray magnetic field. A standard 4-wire SPI serial interface allows a host microcontroller to read 14-bit absolute angle position data from the AS5147 and to program non-volatile settings without a dedicated programmer. Incremental movements are indicated on a set of ABI signals with a maximum resolution of 2048 steps / 512 pulses per revolution. The resolution of the ABI signal is programmable to 1024 steps / 256 pulses per revolution. Brushless DC (BLDC) motors are controlled through a standard UVW commutation interface with a programmable number of pole pairs from 1 to 7. The ab solute angle position is also provided as PWM-encoded output signal The AS5147 supports embedded self-diagnostics including magnetic field strength too high, magnetic field strength too low or lost magnet, and other related diagnostic features. The product is defined as SEooC (Safety Element out of Context) according ISO26262 including FM EDA, safety manual and third party qualification. The AS5147 is available as a single die in a compact 14-pin TSSOP package. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of this device are listed below: Figure 1: Added Value of Using the AS5147 Benefits Features Easy to use – saving costs on DSP DAE C™ Dynamic angle error compensation Good resolution for motor & position control 14-bit core resolution Versatile choice of the interface Independent output interfaces: SPI, ABI, UVW, PWM General Description
AS5147 – 2 ams Datasheet: 2014-Jun-27 [v1-04] General Description
Applications
The AS5147 has been design ed to support BLDC motor commutation for the most challenging automotive applications (AEC-Q100 grade 0 au tomotive qualified) such as electric power steering (EPS), tr ansmission (gearbox, actuator), pump, brake (actuator) and starter & alternator. Block Diagram The functional blocks of this device for reference are shown below: Figure 2: AS5147 Block Diagram No programmer needed (via SPI command) Zero position, configuration programmable Supports safety challenging applications Self-Diagnostics Lower system costs (no shielding) Immune to external stray field Benefits Features VDD3V3 A/D Volatile Memory SPI LDO AS5147 VDD GND CSn MOSI SCL MISO I/PWM A B W / PWM U V Analog Front-End UWVATAN (CORDIC) AGC OTP INTERPOLATOR Hall Sensors PWM Decoder Selectable on I or W ABI Dynamic Angle Error Compensation
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 3 Pin Assignment Figure 3: TSSOP-14 Pin Assignment Figure 4: Pin Description Pin Number Pin Name Pin Type Description
1 CSn Digital input SPI chip select (active low)
2C L K D i g i t a l i n p u t S P I c l o c k
3 MISO Digital output SPI master data input, slave output
4 MOSI Digital input SPI master data output, slave input
5 Test Test pin (connect to ground)
6 B Digital output Incremental signal B
7 A Digital output Incremental signal A
8 W/PWM Digital output Commutation signal W or PWM-encoded output
9 V Digital output Commutation signal V
10 U Digital output Commutation signal U
11 VDD Power supply 5V power supply voltage for on-chip regulator
12 VDD3V3 Power supply 3.3V on-chip low-dropout (LDO) output. Requires an external decoupling capacitor (1μF)
13 GND Power supply Ground
14 I Digital output Incremental signal I (index) or PWM
B A I / PWM GND VDD3V VDD U V W / PWM
AS5147 – 4 ams Datasheet: 2014-Jun-27 [v1-04] Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings“ may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not im plied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units Note VDD5 DC supply voltage at VDD pin -0.3 7.0 V VDD3 DC supply voltage at VDD3V3 pin -0.3 5.0 V VSS DC supply voltage at GND pin -0.3 0.3 V Vin Input pin voltage VDD+0.3 V Iscr Input current (latch-up immunity) -100 100 mA Norm: AEC-Q100-004 ESD Electrostatic discharge ±2 kV Norm: AEC-Q100-002 Pt Total power dissipation (all supplies and outputs) 150 mW Ta5V0 Ambient temperature 5V0 -40 150 °C In the 5.0V power supply mode only Ta3V3 Ambient temperature 3V3 -40 125 °C In the 3.3V power supply mode if NOISESET = 0 TaProg Programming Temperature 5 45 °C Programming @ Roomtemperature (25°C ± 20°C) Tstrg Storage temperature -55 150 °C Tbody Package body temperature 260 °C Norm: IPC/JEDEC J-STD-020 Humidity non-condensing 5 85 % Moisture sensitivity level 3 Represents a maximum floor lifetime of 168h Absolute Maximum Ratings
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 5
Electrical Characteristics
All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. Figure 6: Symbol Parameter Conditions Min Typ Max Units VDD Positive supply voltage 5.0V operation mode 4.5 5.0 5.5 V VDD3V3 Positive supply voltage 3.3V operation mode; only from -40 to 125°C 3.0 3.3 3.6 V VDD3V3_150 Positive supply voltage 3.3V operation mode; only from -40 to 150°C (3V150°C Bit has to be set) 3.2 3.4 3.6 V VDD_Burn Positive supply voltage Supply voltage required for programming in 3.3V operation 3.3 3.5 V V REG Regulated Voltage Voltage at VDD3V3 pin if VDD ≠ VDD3V3 3.2 3.4 3.6 V VporON Internal POR-on level At power-on (VDD rising from 0 to 5.0V) 2.47 2.83 V VporOFF Internal POR-off level At power-off (VDD falling from 5.0 to 0V) 2.24 2.56 V Vporh Internal POR hysteresis 170 mV IDD Supply current 15 mA VIH High-level input voltage 0.7 × VDD V VIL Low-level input voltage 0.3 × VDD V VOH High-level output voltage VDD - 0.5 VOL Low-level output voltage VSS + 0.4 V I_Out Current on digital output 4m A
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 7 Timing Characteristics Reference magnet: N35H, 8mm diameter; 3mm thickness Figure 9: Timing Specifications ON_PWM RMS output noise (1 sigma) on PWM interface Orthogonal component for the magnetic field within the specified range (Bz) 0.068 degree t delay System propagation delay –core Reading angle via SPI 90 110 μs tdelay_ DAEC Residual system propagation delay after dynamic angle error correction. At ABI, UVW and SPI 1.5 1.9 μs t sampl Sampling rate Refresh rate at SPI 202 222 247 ns DAE1700 Dynamic angle error At 1700 RPM constant speed 0.02 degree DAEmax Dynamic angle error At 14500 RPM constant speed 0.18 degree DAEacc Dynamic angle error at constant acceleration (25krad/s²) 25k radians/s² constant acceleration 0.175 degree MS Maximum speed 14500 RPM Symbol Parameter Conditions Min Typ Max Units tpon Power-on time 10 ms Symbol Parameter Conditions Min Typ Max Units Timing Characteristics
AS5147 – 8 ams Datasheet: 2014-Jun-27 [v1-04] Detailed Description The AS5147 is a Hall-effect magnetic sensor using a CMOS technology. The Hall sensors convert the magnetic field component perpendicular to the surface of the chip into a voltage. The signals from the Hall sensors are amplified and filtered by the analog front-end (AFE) before being converted by the analog-to-digital converter (ADC). The output of the ADC is processed by the hardwired CORDIC (coordinate rotation digital computer) block to compute the angle and magnitude of the magnetic vector. The in tensity of the magnetic field (magnitude) is used by the automatic gain control (AGC) to adjust the amplification level for compensation of the temperature and magnetic field variations. The internal 14-bit resolution is available by reading a register through the SPI interface. The resolution on the ABI output can be programmed for 10 or 11 bits. The Dynamic Angle Error Compensation block corrects the calculated angle for latency using a linear prediction calculation algorithm. At constant rotation speed the latency time is internally compensated by the AS5147, reducing the dynamic angle error at the SPI, ABI and UVW outputs. The AS5147 allows selecting between a UVW output interface and a PWM-encoded interface on the W pin. At higher speeds, the interpolator fills in missing ABI pulses and generates the UVW signals with no loss of resolution. The non-volatile settings in the AS5147 can be programmed through the SPI interface without any dedicated programmer. Power Management The AS5147 can be either powered from a 5.0V supply using the on-chip low-dropout regulator or from a 3.3V voltage supply. The LDO regulator is not intended to power any other loads, and it needs a 1 μF capacitor to ground located close to the chip for decoupling as shown in Figure 11 . In 3.3V operation, VDD and VREG must be tied together. In this configuration, normal noise performance ( ONL) is available at reduced maximum temperature (125°C) by clearing NOISESET to 0. When NOISESET is set to 1, the full temperature range is available with reduced noise performance ( ONH). Figure 10: Temperature Range and Output Noise in 3.3V and 5.0V Mode VDD (V) NOISESET Temperature Range (°C) RMS Output Noise (degree) 5.0 0 -40 to 150 0.068 3.3 0 -40 to 125 0.068 3.3 1 -40 to 150 0.082 Detailed Description
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 9 Detailed Description Figure 11: 5.0V and 3.3V Power Supply Options After applying power to the chip, the power-on time ( tpon) must elapse before the AS5147 provides the first valid data. Dynamic Angle Error Compensation The AS5147 uses 4 integrated Hall sensors which produce a voltage proportional to the orthogonal component of the magnetic field to the die. These voltage signals are amplified, filtered, and converted into the digital domain to allow the CORDIC digital block to calculate the angle of the magnetic vector. Propagation of these signals through the analog front-end and digital back-end generates a fixed delay between the time of measurement and the availability of the measured angle at the outputs. This la tency generates a dynamic angle error represented by the product of the angular speed ( ω)and the system propagation delay ( t delay ): DAE = ω x tdelay The dynamic angle compensation block calculates the current magnet rotation speed ( ω) and multiplies it with the system propagation delay ( tdelay ) to determine the correction angle to reduce this error. At constant speed, the residual system propagation delay is tdelay_DAEC . The angle represented on the PWM interface is not compensated by the Dynamic Angle Error Compensation algorithm. it is also possible to disable the Dynamic Angle Error Compensation with the DAECDIS setting. Disabling the Dynamic Angle Error Compensati on gives a noise benefit of 0.016 degree rms.This setting can be advantageous for low speed (under 100 RPM) respectively static positioning applications. 1µF100nF 4.5 - 5.5V VDD3V3 GND VDD 5.0V Operation LDO AS5147 100nF 3.0 – 3.6V VDD3V3 GND VDD 3.3V Operation LDO AS5147
AS5147 – 10 ams Datasheet: 2014-Jun-27 [v1-04] Detailed Description SPI Interface (slave) The SPI interface is used by a host microcontroller (master) to read or write the volatile memory as well as to program the non-volatile OTP registers. The AS5147 SPI only supports slave operation mode. It communicates at clock rates up to 10 MHz. The AS5147 SPI uses mode=1 (CPOL=0, CPHA=1) to exchange data. As shown in Figure 12 , a data transfer starts with the falling edge of CSn (SCL is low). The AS5147 samples MOSI data on the falling edge of SCL. SPI commands are executed at the end of the frame (rising edge of CSn). The bit order is MSB first. Data is protected by parity. SPI Timing The AS5147 SPI timing is shown in Figure 12 . Figure 12: SPI Timing Diagram CSn (Input) CLK (Input) MOSI (Input) MISO (Output) tclktL tMOSI tMISO tOZ tOZ tH tCSn tclkL tclkH Data[15] Data[15] Data[14] Data[14] Data[0] Data[0]
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 11 Detailed Description Figure 13: SPI Timing SPI Transaction An SPI transaction consists of a 16-bit command frame followed by a 16-bit data frame. Figure 14 shows the structure of the command frame. Figure 14: SPI Command Frame Parameter Description Min Max Units tL Time between CSn falling edge and CLK rising edge 350 ns tclk Serial clock period 100 ns tclkL Low period of serial clock 50 ns tclkH High period of serial clock 50 ns tH Time between last falling edge of CLK and rising edge of CSn tclk/2 ns tCSn High time of CSn between two transmissions 350 ns tMOSI Data input valid to falling clock edge 20 ns tMISO CLK edge to data output valid 20 ns tOZ Release bus time after CS rising edge. 10 ns Bit Name Description
15 PARC Parity bit (even) calculated on the command frame
14 R/W 0: Write
1: Read 13:0 ADDR Address to read or write
AS5147 – 12 ams Datasheet: 2014-Jun-27 [v1-04] Detailed Description To increase the reliability of communication over the SPI, an even parity bit ( PARC) must be generated and sent. A wrong setting of the parity bit causes the PARERR bit in the error flag register to be set. The parity bit is calculated from the 16-bit command frame. The 16-bit command specifies whether the transaction is a read or a write and the address. Figure 15 shows the read data frame. Figure 15: SPI Read Data Frame The data is sent on the MISO pin. The parity bit PARD is calculated by the AS5147 for the 16-bit data frame. If an error is detected in the previous SPI command frame, the EF bit is set high. The SPI read is sampled on the rising edge of CSn and the data is transmitted on MISO with the next read command, as shown in Figure 16 . Figure 16: SPI Read Bit Name Description
15 PARD Parity bit (even) for the data frame
14 EF 0: No command frame error command occurred
1: Error occurred 13:0 DATA Data Read ADD[n] Read ADD[k] CSn Read ADD[p] Data ADD[n] Data ADD[p] Read ADD[m] Data ADD[k] Command CommandCommand Command Data Data Data MOSI MISO
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 13 Detailed Description Figure 17: SPI Write Data Frame The parity bit PARD must be calculated from the 16-bit data. In an SPI write transaction, the write command frame (e.g. Write ADD[n]) is followed by a data frame (e.g. DATA [x]). In addition to writing an address in the AS5147, a write command frame causes the old contents of the addressed register (e.g. DATA [y]) to be sent on MISO in the follow ing frame. This is followed by the new contents of the addressed register (DATA [x]) as shown in Figure 19 . Figure 18: SPI Write Transaction Bit Name Description
15 PARD Parity bit (even)
13:0 DATA Data Write ADD[n] CSn MOSI MISO DATA (x) DATA (y) Write (ADDm) DATA (p) Next commandDATA (y) DATA (y)DATA (x) Command Command CommandData to write into ADD[n] Data content of ADD[n] New Data content of ADD[n] Data content of ADD[m] New Data content of ADD[m] Data to write into ADD[n]
AS5147 – 20 ams Datasheet: 2014-Jun-27 [v1-04] Detailed Description PWM The PWM can be enabled with th e bit setting PWMon. The PWM encoded signal is displayed on the pin W or the pin I. The bit setting UVW_ABI defines which ou tput is used as PWM. The PWM output consists of a frame of 4119 PWM clock periods, as shown in Figure 34 . The PWM frame has the following sections:
- 12 PWM Clocks for INIT
- 4 PWM Clocks for Error detection
- 16 PWM clock periods high
- 4095 PWM clock periods of data
- 8 PWM clock periods low The angle is represented in the data part of the frame with a 12-bit resolution. One PWM clock period represents 0.088 degree and has a typical duration of 444 ns. If the embedded diagnostic of th e AS5147 detects any error the PWM interface displays only 12 clock periods high (0.3% duty-cycle). Figure 34: Pulse Width Modulation Encoded Signal time 4095 4094 4093 4092 4091 4090 4089 data 8 clock pulse low 16 clock pulse high Init Error_n
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 21 Detailed Description Hysteresis The hysteresis can be programmed in the HYS bits of the SETTINGS register. The hysteresis can be 1, 2, or 3 LSB bits, in which the LSB is defined by the ABI resolution setting ( ABIRES ). Figure 35: Hysteresis Settings Automatic Gain Control (AGC) and CORDIC Magnitude The AS5147 uses AGC to compensate for variations in the magnetic field strength due to changes of temperature, air gap between the chip and the magnet, and demagnetization of the magnet. The automatic gain control value can be read in the AGC field of the DIAAGC register. Within the specified input magnetic field strength ( Bz), the Automatic Gain Control keeps the CORDIC magnitude value ( MAG) constant. Below the minimum input magnetic field strength, the CORDIC magnitude decreases and the MAGL bit is set. Diagnostic Features The AS5147 supports embedded self-diagnostics. MAGH: magnetic field strength too high, set if AGC = 0x00 . This indicates the non-linearity error may be increased. MAGL: magnetic field strength too low, set high if AGC = 0xFF . This indicates the output noise of the measured angle may be increased. COF: CORDIC overflow. This indicates the measured angle is not reliable. LF: offset compensation completed. At power-up, an internal offset compensation procedure is started, and this bit is set when the procedure is completed. HYS HYSTERESIS with 11BIT ABI Resolution HYSTERESIS with 10BIT ABI Resolution 00 3 2 01 2 1 10 1 0 11 0 3
AS5147 – 22 ams Datasheet: 2014-Jun-27 [v1-04] Detailed Description LF error / COF error In case of an LF or COF error, all outputs are changing into a safe state: SPI Output: Informatio n in the DIAAGC (0x3FFC) register. The angle information is still valid. PWM Output: PWM Clock Period 13 - 16 of the first 16 PWM Clock Periods = low. Additional there is no angle information valid (all 4096 clock periods = low) ABI Output : The state of ABI is frozen to ABI = 111 UVW Output : The state of UVW is frozen to UVW = 000 MAGH error /MAGL error Default diagnostic setting for MAGH error /MAGL error: In case of a MAGH error or MAGL error, there is no safe state on the PWM,ABI or UVW outputs if comp_h_error_en= 0 & comp_h_error_en = 0. The device is operating with the performance as explained. The error flags can be read out with the DIAAGC (0x3FFC) register. Enhanced diagnosis setting for MAGH error / MAGL error: In case of a MAGH error or MAGL error, the PWM,ABI or UVW outputs are going into a safe state if comp_h_error_en= 1 & comp_h_error_en = 1. SPI Output: Informatio n in the DIAAGC (0x3FFC) register. The angle information is still valid, if the MAGH or MAGL error flag is on. PWM Output: PWM Clock Period 13 - 16 of the first 16 PWM Clock Periods = low. Additional there is no angle information valid (all 4096 clock periods = low) ABI Output : The state of ABI is frozen to ABI = 111 UVW Output : The state of UVW is frozen to UVW = 000 Important: When comp_(h/l)_error_en is enabled a marginal magnetic field input can cause toggling of MAGH or MAGL which will lead to toggling of the ABI/UVW outputs between operational mode and failure mode.
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 23
Application Information
Burn and Verification of the OTP Memory Step-by-step procedure to permanently program the non-volatile memory (OTP): The programming can either be performed in 5V operation using the internal LDO (1uF on regulator output pin), or in 3V Operation but using a supply voltage between 3.3V and 3.5V. 1. Power on cycle 2. Write the SETTINGS1 and SETTINGS2 registerswith the Custom settings for this application 3. Position the magnet at the desired zero position 4. Read out the measured angle from the ANGLE register 5. Write ANGLE [5:0] into the ZPOSL register and ANGLE [13:6] into the ZPOSM register 6. Read reg(0x0016) to reg(0x0019) → Read register step1 7. Comparison of written content (settings and angle) with content of read register step1 8. If point 7 is correct, enable OTP read / write by setting PROGEN = 1 in the PROG register 9. Start the OTP burn procedure by setting PROGOTP = 1 in the PROG register 10. Read the PROG register until it reads 0x0000 (Programming procedure complete) 11. Clear the memory content writing 0x00 in the whole non-volatile memory 12. Enable OTP read / write by setting PROGEN = 1 in the PROG register 13. Set the PROGVER = 1 to set the Guard band for the guard band test (1). 14. Refresh the non-volatile memory content with the OTP content by setting OTPREF = 1 15. Read reg(0x0016) to reg(0x0019) → Read register step2 16. Comparison of written content (settings and angle) with content of read register step2. Mandatory: guard band test 17. New power on cycle, if point 16 is correct. If point 16 fails, the test with the guard band test 1 was not successful and the device is incorrectly programmed. A reprogramming is not allowed! 1. Guard band test: - Restricted to temperature range: 25 °C ± 20 °C - Right after the programming pr ocedure (max. 1 hour with same - Conditions 25°C ± 20 °C) - Same VDD voltage The guard band test is only for the verification of the burned OTP fuses during the programming sequence. A use of the guard band in other cases is not allowed.
AS5147 – 24 ams Datasheet: 2014-Jun-27 [v1-04]
- Read reg(0x0016) to reg(0x0019) → Read register step3 19. Comparision of written content (settings and angle) with content of read register step3. 20. If point 19 is correct, the progra mming was successful. If point 19 fails, device is inco rrectly programmed. A reprogramming is not allowed
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 25 Figure 36: OTP Memory Burn and Verification Flowchart correct START Write reg(0x0018) Write reg(0x0019) Set the magnet to the zero position Write Reg(0x0017(5:0))= reg(0x3FFF(5:0)) Reg(0x0016(7:0))= reg(0x3FFF(13:6)) Read Reg(0x0016) Reg(0x0017) Reg(0x0018) Reg(0x0019) Write Reg(0x0003)=0x08 Write Reg(0x0016)=0x00 Reg(0x0017)=0x00 Reg(0x0018=0x00 Reg(0x0019)=0x00 Power-on cycle Read Reg(0x0016) Reg(0x0017) Reg(0x0018) Reg(0x0016) Write Reg(0x0003)=0x40 Verify 2 correct Read ANGLE Write Angle into ZPOSL and ZPOSM Read reg(0x3FFF) Read Register step 1 Comparison of written content (settings and angle) with content of Read Register step 1 Unlock OTParea for read/write (PROGEN=1) Read OTP_CTRL Set Guardband Refresh memory with OTP content Read Register step 2 Comparison of written content (settings and angle) with content of Read Register step 2 Mandatory Guardband-Test Read Register step 3 Verify 1 Clear memory Start OTP burning procedure (PROGOTP=1) Power on cycle AS5147 settings Position of the magnet to the zero position Write Reg(0x0003)=0x01 Write Reg(0x0003)=0x08 Read Reg(0x0003) Reg(0x0003)=0x00 NO OTP burning procedure complete if Reg(0x0003) =0x00 YES Unlock OTParea for read/write (PROGEN=1) Write Reg(0003)=0x04 Read Reg(0x0016) Reg(0x0017) Reg(0x0018) Reg(0x0016) Guardbandtest fails. Wrong programming. Reprogramming not allowed Not correct Verify 3 Comparison of written content (settings and angle) with content of Read Register step 3 END Wrong programming Reprogramming not allowed Not correct END Correct programming and verification correct Not correct
AS5147 – 26 ams Datasheet: 2014-Jun-27 [v1-04] Figure 37: Minimum Circuit Diagram for the AS5147 Note(s) and/or Footnote(s): 1. In terms of EMC and for remote applic ation, additional circuits are necessary. AS5147 CSn CLK MISO MOSI TEST A B GND VDD3V VDD U V W 4.5 – 5.5V 1µF100nF MCU VDD GND I
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 27 Package Drawings & Markings The axis of the magnet must be aligned over the center of the package. Figure 38: Package Outline Drawing Note(s) and/or Footnote(s): 1. Dimensioning and tolerancing conform to ASME Y14.5M - 1994. 2. All dimensions are in millimeters. Angles are in degrees. 3. N is the total number of terminals. Package Drawings & Markings Symbol Min Nom Max A- - 1 . 2 0 A1 0.05 - 0.15 A2 0.80 1.00 1.05 b0 . 1 9 -0 . 3 0 c0 . 0 9 - 0 . 2 0 D 4.90 5.00 5.10 E - 6.40 BSC - E1 4.30 4.40 4.50 e - 0.65 BSC - L 0.45 0.60 0.75 L1 - 1.00 REF - Symbol Min Nom Max R0 . 0 9 - - R1 0.09 - - S0 . 2 0 - - Θ10 º - 8 º Θ2- 1 2 R E F - Θ3- 1 2 R E F - aaa - 0.10 - bbb - 0.10 - ccc - 0.05 - ddd - 0.20 - N1 4 Green RoHS
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 29 Mechanical Data Figure 41: Angle Detection by Default (no zero position programmed) Mechanical Data
AS5147 – 30 ams Datasheet: 2014-Jun-27 [v1-04] Ordering & Contact Information Figure 42:
Ordering Information
Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Ordering Code Package Marking Delivery Form Delivery Quantity AS5147-HTST TSSOP-14 AS5147 13” Tape & Reel in dry pack 4500 AS5147-HTSM TSSOP-14 AS5147 7” Tape & Reel in dry pack 500 Ordering & Contact Information
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 31 RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specif ied lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams knowledge and belief as of the date that it is provided. ams bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are unde rway to better integrate information from third parties. ams has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams and ams suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. RoHS Compliant & ams Green Statement
AS5147 – 32 ams Datasheet: 2014-Jun-27 [v1-04] Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appe aring in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding th e information set forth herein. ams AG reserves the right to ch ange specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications , such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This Product is provided by ams AG “AS IS” and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any th ird party shall arise or flow out of ams AG rendering of technical or other services. Copyrights & Disclaimer
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 33 Document Status Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Document Status
AS5147 – 34 ams Datasheet: 2014-Jun-27 [v1-04] Revision Information Note(s) and/or Footnote(s): 1. Page numbers for the previous version may di ffer from page numbers in the current revision Changes from 1-03 (2014-Jun-17) to current revision 1-04 (2014-Jun-27) Page(1) Updated Figure 22 15 Updated “ABI Incremental Interface” section 18 Updated “UVW Commutation Interface” section 19 Updated Figure 34 20 Revision Information
ams Datasheet: 2014-Jun-27 [v1-04] AS5147 – 35 Content Guide
1 General Description
1 Key Benefits & Features
2 Applications
2 Block Diagram
3 Pin Assignment
4A b s o l u t e M a x i m u m R a t i n g s
5 Electrical Characteristics
6 Magnetic Characteristics
6 System Characteristics
7 Timing Characteristics
8 Detailed Description
8P o w e r M a n a g e m e n t