AS39513

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[v1-10] 2018-Apr-25 Document Feedback AS39513 NFC Sensor Tag and Data Logger IC The AS39513 is a semi-passive tag chip optimized for battery-powered smart labels with sensor functionality. The chip is ideal for applications us ing thin and flex ible batteries but it also supports fully passi ve operation without a battery using the RF field from an RFID reader as a power source. The RFID interface is fully ISO 15693 and NFC-V (T5T) compliant. External power can be supplied from a single-cell battery (typically 1.5V) or a dual-cell battery (typically 3V). The chip has a fully integrated temperature sensor with a programmable temperature range (default -20ºC to 55ºC). The external sensor interface (S EXT) is an analog input and allows the connection of an external sensor. A real-time clock can be used to generate logging times and track the device lifetime. An SPI-like interface is available for chip initialization or communication with a microcontroller. The chip has the capability to energy harvesting from reader field up to 3mA. Configuration and logging data is stored on a configurable 9-kbit EEPROM. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of this device are listed below: Figure 1: Added Value of Using AS39513 Benefits Features

• Versatile data logging with selectable option • Programmable logging modes
• Logging storage capacity up to 1020 events (8-bit logging mode) with time stamp
• On-chip 9-kbit EEPROM
• Real-time clock (RTC)
• Supports data logging from various sensors • On-chip temperature sensor
• Analog input for external resistive sensor
• On-chip temperature sensor
• Default range: -20ºC to 55ºC (±0.5ºC over -20ºC to 10ºC, gold bumped die)
• Temperature range is programmable
• Flexible supply options (1) • Fully passive mode: no battery
• Semi-passive (BAP) mode: 1.5V or 3V battery
• Provides supply for external circuitry • Energy harvesting from reader field up to 3mA General Description

Document Feedback [v1-10] 2018-Apr-25 AS39513 − General Description Note(s): 1. After battery is exhausted, the chip will continue working in passive mode (no RTC).

Applications

The AS39513 applications include:

• Cold Chain: Monitoring and tracking of temperature-sensitive products
• Temperature monitoring of medical products
• Pharmaceutical logistics
• Monitoring of fragile goods transportation
• Autonomous data logging with long battery life of ~1 year (with 30mAh printed battery) • Standby current (RTC enabled): 2.14μATYP (@ 3.0V)
• Works with NFC-enabled phones and HF readers
• ISO 15693/NFC-V (T5T) compliant
• Cool-Log™ commands for logging functions
• Precludes manipulation and unauthorized usage of data
• EEPROM access from reader perpetual protected by password
• Flexible range of packages for inlay and PCB surface mount assembly • Gold bumped die 2403μm x 2313μm Benefits Features

[v1-10] 2018-Apr-25 Document Feedback AS39513 − General Description Block Diagram The functional blocks of this device are shown below: Figure 2: Functional Blocks of AS39513 ANT1 ANT2 VEXT VBAT VSS Temperature Sensor External Sensor SPI Slave CE DIN DOUT SCLK ISO 15693 State Machine 9 Kb EEPROM Real-Time Clock 1024Hz 10-Bit ADC Main Controller TestATEST SEXT

13.56 MHz

13.56MHz Single cell (1.5V)/ or Dual cell (3V) CT

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Pin and Pad Layout The abbreviations used in Figure 4 are given below: S = Supply O = Output I = Input EPTEST O Test pin for EEPROM. Do not connect. ANT2 I RF input from antenna. ANT1 I RF input from antenna. Pin Name Pin Type Description

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Operating Conditions is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5: Symbol Parameter Min Max Unit Comments Electrical Parameters VBAT /VGND Supply Voltage to Ground -0.3 3.7 V VIN Input Pin Voltage to Ground except ANT1, ANT2 and SEXT -0.3 3.3 V Input Pin Voltage to Ground at ANT1 and ANT2 -0.5 6.5 V V INSEXT Input Pin SEXT Voltage to Ground -0.3 1.8 V IIN Peak Current Induced on Pin ANT1 and ANT2 30 mA ISCR Input Current (latch-up immunity) ± 100 mA JEDEC JESD78D Nov 2011 Class 1 Electrostatic Discharge ESDHBM Electrostatic Discharge HBM ± 2 kV JEDEC JS-001-2014 ESDCDM ESD - Charged Device Models ± 500 V JEDEC JESD22-C101F Temperature Ranges and Storage Conditions TJUNC Operating Junction Temperature -20 65 °C TSTRG Storage Temperature Range -55 150 °C RHNC Relative Humidity (non-condensing) 58 5 % tSTRG_DOF Storage Time for DOF/Die or Wafers on Foil 3 months Refers to indicated date of packing TSTRG_DOF Storage Temperature for DOF/Die or Wafers on Foil 17 28 °C Absolute Maximum Ratings

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Absolute Maximum Ratings Note(s): 1. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensiti vity Classification for Non-hermetic Solid State Surface Mount Devices” . RHOPEN_ DOF Relative Humidity for DOF/Die or Wafers on Foil in Open Package 15 % Opened package RH UNOPEN _DOF Relative Humidity for DOF/Die or Wafers on Foil in Sealed Package 40 60 % Sealed bag Symbol Parameter Min Max Unit Comments

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Electrical Characteristics All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. Figure 6: Symbol Parameter Min Typ Max Unit Conditions VBAT3V 3V Battery Supply Voltage 2.2 3.3 V See note (3) VBAT1.5V 1.5V Battery Supply Voltage 1.35 1.8 V See note (3) VBAT_SU Minimum Start-Up Input Voltage 0.7 V T= 6°C Battery assisted mode VANT Power On Voltage 2.5 VP IBAT-SD Shutdown Current into VBAT 0.5 μA VBAT = 3.6V; 25°C IEXT Maximum Current from VEXT Output 3 mA In electromagnetic field VEXT VEXT Limiter Voltage 3.85 V In electromagnetic field RVEXT VEXT Output Resistance 750 Ω VEXT internally connected to rectifier output for supply of external circuits C TG On Chip Capacitance 35 pF Between ANT1 and ANT2 for die with gold bump f SCLK SCLK Serial Data Clock 100 kHz fC Carrier Frequency 13.56 MHz fRTC RTC Clock 1.024 kHz fSYS System Clock 1.92 MHz EWCYC EEPROM Erase/Write Cycles 10000 Cycles tDR EEPROM Data Retention Time 10 Years TJUNC = 25°C tE/W EEPROM Erase/Write Speed (four-byte block) 61 0 m s TACCGB Temperature Sensor Accuracy, Gold Bumped Die (logging mode only)(4) tLOGINT Logging Interval 1 32768 s LOGINT[15:0] 0001h LOGINT[15:0] 8000h

Electrical Characteristics

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Electrical Characteristics Note(s): 1. Temperature 25°C, supply V BAT=3.3V from RF field unless noted otherwise 2. CMOS inputs CE and SCLK have 100k Ohm pull down resistor permanently connected. CMOS Input DIN can be configured with pull up or pull down. See DIMD[1:0]. 3. Below VBAT=1.35V operation and perf ormance of AS39513 is not guaranteed. 4. Temperature sensor accuracy measured performance on wafer with gold bumped die measured at 3.0V for 3V trimmed devices and 1.5V for 1.5V trimmed devices. Assembly method can influence the temperature sensor accuracy. tIDLE Time to enter idle state after power up 300 μs Hmin3Vbat Sensitivity 3V battery assisted mode 150 mA/m Class ID-1 antenna VBAT=3.0V Hmin1_5Vbat Sensitivity 1.5V battery assisted mode 150 mA/m Class ID-1 antenna VBAT=1.5V Hminpass Sensitivity passive mode 280 mA/m Class ID-1 antenna CMOS Digital Input with 100k Ohm Pull-Down: CE, SCLK and DIN with Pull-Down Enabled(2) VIH High Level Input Voltage 0.7* VBAT V VIL Low Level Input Voltage 0.3*VBAT V ILEAK Input Leakage Current 1 μA VIL = 0V RD Pull-Down Resistance 100 kΩ IPD Pull-Down Current 10 50 μA VIH = VBAT CMOS Digital Input with 30k Ohm Pull-Up Active: DIN with Pull-Up Enabled VIH High Level Input Voltage 0.7* VBAT V VIL Low Level Input Voltage 0.3*VBAT V ILEAK Input Leakage Current -1 1 μA VIH = VBAT RU Pull-Up Resistance on DIN (optional see DIMD[1:0]) 30 kΩ IPU Pull-Up Current 30 160 μA VIL = 0V CMOS Digital Output DOUT ROSO Output Resistance Source 1.85 kΩ ROSI Output Resistance Sink 200 Ω Symbol Parameter Min Typ Max Unit Conditions

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description The AS39513 is designed for use in smart semi-passive labels as well as in full passive labels. Smart semi-passive labels are defined as thin and flexible labels that contain an integrated circuit and a power source. Semi-passive smart labels, also known as battery-assisted back-scattered passive labels, enable enhanced functionality and performance over passive labels. The IC includes sensor functionality and logging of sensor data. The RFID portion of the AS39513 operates at 13.56 MHz and is fully ISO15693 and NFC-V (T5T) compliant. The sensor controller runs with an independent clock of frequency f SYS. The chip is supplied from a single-cell battery of typically 1.5V, or from a dual cell battery of typically 3V. The on-chip temperature sensor and real-time clock (RTC) accommodate temperature data logging with time stamps. Power Management The AS39513 is supplied from either the battery or through the power coupled from the RFID reader. The device (sensors, ADC, real-time clock and logic) is norm ally supplied from the battery unless there is no battery attached (passive label), or when the battery is drained. When no battery power is available, these circuits will be powered by the RFID reader. The RFID AFE is always powered by the reader. Note 1.5V and 3V batteries are supported but the battery supply voltage range is not continuous. Please see electrical characteristics. Also it is assu med the battery will be connected when the RF field is not present. Correct operation is not guaranteed if the battery is connected in the presence of an RF field. A minimum ramp up time for VBAT of t RAMP is required to ensure all system registers are correctly loaded from system EEPROM during initialization. This is valid for both 1.5V and 3V battery operation. Energy Harvesting AS39513 has harvesting capability. The regulated voltage output pin for energy harvesting is VEXT. If an RFID reader is present, the harvested reader power is then available externally through the VEXT pin. An internal regulator limits the voltage to V EXT. The output impedance R VEXT of this voltage source is fixed. Analog Front End (AFE) The analog front end (AFE) operates at a carrier frequency of

13.56 MHz according to the ISO 15693 and NFC-V type 5 tag

standards. The incoming data is demodulated from the received ASK (Amplitude Shift Keying) signal, with either 10- 30% modulation index or 100% modula tion index. Outgoing data is transmitted from the AS39513 using load modulation and employs Manchester coding with one or two sub-carrier frequencies: 423.75 kHz (fc/32) or 484.28 kHz (fc/28). Detailed Description

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Processing and Digital Control The AS39513 is fully ISO15693 compliant. The processing of the incoming data is executed by the ISO15693 CODEC block that formats the data in a frame acco rding to the ISO specification. Both data coding modes (1 ou t of 256 and 1 out of 4) are supported by the AS39513. The reader (interrogator) makes the mode selection as part of the SOF (Start of Frame). The 1-of-256 data coding mode has a data rate of 1.65 kbit/s (fc/8192) meaning that the transmission of one byte takes 4.833 ms. The 1-of-4 coding has a rate of 26.48 kbit/s (fc/512) with the transmission of one byte requiring 302.08 μs. This RFID interface can be used to access most of the EEPROM storage and to control the operating mode of the AS39513. Slave Serial Interface (SPI-like) The integrated serial interface (SPI-like) can be used to configure and test the chip. The SPI-like bus can also be used for the communication between a microcontroller externally attached to the AS39513. With the correct access password, it can also be used to access all regions of the EEPROM and the AS39513 test modes. Please note SPI enable is active high. The SPI Read command also has 2 timing issues which need to be observed and are explained in the section SPI timing. Real-Time Clock (RTC) The on-chip real-time clock (RTC) is an integrating RC-type oscillator that is factory trimmed to f RTC. This oscillator is used to generate logging intervals t LOGINT and track the time since the chip was first initialized. The start time for the logging process can be programmed in UPC format by writing the related parameter in th e EEPROM configuration.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Temperature Sensor The on-chip temperature sensor is configured and calibrated to measure temperatures between -20ºC to 55ºC. The gold bumped die achieve an accuracy T ACCGB. The on-chip sensor can be reconfigured for a number of different temperature ranges but the sensor requires recalibration after each temperature range change. The temperature sensor is intended to be used in logging mode. The temperature sensor accuracy is only guaranteed in this mode and not in the presence of a strong RF field from a reader. When placed in the presence of a reader, strong RF fields can cause self heating of the chip depending on the field strength, antenna and length of time in the field. The accuracy of the on-chip temperature sensor can then not be guaranteed. External Sensor The on-chip external sensor interface provides a means for using both resistive and voltage-based sensors. The voltage at the sensor node can be scaled and shifted in order to cover a voltage range of V SEXT , or a subset of that range. The external sensor input S EXT can be also used for event-triggered logging. In this condition the logging is not triggered in predefined time inte rvals from the internal timer, but can be triggered externally, either with a sensor, switch or a microcontroller. The SEXT has in fact a very low power sensing interface that can be used to trigger logging events when the sensor voltage crosses one of four selectable thresholds. In addition an optional drive current can be supplied to the sensor. The maximum allowable voltage on the SEXT pin is V INSEXT . Analog to Digital Converter The chip has an integrated 10-bit analog to digital converter (ADC) with selectable voltage references. It is used for voltage conversion from the temperature sensor, the external sensor, and the external battery voltage.

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Data Protection The 9-kbit EEPROM is accessed through a controller that manages the overall chip operation. Every address in the memory map is assigned to one of four types of access levels. There is write protection for three memory areas (System, Application, and Measurement) using three different 32-bit passwords. All three memory areas are open for read at all times. A fourth memory area, called the Factory area, is much more restricted and is not accessible via RF except for the lock bits and passwords. This is used for passwords, memory lock bits, and some calibration information. For the Application, Measurement and System Access areas the access via RF remains open until the RF field is removed (the access via RF will close with the loss of RF field even if the logic is continuously powered by an exte rnal battery). Note if the chip is powered by a battery these areas will still be accessible by SPI. The chip also supports a one-ti me use secure mode. When this mode is used, the RFID write ca pability for all Application and Measurement blocks is blocked. The measurement area can still be written through the logging operations, but the logging results cannot be overwritten through the RFID interface even if the 32-bit password is known.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description System Description & Modes of Operation Once the AS39513 has been powered either from a battery or the RFID interface, the controller logic manages the operation of the IC according to the state diagram below. Figure 9: State Transition Diagram The description of each operation mode is reported in the next sections. end RESET Load Registers restart? Y N Initialize Counter Registers Restore Counters IDLE porz command WAITIDLE COMMAND WAIT COMMAND done command done Set_mode to_wait ACTIVE ACTIVE COMMAND command done start to_ready to_ready LOGGING event Set_mode to Active ACTPOR=1 ACTPOR=0 RF or SPI commands allowed Command mode where command is processed Write System block commands normally used here to configure logging

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Initializing the Chip A virgin chip (not initialized) can be initialized either through the SPI port or through RFID interface from a reader. Once the battery voltage is applied to the VBAT pin or the supply voltage is extracted from the RF field, the AS39513 boots up with the default factory configuration. For battery powered devices it is important that VBAT ramps up with t RAMP minimum to ensure system EEPROM values are correctly loaded into the system registers. This is valid for both 1.5V and 3V battery operation. Within t IDLE after power is applied, the logging controller goes to the IDLE state where it waits for configuration. Once all of the configuration information ha s been written to the device using write system block comma nds, the RFID “Set Mode” command is used to place the AS39513 either into the WAIT state or into the ACTIVE state directly. If in the WAIT state, a timer or input action can move th e device into the ACTIVE state. Once in the ACTIVE state, the AS39513 will begin logging data whenever a logging event occurs. RESET Mode Once the chip powers up, either from the battery or the RF field, and the power is stable, the initia lization process begins. At this point, the controller logic will read specific EEPROM addresses and load them into “shadow” registers. During this phase the battery type will be determined by checking System parameter BTYPE available in the EEPROM field. Two of the other EEPROM fields that will be read during this phase are the System parameters WAKEMD (wakeup mode) and ACTIVE (true if last state was ACTIVE). If both of these fields are high, it means that the chip wa s reinitialized from a previous ACTIVE mode and the restart condition flag ACTPOR will be set to high. If the restart condition is true (ACTPOR is high) then the measurement pointers and counters are reloaded from the last available state and the device returns to the ACTIVE mode. If the restart condition is false (ACTPOR is low), the register pointers and counters are initialized assuming that no measurements have been made but the MEASCNT and MEASPTR values in EEPROM will be retained, and the device enters IDLE mode. This means that if for example the battery voltage dropped during a logging event and caused a POR, the chip would enter idle mode ie stop, but the MEASCNT and MEASPTR values would be retained in EEPROM. If the mode is subsequently changed to Active (i.e. logging is restarted), the EEPROM MEASCNT and MEASPTR are zeroed. (The bit fields ACTPOR, WAKEMD, and ACTIVE are further documented in the Memory Map section).

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description IDLE Mode In the IDLE mode the device is waiting for commands either from the RFID or SPI interface. In this state the device can be first initialized after the first power up by setting the related EEPROM parameters. Initiating either interface and sending a command enables the internal “command” signal that moves the device into IDLE COMMAND mode. In IDLE mode the data logging parameters can be configured using Write System Block commands. Once fully configured a Set mode command can be used to either commence logging or change state to the WAIT state. WAIT Mode In WAIT mode the device is waitin g before to enter in the ACTIVE mode for a defined condition th at is dependent on the System parameters (Logging Control Parameters) set in the EEPROM. WAIT mode provides in fact a mechanism to delay the start of logging after the Set Mode command is issued. If the parameter TMSRT is set to 1, then the WAIT mode will transition to the ACTIVE mode after LOGDEL*512 seconds, where LOGDEL is also part of the System Parameters. If the parameter DIMD[1:0] is 2’b10, then the WAIT mode will transition to the ACTIVE mode when the DIN pin is pulled low. If TMSRT is 0 and DIMD is not 2’b10, then the WAIT mode will transition without delay to the ACTIVE mode. (The bit fields TMSRT, DIMD, and LOGDEL are further documented in the Memory Map section.) Commands from either the RFID or SPI interfaces are accepted in the WAIT mode. If a command request and a start event occur at the exact same time, the command processing has priority; the mode will transition to ACTIVE when the command is done. If a command is being processed when a start event occurs, the start event is pending until the command is completed and then the transition to ACTIVE mode occurs. When the device transitions from the WAIT to the ACTIVE mode, the real time clock counter (RTC) is reset to 0. In this way, the baseline time of the AS39513 is the time that the device was placed in ACTIVE mode.

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description ACTIVE Mode In ACTIVE mode, the device waits for a logging event to begin logging. The logging events can be generated by the real-time clock, a voltage level on the SEXT pin, or a digital signal on the DIN pin. Each type of logging event can be individually enabled by System parameters in the EEPROM. When any one of the enabled logging events occur, the mode transitions to the LOGGING mode and the data measurement and logging commences. If two logging events happen to occur in the exact same clock cycle, only one logging operation will be performed. Commands from either the RFID or SPI interfaces are accepted in the ACTIVE mode. If a command request and a logging event occur at the exact same time, the command request has priority. If a command is being processed when a logging event occurs, the logging event is pending until the command is completed and then the logging commences. COMMAND Mode The COMMAND modes process a command either from the RFID or SPI interface. Whichever interface issues the command first gets priority. The other interface will get a “device busy” error until the first command is completed. If both interfaces happen to request a command on the exact same clock edge (very unlikely), the RFID interface will get priority. There are three versions of COMMAND mode, one for each of the calling modes: IDLE, WAIT, an d ACTIVE. The only difference in these COMMAND modes is that when the command processing is complete, the mode will return to the mode that initiated the command. The exception is the command that purposely generates a mode change, Set Mode. For example, if the device is in the IDLE mode and the Set Mode command is called to change to the WAIT mode, the device returns from the IDLE COMMAND mode to the WAIT mode. LOGGING Mode In LOGGING mode, a sequence of measurements followed by an optional sequence of storing logging values takes place. This sequence is described in the following subsections.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Battery Check Before executing any measurement it is possible to check the status of the battery by performing the so called Battery Check. It is executed if the System parameter BATCHK is set to 1, then a coarse battery check is enabled. The reason of performing this check is that the power-on-reset only ensures that the battery voltage is enough for the logic to function but it does not guarantee that the battery voltage is within the tolerances for accurate measurements. The battery check involves the following steps. First, the battery check sensor elements are enabled. There is a brief wait for the analog circuits to settle. Using the battery type determined during RESET mode, the battery check comparator output will indicate if the battery voltage is acceptable. If it is, then the rest of the logging continues, if it is not, the logging stops, and the error flag, present in the System parameter, LOWBAT is set. Note that if a logging event was skipped because of low battery, the measurement counter is still incremented to give some indication of how many measurements were skipped. Because the battery may be too weak for a reliable write, the measurement counter will not be written to EEPROM if the battery voltage check has failed. Figure 10: Battery Check Threshold Voltages Battery Type BCKSEL [1:0] Threshold Voltage (V) 1.5V 00 1.2 3V 00 2.2 3V 01 2.1 3V 10 2.0 3V 11 1.9

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Sensor Measurements After the battery check, the sensor measurements are made. The three possible measurement that consist of Temperature, External Sensor and Battery Voltage are independently enabled by the System parameters TSMEAS, EXMEAS, and BVMEAS part of the System EEPROM fields, and they are executed in a fixed sequence as they are reported below. First, there is the temperature measurement. If TSMEAS is 1, the temperature circuits are enabled, and the temperature configuration values for the references and ADC are loaded. After a wait period for analog settling, an ADC measurement is taken, and the result is stored in ts_res_ff[9:0]. Next is the external sensor measurement. If EXMEAS is 1, the external sensor circuitry is enabled, including the optional current drive for the external sensor. The external sensor values for the references and ADC are loaded, and a wait period ensues to allow for analog settling. After the wait period, an ADC measurement is taken, and the result is stored in ex_ref_ff[9:0]. Finally, there is the battery voltage measurement. If BVMEAS is 1, the battery measurement circuits are enabled, and the battery voltage configuration values for the reference and ADC are loaded. After a wait period for analog settling, an ADC measurement is taken, and the result is stored in bv_res_ff[9:0].

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Limit Check Algorithm Once all the enabled measurements are done, an optional limit check algorithm begins. The AS39513 can be set to only record logging information if certain limit conditions are met. The internal temperature sensor and external sensor each have independent limit conditions. The ADC result for each sensor measurement is compared to four thresholds to determine the limit result. The limit thresholds are each 8-bit in length and are the 8 MSB values when compared to the 10-bit ADC values.The limit results follow the tables below. If a sensor is not enabled for logging, its limit result is taken to be 3’b000. Figure 11: Limit Check Results for Temperature Sensor Figure 12: Limit Check Results for External Sensor Note that in the computation of the limit result, the conditions are checked in the order given in the tables above. It is possible that more than one condition can be met at the same time, because there is no check on the relative values of the four limit parameters for each sensor. The first condition that is true in the order given in the table is the condition that determines the limit result. Step Condition ts_lim 1 ts_res_ff ≥ { TXHILIM, 2’b00 } 3’b100 2 ts_res_ff ≤ { TXLOLIM, 2’b11 } 3’b101 3 ts_res_ff ≥ { THIL IM, 2’b00 } 3’b110 4 ts_res_ff ≤ { TLOLIM, 2’b11 } 3’b111

5 Otherwise 3’b000

Step Condition ex_lim 1 ex_res_ff ≥ { EXHILIM, 2’b00 } 3’b100 2 ex_res_ff ≤ { EXLOLIM, 2’b11 } 3’b101 3 ex_res_ff ≥ { EHILIM, 2’b00 } 3’b110 4 ex_res_ff ≤ { ELOLIM, 2’b11 } 3’b111

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description The limit check algorithm is as follows. The limit result for each sensor is computed. For each limit result that is non-zero, the limit counter that corresponds to that limit flag is incremented. 1 The over limit count flag OVLIM will be set if any of the following conditions are true: TXHICNT > 0, TXLOCNT > 0, THICNT > THIMAX, TLOCNT > TLOMAX, EXHICNT > 0, EXLOCNT > 0, EHICNT > EHIMAX, or ELOCNT > ELOMAX (These System parameters are further documented in the Memory Map section). There are two types of limit check modes: normal and limit crossing. If normal limit mode is selected (LOGMD = 2’b10), then logging will occur if, and only if, at least one of the two sensor’s limit results is non-zero. I f l i m i t c r o s s i n g m o d e i s s e l e c t e d ( LO G M D = 2 ’ b 1 1 ) , t h e n l o g g i n g will occur if, and only if, the limit result for either sensor is different from that sensor’s previous measurement limit result. At initialization, the “previous” limit result for each sensor is assumed to be 3’b000. Therefor e, the first measurement that will be logged will be the first time that at least one of the two sensor’s limit results is non-zero. If neither of the limit modes are selected (LOGMD[1] = 0), then no limits are checked, the limit counters are not changed, and the measurement results are always logged. Measurement Results Logging If one of the limit criteria are sati sfied, or if the device is in the no-limit logging mode (LOGMD = 2’b00 or 2’b01), than the measurement results are logged. Memory Check: Prior to writing the log values in EEPROM, the logging measurement pointer ME ASPTR[11:0] is checked to insure that there will be room for the log data. If there is no room and STRMD is 0, the data is not logged, and the error flag EEFULL is set. 1. The limit counters are simple binary counters. If a limit count exceeds 16’hFFFF (65535), then the count will wrap around to zero.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Memory Pointer: Assuming the data can and should be logged, the logging begins at the curren t value of the MEASPTR[11:0], where MEASPTR[11:2] represents the EEPROM address for the first log data, and 2*MEASPTR[1:0] is the bit position at which to start the log data. The data is logged in the following order, with increasing pointer addresses for each log value. Once all the logging values are stored, and if the adjust logging information ADJUST parameter is set to 1, then the MEASPTR is rounded up to the nearest byte boundary. This wastes some memory space in return for being able to easily calculate the byte position of each log point. Format Options: In order to minimize EEPROM usage, data is logged at 2-bit boundaries acco rding to the format options LOGFMT: all measurement data is logged using either 8 or 10 bits. The 8-bit format is used if bo th logging mode LOGMD = 2’b00 and logging format LOGFMT = 0. Otherwise, 10 bits are used. Measurement Storing Sequence: First, if a temperature measurement was made, the result in ts_res_ff is written. Second, if an external measurement was made, the value in ex_ref_ff is written. Third, if a battery voltage measurement was made, the result in bv_res_ff is written. Note the number of bits (8 or 10) stored for the temperature, external sensor and battery voltage measurements depends on the LOGFMT and LOGMD configuration settings. Optional Status Signals: After the measurements are recorded, the status of two digital signals can optionally be recorded. If the optional logging da ta DLOG is 1, then the values of the digital signals at the DIN pin (the digital input din_i) and the external sensor interrupt SEXT (extirq_i) are recorded using the 2-bit value { din_i, extirq_i }. Note that if DLOG is the only logging option selected, that means, there are no ADC measurements enabled, then the logging state machine will wait about 3ms (the approximate time for one ADC conversion) in order for the external voltage at the SEXT pin to settle. N ote that if the val u e of th e ex t irq _i sign al want to b e use d, the n the Enable external sensor interrupt EIEN field must be set to 1 in order to enable the comparat or that generates the extirq_i interrupt event. Logging Modes: Finally, information about this measurement are written, depending on the logging mode. If interrupt logging mode is us ed (LOGMD = 2’b01), then the 30-bit real-time clock counter value is logged, followed by a two-bit value that indicates the logging event trigger source (further detail will follow in the Memory Map section). If one of the two limit logging modes is used (LOGMD = 2’b01 or LOGMD = 2’b11), the 16-bit log counter LOGCNT is written into the EEPROM.

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Status Parameters: As a last step in the logging operation, the measurement count, MEASCNT, is incremented. If update counts SKIP16 = 0 or MEASCNT[3:0] = 4’b1111, then MEASCNT, the status bits ACTIVE, EEFULL, OVWRT, ADCERR, LOWBAT, and OVLIM, and the ending measurement pointer MEASPTR are written into EEPROM. Even if no logging occurred (because the limit conditions were not met or the EEPROM was full), the measurement count MEASCNT is still incremented and written into EEPROM (still using the SKIP16 option to only write once every 16 measurements). The measurement counter MEASCNT clips at 16’hFFFF so that it does not wrap around to 0. The measurement pointer MEASPTR is only updated if data was logged to the EEPROM; it always points to just after the end of the data that was actually written to EEPROM. Logging Arbitration: In the condition that another enabled logging event occurs before the logging of the current event is complete, the next logging event will be queued and will commence at the completion of the current logging operation. If an RFID or SPI command request occurs during logging, the command is ignored in order to prevent conflicts in EEPROM access. Power Modes The controller modes described above also control which of the sensor blocks are enabled. If the controller is in any of the COMMAND modes, the LOGGING mode or the RESET initialization, there is a high-speed SYS=1.92 MHz) ring oscillator that is enabled to clock the controller logic and the EEPROM. In the LOGGING mode, there are three additional power modes. Battery check mode (bchk_md) enables all the sensor circuits needed to do the coarse battery check, which is basically everything in the sensor system except the ADC. Measure mode (meas_md) enables basically everything in the sensor system except the battery check circui t; this mode is used for temperature and external sensor measurements. Battery voltage mode (both bchk_md and meas_md enabled) is used to measure the battery voltage. If the AS39513 is not in one of the modes requiring the ring oscillator, the ring oscillator is disabled and the lowpow signal is asserted. This signal causes the power switch in the AFE to switch to an unregulated supply for the logic, further reducing the power consumption. The only circuits that are operational in this low power mode that would draw current from the external battery are the real time oscillator (if OSCEN = 1) and the external interrupt comparator (if EIEN = 1).

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Data Log Functions The AS39513 device supports various flexible data log formats. The data log format depends on the Logging form. The data log formats are defined in Figure below. The Logging form is set with the logging mode LOGMD[1:0] System parameter stored in the Logging Control Parameters address 0x43B (bits 4-5) in the EEPROM. Figure 13: Supported Logging Formats Storage Mode The storage mode defines what happens when the logging area in the EEPROM is full. The storage mode is set with the storage mode STRMD System parameter, stored in the Logging Control Parameters address 0x40E (bit 6) in the EEPROM. Figure 14: Storage Mode Bit 5 Bit 4 Logging Form Description 00 D e n s e Logging will occur for all logging events. No measurement count or real-time clock values will be logged.

01 I n t e r r u p t

Interrupt mode. Logging will occur for all logging events. Sensors are always logged to 10-bit accuracy. The real-time clock value and interrupt source are logged. The interrupt source is a two-bit value: 2’b01 = external sensor interrupt, and 2’b10 = DIN interrupt.

10 N o r m a l l i m i t

Enable logging if any of the limit check conditions are met. Sensors are always logged to 10-bit accuracy. If a measurement is logged, the value of the measurement counter is also logged. 1 1 Limit crossing Enable logging only if one of the limit check conditions is different than that from the previous logging event. Sensors are always logged to 10-bit accuracy. If a measurement is logged, the value of the measurement counter is also logged. Bit Storage Mode Description 0N o r m a l When the logging area in the EEPROM is full, the chip does not store any new sensor data to the EEPROM, additional logging values will be lost.

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Logging Timer The AS39513 device has an integr ated RC oscillator that is calibrated to f RTC. This oscillator drives the logging timer. The logging timer resolution is 1 second. The maximum period is tLOGINT =9.1 hours (32768 seconds). The logging interval is programmed by setting the LOGINT System parameter. The measurement real time is derived from 4 parameters – the Start time (STIME), the Delay time (LOGDEL), the log interval (LOGINT), and the # of the measurement (MEASCNT). This value has to be calculated in the reader by the equation: Real time = STIME+LOGDEL+LOGINT*MEASCNT Delay Time The AS39513 supports delayed start of the logging procedure. The Delay time has a resolution of 8 minutes - 32 seconds (512 seconds) and a maximum value of 582 hours (12 bits). The delay time value is set with the LOGD EL System parameter, while the Delay time counter starts counting when the device enter in WAIT mode. The delay time can also be disabl ed and an external push button at the DIN pin can be used for starting the logging procedure. When in the WAIT state, a pull-up current is supplied to DIN. A falling edge on DIN manually causes a transition from WAIT mode to ACTIVE mode.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Manual Log Start In addition to the delayed Star t Log, the application can start the logging manually (without a RFID reader). The manual control can be of 2 types: 1. To manually execute the transaction from WAIT to ACTIVE mode. When in WAIT mode, a pull-up current is supplied to DIN pin. A falling edge on DIN, for instance generated by an external button, manually cause the transaction. 2. To manually execute a logging event when the device is in ACTIVE mode. When in ACTIVE mode, a pull-up current is supplied to DIN pin. A falling edge on DIN, for instance generated by an external button, manually cause the logging event. During ACTIVE mode, a pull-up current is supplied to DIN, so the only required external component is the button. A falling edge on DIN generates a logging event and the logging will be started. Logging Mode Data Formats The data formats for the various logging modes are shown in Figures 15 to 19. The start address for the Measured (logged) data is determined by APPBLKS. If APPBLKS = 0 the start address for Measured data is byte address 0x004. Note each new measurement is added in the memory from right to left with the LSB of the next measurement starting at the first free bit from the right immediately next to the previous measurement.

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Figure 15: One Measurement Chosen sensor [7:0] RTC [19:12] RTC [11:4] no ADJUST LOGMD=01 DLOG[1:0] Sens [9:8] RTC [27:20] SRC[1:0]RTC [29:28] LOGMD=00 LOGMD=1X Meas counter [13:6] eas counter [15:1 DLOG Chosen sensor [7:0] Sens [9:8] DLOG Chosen sensor [7:0] LOGFMT = 1 DLOG Chosen sensor [7:0] Chosen sensor [7:0] Meas counter [5:0] Sens [9:8] LOGFMT = 0DLOG Chosen sensor [7:0] Chosen sensor [7:0] DLOG[1:0] Meas counter [3:0] Sens [9:8] DLOG Chosen sensor [7:0] RTC [3:0] RTC [13:6] DLOG[1:0] Meas counter [11:4] Meas counter [15:12] DLOG[1:0] Sens [9:8] RTC [21:14] DLOG RTC [5:0] Sens [9:8] RTC [29:22] SRC[1:0] SRC[1:0] DLOG DLOG RTC [29:24] Meas counter [15:8] Meas counter [15:8] ADJUST RTC [23:16] DLOG[1:0] Sens [9:8] RTC [7:0] RTC [15:8] RTC [23:16] Chosen sensor [7:0] SRC[1:0] RTC [29:24] RTC [7:0] RTC [15:8] Meas counter [7:0] DLOG Chosen sensor [7:0] Sens [9:8] DLOG Chosen sensor [7:0] DLOG[1:0] Sens [9:8] LOGMD=01 Chosen sensor [7:0] LOGFMT = 0 LOGFMT = 1 DLOG[1:0] DLOG[1:0] Sens [9:8] Sens [9:8] LOGMD=00 LOGMD=1X DLOG Chosen sensor [7:0] Chosen sensor [7:0] Sens [9:8] Meas counter [7:0] DLOG Chosen sensor [7:0] Chosen sensor [7:0]

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Figure 16: One Sensor + Battery SRC[1:0] RTC [29:26] RTC [25:18] LOGMD=01 Battery [5:0] DLOG[1:0] Battery [9:6] DLOG[1:0] RTC [3:0] Battery [9:6] Sens [9:8] RTC [9:2] Sens [9:8] RTC [17:10] RTC [1:0] DLOG[1:0] Battery [9:6] Battery [5:0] DLOG Chosen sensor [7:0] RTC [27:20] SRC[1:0]RTC [29:28 RTC [11:4] RTC [19:12] DLOG Battery [5:0] Sens [9:8] Chosen sensor [7:0] DLOG Chosen sensor [7:0] Battery [5:0] Battery [9:6] LOGFMT = 1 DLOG Chosen sensor [7:0] Sens [9:8] as counter [ DLOG[1:0] Battery [9:6] Meas counter [9:2] Meas counter [15:10] LOGFMT = 0 Sens [9:8]Battery [7:0] Battery [5:0] Battery [7:0] Meas counter [3:0] Battery [9:6] Meas counter [11:4] Meas counter [15:12] DLOG Chosen sensor [7:0] Chosen sensor [7:0] Battery [5:0] Sens [9:8] DLOG Chosen sensor [7:0] Chosen sensor [7:0] no ADJUST LOGMD=00 LOGMD=1X Battery [5:0] DLOG[1:0] Battery [9:6] RTC [23:16] SRC[1:0] RTC [29:24] DLOG[1:0] Sens [9:8] LOGMD=01 LOGFMT = 1 Battery [5:0] Battery [9:6] Battery [5:0] DLOG[1:0] Battery [9:6] Sens [9:8] DLOG[1:0] Battery [9:6] Meas counter [15:8] Battery [9:6] Battery [7:0] Battery [5:0] Meas counter [15:8] Chosen sensor [7:0] Sens [9:8] Meas counter [7:0] Battery [9:6] Chosen sensor [7:0] RTC [7:0] RTC [15:8] Chosen sensor [7:0] Sens [9:8] DLOG RTC [23:16] SRC[1:0] RTC [29:24] RTC [7:0] RTC [15:8] Battery [5:0] Sens [9:8] DLOG DLOG Chosen sensor [7:0] Meas counter [7:0] DLOG Chosen sensor [7:0] LOGFMT = 0 Battery [7:0] Chosen sensor [7:0] DLOG DLOG ADJUST LOGMD=00 LOGMD=1X Chosen sensor [7:0] Chosen sensor [7:0] Battery [5:0] Sens [9:8]

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Figure 17: Two Sensors No Battery SRC[1:0] RTC [29:26] RTC [9:2] RTC [17:10] RTC [25:18] RTC [1:0] DLOG[1:0] Ex Sensor [9:6] DLOG Chosen sensor [7:0] Ex Sensor [5:0] Sens [9:8] RTC [19:12] RTC [27:20] SRC[1:0]RTC [29:28 RTC [3:0] Ex Sensor [9:6] RTC [11:4] Chosen sensor [7:0]DLOG Ex Sensor [5:0] Sens [9:8] LOGMD=01 Chosen sensor [7:0] Ex Sensor [5:0] Sens [9:8] Meas counter [15:10] DLOG LOGFMT = 1 Chosen sensor [7:0] Ex Sensor [5:0] Sens [9:8] Ex Sensor [9:6] DLOG LOGFMT = 0 Chosen sensor [7:0] Chosen sensor [7:0] Meas counter [9:2] DLOG[1:0] Ex Sensor [9:6] DLOG[1:0] as counter [ DLOG[1:0] Ex Sensor [9:6] Ex Sensor [7:0] Ex Sensor [5:0] Sens [9:8] Meas counter [11:4] Meas counter [15:12] DLOG no ADJUST LOGMD=00 LOGMD=1X DLOG Chosen sensor [7:0] Chosen sensor [7:0] Ex Sensor [7:0] Ex Sensor [5:0] Sens [9:8] Meas counter [3:0] Ex Sensor [9:6] SRC[1:0] RTC [29:24] RTC [7:0] RTC [15:8] RTC [23:16] DLOG[1:0] Ex Sensor [9:6] DLOG Chosen sensor [7:0] Ex Sensor [5:0] Sens [9:8] RTC [15:8] RTC [23:16] SRC[1:0] RTC [29:24] Ex Sensor [9:6] RTC [7:0] Chosen sensor [7:0]DLOG Ex Sensor [5:0] Sens [9:8] Ex Sensor [9:6] LOGMD=01 DLOG Chosen sensor [7:0] Ex Sensor [5:0] Sens [9:8] Meas counter [7:0] Meas counter [15:8] DLOG LOGFMT = 1 Chosen sensor [7:0] Ex Sensor [5:0] Sens [9:8] Ex Sensor [9:6] DLOG DLOG[1:0] DLOG[1:0] DLOG[1:0] Ex Sensor [9:6] Ex Sensor [9:6] Meas counter [7:0] Ex Sensor [7:0] Ex Sensor [5:0] Sens [9:8] ADJUST LOGMD=00 LOGMD=1X Meas counter [15:8] DLOG Chosen sensor [7:0] Chosen sensor [7:0] LOGFMT = 0 Chosen sensor [7:0] Chosen sensor [7:0] Ex Sensor [7:0] Ex Sensor [5:0] Sens [9:8]

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Figure 18: Two Sensors + Battery Meas count RTC [1:0 RTC [7:0] RTC [15:8] Battery [9:4] RTC [25:18] Meas counter [7:0] Meas counter [15:8] Battery [7:0] Battery [7:0] DLOG[1:0] Temp [7:0] LOGMD=01 Battery [3:0] Ex Sensor [9:6] DLOG[1:0] Battery [9:4] Battery [3:0] Ex Sensor [9:6] SRC[1:0] RTC [29:26] DLOG Ex Sensor [5:0] Temp [9:8] Battery [9:4]DLOG[1:0] SRC[1:0] RTC [29:24] RTC [23:16] Ex Sensor [9:6]Battery [3:0] DLOG Chosen sensor [7:0] Ex Sensor [5:0] Sens [9:8] RTC [9:2] RTC [17:10] Battery [9:4] DLOG Temp [7:0] Ex Sensor [5:0] Temp [9:8] Ex Sensor [9:6]DLOG LOGFMT = 0 Temp [7:0] Temp [7:0] Ex Sensor [7:0] Battery [9:4] Battery [3:0] Ex Sensor [9:6] DLOG[1:0] LOGFMT = 1 Battery [3:0] Battery [9:4] Temp [7:0] Ex Sensor [5:0] Temp [9:8] DLOG Temp [7:0] Meas counter [9:2] Meas counter [15:10] Ex Sensor [7:0] Ex Sensor [5:0] Temp [9:8] Battery [3:0] Ex Sensor [9:6] DLOG no ADJUST LOGMD=00 LOGMD=1X Temp [7:0] Ex Sensor [5:0] Temp [9:8] Battery [9:4] Battery [9:4] Battery [7:0] Battery [9:4] Temp [7:0] Ex Sensor [7:0] Ex Sensor [5:0] Temp [9:8] Meas counter [15:8] DLOG Temp [7:0] LOGMD=01 Ex Sensor [5:0] Temp [9:8] Battery [3:0] Chosen sensor [7:0] Ex Sensor [5:0] Sens [9:8] RTC [15:8] RTC [7:0] Ex Sensor [9:6] RTC [15:8] RTC [7:0] SRC[1:0] RTC [29:24] Battery [3:0] DLOG[1:0] Battery [9:4] Battery [9:4] RTC [23:16] Ex Sensor [9:6] DLOG[1:0] Meas counter [7:0] LOGFMT = 1 Meas counter [15:8] Temp [7:0] Ex Sensor [5:0] Temp [9:8] Battery [3:0] Ex Sensor [9:6] Battery [9:4] Temp [7:0] Ex Sensor [5:0] Temp [9:8] RTC [23:16] SRC[1:0] RTC [29:24] Ex Sensor [9:6]Battery [3:0] DLOG DLOG DLOG DLOG DLOG LOGFMT = 0 Temp [7:0] Temp [7:0] Ex Sensor [7:0] Ex Sensor [5:0] Temp [9:8] Battery [3:0] Ex Sensor [9:6] Battery [7:0] Battery [3:0] Ex Sensor [9:6] DLOG[1:0] DLOG[1:0] ADJUST LOGMD=00 LOGMD=1X Temp [7:0] Meas counter [7:0]

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Figure 19: DLog Only SRC[1:0] RTC [13:6] RTC [29:22] RTC [21:14] RTC [5:0] DLOG[1:0] LOGMD=01 DLOG[1:0] Meas counter [5:0] DLOG[1:0] Meas counter [13:6] counter [1 LOGMD=00 LOGMD=1X no ADJUST SRC[1:0] RTC [29:24] RTC [7:0] DLOG[1:0] DLOG[1:0] RTC [15:8] RTC [23:16] Meas counter [15:8] Meas counter [7:0] LOGMD=01 DLOG[1:0] ADJUST LOGMD=00 LOGMD=1X

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description These constants in turn are used to calculate the effective ADC offset and scale factor, V ZERO and V SCALE , where The ADC output code, n ADC, will then be where V SIG is the voltage of the selected multiplexer signal (V SIG,TEMP , VSIG,EXT , VSIG,BAT1 , or V SIG,BAT2 ). Since the ADC voltage ranges for various settings can overlap, it is often not obvious which are the optimum settings for a given sensor voltage range. An Excel spreadsheet entitled “AS39513 ADC Settings.xslx” ha s been developed which shows the effect of the ADC references and sensor configuration settings on the temperature and external sensor input ranges. (EQ3) VZERO VLOW VMUXO– AMUX (EQ4) VSCALE VLOW VRNG– AMUX (EQ5) nADC 1024 VSIG VZERO– VSCALE (EQ6) VSIG nADC V• SCALE() 1024⁄ VZERO+=

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description ADC Output and Range for Temperature Measurement The temperature sensor produces a signal voltage that is given by the formula where T is the device temperature in degrees Celsius. Various temperature ranges are possible for the on-chip temperature sensor with different settings of TV1SET and TV2SET (mux_gain and gndv1 are always 00 and 0 respectively for temperature measurements). The nominal default temperature range with TV1SET=2, TV2SET=3 (implies ADC reference voltages VRNG=V1= 260mV VLOW=V2=410mV) is -26.5°C to 63.5°C. Accuracy of the temperature sensor is T ACCGB. Possible temperature ranges are shown in Figure 26 . (EQ7) VSIG TEMP, T 273.15+

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Figure 26: Temperature Ranges Possible with Different TV1SET and TV2SET Values Note(s): 1. Colored row indicated default range. 2. The temperature sensor has a temperature range starting at -26.6ºC, but the chip operating temperature range restricts the l ower limit to -20ºC. The default upper limit of the temperature sensor is guaranteed 55ºC minimum and nominally 63.5ºC. The upper li mit may be lower than the nominal 63.5ºC due to calibr ation, but an upper limit of 55ºC is guaranteed. TV1SET TV2SET Temperature ºC Start End Range 0 3 -26.6 123.6 150.2 1 3 -26.6 93.5 120.1 3 3 -26.6 33.5 60.1 4 3 -26.6 3.5 30.1 2 4 3.5 123.6 120.1 34 3 . 5 9 3 . 6 9 0 . 1 44 3 . 5 6 3 . 5 6 0 54 3 . 5 3 3 . 5 3 0 4 5 33.5 123.6 90.1 5 5 33.5 93.6 60.1 6 5 33.5 63.6 30.1 6 6 63.6 123.7 60.1 7 6 63.6 93.6 30

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description ADC Output and Range for Battery Measurement The battery sensor uses a voltage divider that depends on the battery type. If the battery type is set to a single cell battery, the signal voltage is Where VBAT is the voltage at the VBAT pin. If the battery type is set to a dual cell battery, the signal voltage is The configuration settings for battery measurement are V1SET= 3’b000, V2SET=3’b001 mux_gain=00 and gndv1=1 which translates to ADC reference voltages of VRNG=0 and VLOW=V2=310mV. ADC Output and Range for External Sensor Measurement The external sensor is just a switch to the SEXT pin, so the signal voltage, VSIG, EXT, is just the voltage at the SEXT pin. The configuration settings for ext. sensor measurement are EV1SET= 3'b010, EVSET2= 3'b101 mux_gain=00 and gndv1=0 which translates to ADC reference voltages of V RNG=V1=260mV and VLOW=V2=510mV. This translates to an SEXT input voltage range 510 – 760mV typ. Figure 27: ADC Input/Output Characteristic for Ext. Sensor Measurement with Default Settings (EQ8) VSIG BAT1, VBAT (EQ9) VSIG BAT2, VBAT Code 1024 510mV ADC Range: 250mV 760mV Vin

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description GPIO When the SPI is not used (CE open or low), the DIN and DOUT pins can be used as general purpose IOs (unless the SPI direct command “Set IO Mode” has lock ed the device in SPI mode). The functions of the DIN can be programmed as follows according to the System parameter DIMD[1:0] stored in the “Logging Control Parameters” address 0x439 (bits 1- 0) in the EEPROM: Figure 28: DIN Functional Options (GPIO) Bit 1 Bit 0 I/O Structure Function 0 0 Input Pull-down CMOS input, non-inverting 100k ohm pull down to ground enabled. 0 1 Input Pull-up Pull-up current is supplied to DIN only during a logging event. 1 0 Input Pull-up When in the WAIT state, a pull-up current is supplied to DIN. A falling edge on DIN manually causes a transition from WAIT mode to ACTIVE mode. If TMSRT is also 1, the event that happens first (delay or DIN input) causes the transition from WAIT mode to ACTIVE mode. 1 1 Input Pull-up During ACTIVE mode, a pull-up current is supplied to DIN. A falling edge on DIN generates a logging event.

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Memory Map The EEPROM memory as well as registers share a common 11-bit memory space. From the related 11-bit address it is then possible to access the EEPROM as well as the register and moreover it is possible to know which Access level is required to access each memory area. By decoding the address MSBs is possible to determine both the type of hardware (EEPROM or registers) and the access level required (Application, Measurement, System, or Factory). The overall memory layout is described in the figure shown below. Figure 31: Memory Map Layout The gray regions in this memory map duplicate other regions to simplify address decoding. Address[7:6] Address[10:8] 000 001 010 011 100 101 110 111 00 01 10 11 System EEPROM Factory EEPROM Application / Measurement EEPROM System Registers Factory Registers

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description The decoding of the address MSBs can discriminate the addressed memory area as follows:

• EEPROM area with Applicat ion or Measurement access level If the Address[10] is 0 then the addressed memory are is EEPROM and the access level is either Application or Measurement. The boundary between the Application and Measurement regions is determined by the number of four-byte memory blocks, APPBLKS parameter, described later in this section.
• EEPROM area with System or Factory access level If the Address[10:9] is 2’b1 0 then the addr essed memory is the upper part of the EEPROM. If the Address[6] is 0, the access level is System, and if Address[6] is 1, the access level is Factory. The Address[8:7] is simply ig nored and treated as if those two bits were 0.
• R e g i s t e r s area with System or Factory access level If the Address[10:9] is 2’b11, the memory hardware is registers in the logic. If the Address[6] is 0, the ac cess level is System, and if the Address[6] is 1, the access level is Factory. The Address[7] is ignored an d treated as if it were 0. The section below describes the memory access levels in more detail. The remaining sections in this chapter describe the parameters in the System and Factory regions of the memory map, one 16-byte page at a time.

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Memory Access Levels Every address in the memory map is assigned to one of four types of access levels: Applicat ion, Measurement, System, and Factory. The properties of each access level are described in this section and shown in Figure 32 . Figure 32: Memory Map Application Access Region The Application access region is for application parameters that are protected from data logging. This region begins at byte address 0x000 and ends at byte address 4*APPBLKS[7:0] + 3. This region is readable by both the RFID and SPI memory access commands. It is writeable thro ugh RFID only if Application access has been granted throug h the Set Access command. It is always writeable through the SPI. Memory Area Location Contents RFID Access SPI Access Application 0x000 -4*APPBLKS[7:0]+3 Application data not logged data Readable by RFID. Writeable by RFID if Application access has been granted through Set Access Read/Write by SPI Measurement 4*APPBLKS[7:0]+4 to 0x3FF Logged data Readable by RFID. Writeable by RFID if Measurement access has been granted through Set Access Read/Write by SPI System See Memory Map Layout System-level parameters (e.g. logging start time, logging interval & limits), data pointers, and other control settings. Readable by RFID. Writeable by RFID if System access has been granted through Set Access Read/Write by SPI Factory See Memory Map Layout Calibration info, passwords, memory lock bits etc. Examples are UID, real time and system oscillator trim values Lock bits can be set but not read through the RF interface using the Lock Block command but otherwise not accessible through the RF interface. Readable through SPI Writeable through SPI if Factory access is active.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Measurement Access Region The Measurement access region is for data logging. If APPBLKS[7:0] is not 8’d255, this region begins at address 4*APPBLKS[7:0] + 4 and ends at address 0x3FF. (If APPBLKS[7:0] equals 8’d255, there is no Measurement region.) This region is readable by both the RFID and SPI memory access commands. It is writeable through RFID only if Measurement access has been granted through the Set Access command. It is always writeable through the SPI. The logging functions do not need Measurement access in order to write to this region; the Measurement access is only required for direct writing via the RFID interface. System Access Region The System access region is for system-level calibration parameters, data pointers, and other control settings. This region is readable by both the RFID and SPI memory access commands. It is writeable throug h the RFID interface only if System access has been granted through the Set Access command. It is always writeable through the SPI. There are two sub-regions of System access. The EEPROM region is from address 0x400 through 0x43 F. All values in this region are readable and writable with the correct access. The second sub-region of System access is the mirrored registers. It is for EEPROM parameters that are read and copied into registers at startup. This region is from address 0x600 through 0x63F. All values in this region are write-only (with the correct access). All bytes in this region will read back as 0x00 (with no error).

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Factory Access Region The Factory access region is for factory-only calibration parameters and control settings, as well as password storage and memory lock bits. The region is not accessible through the RFID interface. Attempts to write to this region through the RFID interface will generate a password error. Reads through the RFID interface will simply read 0x00 for each byte with no error. The Factory access regions are readable through the SPI, but are only writeable if Factory access is active. Factory access is made active by writing a special hard-coded Factory access password using the SPI direct command “Factory Access” . If Factory access is not open, SPI writes to Factory access area will simply be ignored. There are three sub-regions of Factory access. The first sub-region is the EEPROM region from address 0x440 through 0x47F. All values in this region are readable and writable via the SPI with the correct access. The second sub-region of Factory access is the mirrored registers. It is for EEPROM parameters that are read and copied into registers at startup. This region is from address 0x640 through 0x67F. All values in this region are write-only (with the correct access). All bytes in this region will read back as 0x00 (with no error). The third sub-region of Factory ac cess is the volatile registers. These registers are used for factory level parameters that are not duplicated in the EEPROM and require access through the memory map. This region goes from address 0x740 through 0x77F. All values are writeable with the correct access. No addresses in this region are readable; they all read back as 0x00 with no error. The remaining sections in this chapter describe the parameters in the System and Factory regions of the memory map, one 16-byte page at a time.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description System EEPROM Global System Parameters The System EEPROM page from addresses 0x400 through 0x40F contains several global use System parameters. All have the standard System level access through RFID and SPI. Figure 33: Global System Parameters STIME[31:0] – Start time. This 32-bit value can be used to mark the start time for logging. It is not used internally by the AS39513, so its format can be application dependent. DSFID[7:0] – Data storage format identifier. This value is written by the Write DSFID command and read back as part of the Get System Info command. AFI[7:0] – Application family identifier. This value is written by the Write AFI command and is read back as part of the Get System Info command. Addr. RFID Block Bit 7 6 5 4 3 2 1 0 0x400 0x00 STIME[7:0] 0x401 STIME[15:6] 0x402 STIME[23:16] 0x403 STIME[31:24] 0x404 0x01 DSFID[7:0] 0x405 AFI[7:0] 0x406 APPBLKS[7:0] 0x407 0x408 0x02 LOGDEL[7:0] 0x409 LOGDEL[11:8] 0x40A LOGINT[7:0] 0x40B LOGINT[15:8] 0x40C 0x03 MEASCNT[7:0] 0x40D MEASCNT[15:8] 0x40E SKIP16 STRMD 0x40F

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description APPBLKS[7:0] – Number of four-byte memory blocks in Application memory minus 1. APPBLKS = 255 means 256 Application blocks and no Me asurement blocks. APPBLKS = 0 means 1 Application block and 255 Measurement blocks. The measurement logging will begin at address {1’b0, APPBLKS + 1, 2’b00}, assuming APPBLKS < 255. LOGDEL[11:0] – Logging delay before first logging event. Wait 512*LOGDEL seconds after power-up initialization to begin logging. LOGINT[15:0] – Logging interval, in seconds, between timer-generated logging events. If LOGINT is set to zero, no logging is performed. MEASCNT[15:0] – Measurement count. This value is incremented with each logging event, even if the limit thresholds caused the measurements not to be recorded to EEPROM. STRMD – Storage mode. 0 = Normal logging. When th e logging memory is full, additional logging values will be lost. SKIP16 – Update counts only every 16 measurements. 0 = MEASCNT, MEASPTR, and status byte (0x43B) updated every measurement. 1 = MEASCNT, MEASPTR, and status byte (0x43B) updated every 16 measurements, when MEASCNT[3:0] = 4’b1111.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Temperature Sensor Parameters The temperature sensor parameter EEPROM page from addresses 0x410 through 0x41F contains parameters used during temperature logging. All have the standard System level access through RFID and SPI. Figure 34: Temperature Sensor Parameters TXHILIM[7:0] – First threshold to use for limit checks during temperature measurements. See the section on Limit Check Algorithm above. TXLOLIM[7:0] – Second threshold to use for limit checks during temperature measurements. See the section on Limit Check Algorithm above. THILIM[7:0] – Third threshold to use for limit checks during temperature measurements. See the section on Limit Check Algorithm above. Addr. RFID Block Bit 7 6 5 4 3 2 1 0 0x410 0x04 TXHILIM[7:0] 0x411 TXLOLIM[7:0] 0x412 THILIM[7:0] 0x413 TLOLIM[7:0] 0x414 0x05 TXHICNT[7:0] 0x415 TXLOCNT[7:0] 0x416 THICNT[7:0] 0x417 TLOCNT[7:0] 0x418 0x06 THIMAX[7:0] 0x419 TLOMAX[7:0] 0x41A 0x41B 0x41C 0x07 0x41D 0x41E 0x41F

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description TLOLIM[7:0] – Fourth threshold to use for limit checks during temperature measurements. See the section on Limit Check Algorithm above. TXHICNT[7:0] – Counter for the number of times that the first threshold condition was met du ring limit checks of the temperature measurement. If this count is non-zero, the over limit count flag, OVLIM, will be set. TXLOCNT[7:0] – Counter for the number of times that the second threshold condition was met (but not the first condition) during limit checks of the temperature measurement. If this count is non-zero, the over limit count flag, OVLIM, will be set. THICNT[7:0] – Counter for the number of times that the third threshold condition was met (b ut not the first or second condition) during limit checks of the temperature measurement. TLOCNT[7:0] – Counter for the number of times that the fourth threshold condition was met (but not the first, second, or third condition) during limit checks of the temperature measurement. THIMAX[7:0] – Maximum count for the number of times that the third threshold condition wa s met (but not the first or second condition) during limit checks of the external sensor measurement. If THICNT > THIM AX, then the over limit count flag, OVLIM, will be set. TLOMAX[7:0] – Maximum count for the number of times that the fourth threshold condition was met (but not the first, second, or third condition) during limit checks of the external sensor measurement. If TLOCNT > TLOMAX, then the over limit count flag, OVLIM, will be set.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description External Sensor Parameters The external sensor paramete r EEPROM page from addresses 0x420 through 0x42F contains parameters used during external sensor logging. All have the standard System level access through RFID and SPI. Figure 35: External Sensor Parameters EXHILIM[7:0] – First threshold to use for limit checks during external sensor measurements. See the section on Limit Check Algorithm above. EXLOLIM[7:0] – Second threshold to use for limit checks during external sensor measurements. See the section on Limit Check Algorithm above. EHILIM[7:0] – Third threshold to use for limit checks during external sensor measurements. See the section on Limit Check Algorithm above. Addr. RFID Block Bit 7 6 5 4 3 2 1 0 0x420 0x08 EXHILIM[7:0] 0x421 EXLOLIM[7:0] 0x422 EHILIM[7:0] 0x423 ELOLIM[7:0] 0x424 0x09 EXHICNT[7:0] 0x425 EXLOCNT[7:0] 0x426 EHICNT[7:0] 0x427 ELOCNT[7:0] 0x428 0x0A EHIMAX[7:0] 0x429 ELOMAX[7:0] 0x42A 0x42B 0x42C 0x0B 0x42D 0x42E 0x42F

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description ELOLIM[7:0] – Fourth threshold to use for limit checks during external sensor measurements. See the section on Limit Check Algorithm above. EXHICNT[7:0] – Counter for the number of times that the first threshold condition was met during limit checks of the external sensor measurement. If this count is non-zero, the over limit count flag, OVLIM, will be set. EXLOCNT[7:0] – Counter for the number of times that the second threshold condition was met (but not the first condition) during limit checks of the external sensor measurement. If this count is non-zero, the over limit count flag, OVLIM, will be set. EHICNT[7:0] – Counter for the number of times that the third threshold condition was met (b ut not the first or second condition) during limit checks of the external sensor measurement. ELOCNT[7:0] – Counter for the number of times that the fourth threshold condition was met (but not the first, second, or third condition) during limit checks of the external sensor measurement. EHIMAX[7:0] – Maximum count for the number of times that the third threshold condition wa s met (but not the first or second condition) during limit checks of the external sensor measurement. If EHICNT > EHIM AX, then the over limit count flag, OVLIM, will be set. ELOMAX[7:0] – Maximum count for the number of times that the fourth threshold condition was met (but not the first, second, or third condition) during limit checks of the external sensor measurement. If ELOCNT > ELOMAX, then the over limit count flag, OVLIM, will be set. Logging Control Parameters The logging control parameter EEPROM page from addresses 0x430 through 0x43F contains parameters used during logging and other system controls. All have the standard System level access through RFID and SPI. This page is copied to registers at 0x630 through 0x63F during device initialization. After initialization, if an EEPROM wr ite occurs to these addresses either from the RFID or SPI interface, the corresponding register in the 0x630 through 0x63F page is also updated. In addition, the status byte 0x43D is updated at the end of a logging event.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Figure 36: Logging Control Parameters Addr. Default Settings RFID Block Bit 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 0x430 010 0x0C TV1SET[2:0] TV1TRIM[4:0] 0x431 0 1 1 TV2SET[2:0] TV2TRIM[4:0] 0x432 TSMOFF[6:0] 0x433 0 TSV1G 0x434 010 0x0D EV1SET[2:0] EV1TRIM[4:0] 0x435 1 0 1 EV2SET[2:0] EV2TRIM[4:0] 0x436 EXMOFF[6:0] 0x437 0 0 0 EXGAIN[1:0] EXV1G 0x438 00000 00 0x0E HILIM LOPOR ADJUST CPHLD OSCEN TMIEN TMSRT 0x439 0 0 1 1 0 0 0 DOSRC[1:0] DOMD[1:0] DLOG DIMD[1:0] 0x43A 000010 BCKSEL[1:0] BTYPE[2:0] BATCHK 0x43B 0 0 0 0 0 0 0 0 EXCPR LOGFMT LOGMD[1:0] EIEN EXMEAS BVMEAS TSMEAS 0x43C 00000000 0x0F EXCSET[4:0] EICUR EXIVSET[1:0] 0x43D 0 0 0 0 0 0 0 ACTIVE EEFULL OVWRT ADCERR LOWBAT ACTPOR OVLIM 0x43E 00000000 MEASPTR[7:0] 0x43F 0 0 0 0 0 WAKEMD MEASPTR[11:8]

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description TV1TRIM[2:0] – Signed binary value. Trims the ADC reference voltage V1 used during temperature and battery measurements. See the section Analog to Digital Conversion for more details. TV1SET[2:0] – Reference levels for the ADC during temperature measurements. The condition TV2SET ≥ TV1SET-1 must be fulfilled to ensure the ADC input range V2-V1 is positive. Note if the temperature range is changed the temperature sensor will need recalibration. See the section Analog to Digital Conversion for more details. TV2TRIM[2:0] – Signed binary value. Trims the ADC reference voltage V2 used during temperature and battery measurements. See the section Analog to Digital Conversion for more details. TV2SET[2:0] – Reference levels for the ADC to use during temperature measurements. The condition TV2SET ≥ TV1SET-1 must be fulfilled to ensure the ADC input range V2-V1 is positive. Note if the temperature range is changed the temperature sensor will need recalibration. See the section Analog to Digital Conversion for more details. TSMOFF[6:0] – Offset to use during temperature and battery measurements. This value is a twos-compliment signed value. It is sign-extended to 10 bits and added to the ADC result after a temperature or battery measurement. TSV1G – V1 ground setting (trf_gndv1_o) to use during temperature measurements. EV1TRIM[2:0] – Signed binary value. Trims the ADC reference voltage V1 used during external sensor measurements. See the section Analog to Digital Conversion for more details. EV1SET[2:0] – Reference levels for the ADC to use during external sensor measurements. The condition EV2SET ≥ EV1SET-1 must be fulfilled to ensure the ADC input range V2-V1 is positive. See the section Analog to Digital Conversion for more details. EV2TRIM[2:0] – Signed binary value. Trims the ADC reference voltage V2 used during external sensor measurements. See the section Analog to Digital Conversion for more details. EV2SET[2:0] – Reference levels for the ADC to use during external sensor measurements. The condition EV2SET ≥ EV1SET-1 must be fulfilled to ensure the ADC input range V2-V1 is positive. See the section Analog to Digital Conversion for more details. EXMOFF[6:0] – Offset to use during external sensor measurements. This value is a twos-compliment signed value. It is sign-extended to 10-bits and added to the ADC result after an external sensor measurement. EXV1G – V1 ground setting (trf_gndv1_o) to use during external sensor measurements. EXGAIN[1:0] – Multiplexer gain setting (mux_gain_o) to use during external sensor measurements.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description TMSRT – Use delay timer (with LOGDEL) to transition from WAIT mode to ACTIVE mode. 0 = Do not use delay timer. If DIMD is not 2’b10, WAIT mode transitions directly to AC TIVE mode with no delay. 1 = Use the delay timer. If DIMD is 2’b10, the event that happens first (delay or DIN input) causes the transition from WAIT mode to ACTIVE mode. TMIEN – Timer interrupt enable. 0 = No timer generated logging events. 1 = Generate logging events with the LOGINT delay. OSCEN – Real-time oscillator enable. The real-time oscillator must be enabled for any of the real-time delays above to be of use. It can be disabled to further reduce power consumption in applications that do not need timing based interrupts or log time tracking. 0 = Disable real-time oscillator. 1 = Enable real-time oscillator. CPHLD – Enable charge-pump hold feature of the sensor charge pump. 0 = Disable charge-pump hold. 1 = Enable charge-pump hold. ADJUST – Adjust logging information to an even byte boundary after logging. 0 = No adjustment. Logging information is maximally packed in spite of byte boundaries. 1 = Each logging event ends at a byte boundary. Only values within the same logging event are packed. LOPOR – Control RF POR threshold. 0 = Use default higher POR threshold. 1 = Use lower POR threshold. HILIM – Control RF limiter threshold. 0 = Use default lower limiter threshold. 1 = Use higher limiter threshold.

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description DIMD[1:0] – Input mode for DIN pin (when not in SPI communication). 2’b00 = CMOS input, non-invert ing 100k ohm pull down to ground enabled. 2’b01 = Digital sensor input with pull up. Pull-up current is supplied to DIN only during a logging event. 2’b10 = Use the DIN pin for startup. When in the WAIT state, a pull-up current is supplied to DIN. A falling edge on DIN manually causes a transition from WAIT mode to ACTIVE mode. If TMSRT is also 1, the event that happens first (delay or DIN input) causes the transition from WAIT mode to ACTIVE mode. 2’b11 = Use the DIN pin for a logg ing interrupt. During ACTIVE mode, a pull-up current is supplied to DIN. A falling edge on DIN generates a logging event. DLOG – Add the digital input and external sensor interrupt values to the data that is logged. The two-bit value { din_i, extirq_i } is added to the logging data. 0 = No status logging of the digital input and external sensor interrupt. 1 = Add logging of the digital input and external sensor interrupt. DOMD[1:0] – Digital output mode (when not in SPI communication). 2’b00 = CMOS (push-pull) output. 2’b01 = Pull-up output. 2’b10 = Pull-down output. DOUT is inverted relative to DOSRC description below. 2’b11 = High impedance (disconnected) output. Default. DOSRC[1:0] – Digital output source (when not in SPI communication). 2’b00 = DOUT is a copy of the external interrupt comparator output. 2’b01 = DOUT is high when an ISO 15693 command has been recognized and is being processed. 2’b10 = DOUT is high when the RF field is available. 2’b11 = DOUT is the logical OR of EEFULL, ADCERR, LOWBAT, and OVLIM. If OSCEN=1, the outp ut is AND’d with a modulated signal that is 1/32 second high (32 counts of osc1k) and 31/32 second low (992 counts of osc1k). BATCHK – Battery check at the start of logging. 0 = No battery check. 1 = Do a battery check in order to qualify the logging.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description BTYPE [2:0] – Battery type algorithm to use. 3’b000 = Battery voltage is assumed to be nominally 1.5 V. 3’b001 = Battery voltage is assumed to be nominally 3.0 V. If the BTYPE value is changed for example from 3V type to 1.5V type, the new BTYPE value will only take effect after the next power up of the chip. The temperature sensor accuracy is only guaranteed if the chip is operated with a battery corresponding to the BTYPE it was tested with. BCKSEL[1:0] – Battery compare threshold. Threshold also depends on whether the battery is a 3 V or 1.5 V type as determined by the BTYPE[2:0] abov e. This is mapped directly to bchk_sel_o. When BTYPE is set for 1.5V batteries, BCKSEL can only have the default value BCKSEL[1:0] = 00. Please see Figure 10 for the battery check threshold values. TSMEAS – Enable temperature sensor logging. 0 = No temperature measurements. 1 = During logging, temperature measurements are made and optionally recorded depending on the logging mode. BVMEAS – Enable an ADC measurement of the battery voltage. 0 = No ADC measurement of the battery voltage is made or logged. 1 = Enable ADC measurement and logging of the battery voltage. EXMEAS – Enable external sensor logging. 0 = No external sensor measurements. 1 = During logging, external sensor measurements are made and optionally recorded depe nding on the logging mode. EIEN – Enable external sensor interrupt. 0 = No external sensor interrupt. 1 = External sensor interrupt can trigger a logging event. Interrupt will be triggered when the voltage on the SEXT pin falls below the threshold defined by EXIVSET. Interrupt is falling-edge sensitive, so the SEXT pin must rise above the threshold before an addition al sensor interrupt can be triggered. LOGMD[1:0] – Logging mode for all sensors. 2’b00 – Dense mode. Logging will occur for all logging events. No measurement count or real-time clock values will be logged. 2’b01 – Interrupt mode. Logging will occur for all logging events. Sensors are always logged to 10-bit accuracy. The real-time clock value and interrupt source are logged. The interrupt source is a two-bit value: 2’b01 = external sensor interrupt, and 2’b10 = DIN interrupt. 2’b10 – Normal limit mode. Enable logging if any of the limit check conditions are met. Sensors are always logged to 10-bit accuracy. If a measurement is logged, the value of the measurement counter is also logged.

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description 2’b11 – Limit crossing mode. Enable logging only if one of the limit check conditions is differen t than that from the previous logging event. Sensors are always logged to 10-bit accuracy. If a measurement is logged, the value of the measurement counter is also logged. LOGFMT – Logging format. 0 = Only the 8 MSB’s of the 10-bit ADC result for each measurement are logged. This is only valid when LOGMD = 2’b00. For other values of LOGMD, 10 bits are always used. 1 = All 10 bits of the ADC result for each measurement are logged. EXCPR – Use compressed format for external sensor. 0 = Uncompressed ADC result used. 1 = An 8-bit compressed version of the 10-bit ADC result is logged. (This is only valid when LOGMD = 2’b00 and LOGFMT = 0.) The compression algorithm for the result ex_res_ff[9:0] is as follows: Figure 37: Compression Algorithm EXIVSET[1:0] – Voltage threshold for external interrupt. This value is mapped directly to exi_vset_o[1:0]. See the description of the External Sensor Interrupt circuits for more information. The threshold voltages are given in the table below, where vdda is the digital supply voltage. Condition Compressed Result ex_res_ff[9] = 1 { 2’b11, ex_res_ff[8:3] } ex_res_ff[9:8] = 2’b01 { 2’b10, ex_res_ff[7:2] } ex_res_ff[9:7] = 3’b001 { 2’b01, ex_res_ff[6:1] } Otherwise { 2’b00, ex_res_ff[5:0] }

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Figure 38: Voltage Threshold for External Interrupt EICUR – Enable the current drive for the external sensor interrupt. This is independent of the EXCSET current source and is only used if EIEN = 1. 0 = Disable external sensor interrupt current. 1 = Enable current drive for external sensor interrupt if EIEN = 1. EXCSET[4:0] – Current drive select for external sensor measurement. This current is only active during the external sensor measurement. It is not used when the AS39513 is in low power mode waiting for an interr upt or timer event. This value is mapped directly to trf_iset_o [4:0]. See the description of the Trimmed Reference circuit for more information. OVLIM – Limit count threshold exceeded. 0 = No limit count thresholds exceeded. 1 = One of the eight limit count thresholds have been exceeded. ACTPOR – Active wakeup after power-up reset. 0 = The AS39513 has not had a reset direct to ACTIVE mode event. 1 = The AS39513 has had a power on reset occur when WAKEMD = 1 and ACTIVE = 1. LOWBAT – Low battery condition. 0 = No low battery condition measured. 1 = The battery check operation (BATCHK = 1) resulted in a low battery indication. ADCERR – ADC error flag. ADCERR is a flag in system EEPROM which is set by an under or overflow of the ADC during logging measurements. Once set it remains set until the system EEP ROM bit is cleared by a write command to system EEPROM memory. The ADCERR flag is not set by an ADC under or overflow during a Do Measurement command. 0 = No ADC error has occurred. 1 = An ADC error has occurred, either from an input signal out of range or a poorly chosen combination of reference voltage settings. EXIVSET[1:0] Voltage Threshold 2’b00 vdda * 0.256 2’b01 vdda * 0.083 2’b10 vdda * 0.355 2’b11 vdda * 0.438

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description OVWRT – Measurement overwrite flag. 0 = No measurements have been overwritten. 1 = At least one measurement has been overwritten. EEFULL – The EEPROM is full. 0 = More measurements can be logged. 1 = At least one measurement was not logged due to a lack of EEPROM space. ACTIVE – Controller state. 0 = Controller is in the IDLE or WAIT modes. 1 = Controller is in the ACTIVE mode. MEASPTR[11:0] – Measurement pointer. The EEPROM value is the pointer value at the end of a logging operation. The register copy of this measurement pointer will also be updated with each EEPROM write during logging so that it always points to the next logging location. The upper 10 bits of this 12-bit value is the address in the Application and Measurement EEPROM area to which to write. The two LSB’s represent the current bit position. The logging values are a ll 2, 6, 8, or 10-bit values, so they will always fall on one of the four two-bit boundaries in a byte. WAKEMD – Wakeup mode. 0 = The AS39513 always reinitializes after a power-up reset but the MEASCNT and MEASPTR values in EEPROM from any previous data logging will be retained as long as the chip stays in idle mode. 1 = The AS39513 will skip to ACTIVE mode after a power-up reset if ACTIVE = 1.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Factory EEPROM Factory Trim and RFID Parameters The factory trim and RFID parameter EEPROM page from addresses 0x440 through 0x44F contains trim parameters to be loaded during initialization an d RFID factory-set parameters. These values cannot be accessed through the RFID interface unless noted in the field descriptions below. They can be read through the SPI interface. They can be written through the SPI interface if the Factory access password has been entered previously using an SPI direct command. Bytes 0x440 through 0x443 are copied to registers at 0x640 through 0x643 during device initialization. After initia lization, if an SPI EEPROM write occurs to the addresses 0x440 through 0x443, the corresponding register in the 0x640 through 0x643 address range is also updated. Figure 39: Factory Trim and RFID Parameters Addr. Bit 7 6 5 4 3 2 1 0 0x440 OSCTRIM[7:0] 0x441 LKALL ROSTRIM[4:0] 0x442 V0TRIM[4:0] 0x443 TSENTRIM[3:0] 0x444 0x445 0x446 AFI_LK DSF_LK 0x447 CHIPREV[7:0] 0x448 UID[7:0] 0x449 UID[15:8] 0x44A UID[23:16] 0x44B UID[31:24] 0x44C UID[39:32] 0x44D UID[47:40] 0x44E UID[55:48] 0x44F UID[63:56]

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description OSCTRIM[7:0] – Real-time oscillator trim setting. This value is mapped directly to osc_trim_o[7:0]. See the description of the Real-Time Oscillator for more information. ROSTRIM[7:0] – High-speed ring oscillator trim setting. This value is mapped directly to ros_trim_o[4:0]. See the description of the High-Speed Oscillator for more information. LKALL – Lock all memory. If set, this bit will prevent all Measurement EEPROM from being written directly through RFID commands. Logging events will still be able to write to the Measurement memory. 0 = Lock setting depends on individual block lock bits. 1 = Lock all EEPROM Measurement areas from RFID writes. V0TRIM[4:0] – Main voltage trim setting for the trimmed reference. TSENTRIM[3:0] – Temperature sensor bandgap slope trim. This value is mapped directly to tsen_trim_o[3:0]. See the description of the Temperature Sensor for more information. DSF_LK – Lock the data storage format identifier. This bit can be set through the Lock DSFID command. 0 = The Write DSFID command can change the DSFID value. 1 = The Write DSFID command cannot change the DSFID value. AFI_LK – Lock the application family identifier. This bit can be set through the Lock AFI command. 0 = The Write AFI command can change the AFI value. 1 = The Write AFI command cannot change the AFI value. CHIPREV[7:0] – The chip revision identifier. This value can be read through the Get System Info RFID command. 8’h11 = AS39513 v2.0. UID[63:0] – The unique RFID identifier. This value can be read through the Get System Info RFID command.

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Passwords The passwords EEPROM page from addresses 0x450 through 0x45F contains the System, Application, and Measurement passwords. The RFID interface can only access these values through the Set Access and Set Password commands described above. They can be read through the SPI interface. They can be written through the SPI interface if the Factory access password has been entered previously. Figure 40: Passwords SYSPW[31:0] – System access password. APPPW[31:0] – Application access password. MEASPW[31:0] – Measurement access password. Addr. Bit 7 6 5 4 3 2 1 0 0x450 SYSPW[7:0] 0x451 SYSPW[15:8] 0x452 SYSPW[23:16] 0x453 SYSPW[31:24] 0x454 APPPW[7:0] 0x455 APPPW[15:8] 0x456 APPPW[23:16] 0x457 APPPW[31:24] 0x458 MEASPW[7:0] 0x459 MEASPW[15:8] 0x45A MEASPW[23:16] 0x45B MEASPW[31:24] 0x45C 0x45D 0x45E 0x45F

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Memory Lock Bits The memory lock bits EEPROM pages from addresses 0x460 through 0x47F contain the individual lock status for each EEPROM block in the Application and Measurement area. As described above, the AS39513 has an 11-bit memory map address space. Let the address space for the Application and Measurement EEPROM be represented by the fields below. Figure 41: Address Space for the Application and Measurement EEPROM For the Application and Memory areas, Address[10] is always 0. These areas are broken into 256 blocks of four bytes each. The RFID read and write commands work on a block-by-block basis. The 8-bit block address is the concatenation: { AGROUP[4:0], ABLSB[2:0] }. Each block can be individually locked from writing via the RFID write commands by setting one of the memory lock bits in the EEPROM. The EEPROM address containing the memory lock bit for a given block is at the address 0x460 + AGROUP . The bit index to lock the block is ABLSB. For example to lock the block containing the memory address 0x13A, for which AGROUP = 5’b01001, ABLSB = 3’b110, and ABYTE = 2’b10, the RFID Lock Block command writes a 1 to bit 6 in EEPROM address 0x469. The RFID Write Block command must check that the corresponding lock bit is not set before writing to that block. The RFID interface can only access the memory lock bits through the Lock Block command described above. They can be read through the SPI interface. They can be written through the SPI interface if the Factory access password has been entered previously. B i t 1 0 98765 4 32 1 0 Address 0 AGROUP[4:0] ABLSB[2:0] ABYTE[1:0]

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description System Registers Mirrored System Registers The addresses 0x630 through 0x63F access registers whose values are copied from the EEPROM addresses 0x430 through 043F during device initializati on. After initialization, if an EEPROM write occurs to one or more system EEPROM blocks in the addresses 0x430 through 0x43F, either from the RFID or SPI interface, all the system registers in the 0x630 through 0x63F page are also updated. The mirrored system register values cannot be accessed directly through the RFID interface. They can be written directly through the SPI interface. Writing directly to the address locations 0x630 through 0x63F only changes the register value; it does not change the EEPROM value. It is intended that the register values will be changed directly during system or factory calibration, and then the final values will be written into EEPROM when the calibration is complete. These registers cannot be read. Reading bytes fr om these address locations just returns 0x00. Figure 42: Mirrored System Registers Addr. Bit 7 6 5 4 3 2 1 0 0x630 TV1SET[2:0] TV1TRIM[4:0] 0x631 TV2SET[2:0] TV2TRIM[4:0] 0x632 TSMOFF[6:0] 0x633 TSV1G 0x634 EV1SET[2:0] EV1TRIM[4:0] 0x635 EV2SET[2:0] EV2TRIM[4:0] 0x636 EXMOFF[6:0] 0x637 EXGAIN[1:0] EXV1G 0x638 HILIM LOPOR ADJUST CPHLD OSCEN TMIEN TMSRT 0x639 DOSRC[1:0] DOMD[1:0] DLOG DIMD[1:0] 0x63A BCKSEL[1:0] BTYPE[2:0] BATCHK 0x63B EXCPR LOGFMT LOGMD[1:0] EIEN EXMEAS BVMEAS TSMEAS 0x63C EXCSET[4:0] EICUR EXIVSET[1:0] 0x63D ACTIVE EEFULL OVWRT ADCERR LOWBAT ACTPOR OVLIM 0x63E MEASPTR[7:0]

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description For descriptions of all of these parameters, see Logging Control Parameters . Factory Registers Mirrored Factory Registers The addresses 0x640 through 0x643 access registers whose values are copied from the EEPROM addresses 0x440 through 0443 during device initializati on. After initialization, if an EEPROM write occurs to the addresses 0x440 through 0x443, the corresponding register in the 0x640 through 0x643 address range is also updated. The mirrored factory register values cannot be accessed directly through the RFID interface. They can also be written through the SPI interface if Factory access is open. Writing to the address locations 0x640 through 0x643 only changes the register value; it does not change the EEPROM value. It is intended that the register values will be changed directly during factory calibration, and then the final values will be written into EEPROM when the calibration is complete. These registers cannot be read. Reading bytes fr om these address locations just returns 0x00. Figure 43: Mirrored Factory Registers For descriptions of all of these parameters, see Factory Trim and RFID Parameters . 0x63F WAKEMD MEASPTR[11:8] Addr. Bit 7 6 5 4 3 2 1 0 0x640 OSCTRIM[7:0] 0x641 LKALL ROSTRIM[4:0] 0x642 V0TRIM[4:0] 0x643 TSENTRIM[3:0] Addr. Bit 7 6 5 4 3 2 1 0

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description RFID Commands All of the RFID commands for the AS39513 follow the standard ISO15693 format. In general, each command has a request and a response. When powered, the RFID interface has three possible states: ready, quiet, an d selected, as sp ecified in the ISO15693 standard. Figure 44: ISO15693 State Diagram Note(s): 1. Duplicate of ISO15693-3 selected state diagram Any other Command where Select_flag is not set In Field Reset to ready Any other command where the Adddress_flag is set AND where Inventory_flag is not set Reset to Ready where Select_flag is set or Select (different UID) Any other command Select (UID) Stay quiet(UID) Out of Field Out of Field Out of Field Power-off Ready Quiet Select(UID) Stay quiet(UID) Selected

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Request Command Structure The Request Command Structure from the Reader is: where SOF is the ISO15693 start-of-frame, the Flags are the protocol control flags described below, the command code determines which command is being requested, UID is the unique identifier, parameters and data are zero or more bytes depending on the command, the CRC is the error check code, which is calculated in accordan ce with ISO15693-3 and EOF is the ISO15693 end-of-frame. The UID can be present or not present depending on the Flags settings. For the custom commands (command codes 0xA0 through 0xDF), the command code field will be followed immediately by an IC manufacturing code, which for the AS39513 is 0x36 for legacy reasons. Flags There are two types of request command flags used in ISO15693: inventory flags (abbreviated IFLAGS) and non-inventory flags (abbreviated NFLAGS). Their formats are as follows. The Inventory Flags are: where: SUBCAR – Sub-carrier selection. 0 = Use a single sub-carrier frequency in the response. 1 = Use two sub-carriers in the response. DRATE – Data rate selection. 0 = Use low data rate. 1 = Use high data rate. AFI – AFI field usage. Only 0 (no AFI field) is supported in the AS39513. NBSLOTS – Number of anti-collision slots. 0 = 16 slots. SOF Flags Command Code UID Parameters Data CRC EOF 8 bits 8 bits 64 bits n*8 bits m*8 bits 16 bits B i t 7 6 5 432 1 0 IFLAGS 0 OPTION NBSLOTS AFI 0 1 DRATE SUBCAR

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Inventory Command Flags Figure 45: Inventory Command Flags The Non-Inventory Flags are: where: SUBCAR – Sub-carrier selection. 0 = Use a single sub-carrier frequency in the response. 1 = Use two sub-carriers in the response. DRATE – Data rate selection. 0 = Use low data rate. 1 = Use high data rate. SELECT – Use selected or addressed tag. 0 = Command request will be executed according to the ADDR bit. 1 = Command request will be executed only if the AS39513 RFID interface is in the “select” state. The ADDR bit should be 0, and the UID field is not included in the request. ADDR – Addressing mode. 0 = Request is not addressed. The UID field is not used. The AS39513 always responds to the request. 1 = Request is address to a specific UID. The UID field is used, and the AS39513 responds only if its UID matches that in the command request. Flag Bits Flag Name Bit Value Meaning 0 1 b0 SUBCAR Single Double b1 DRATE Low High b2 Inventory X 1 for inventory b3 Protocol ext. Always 0 RFU b4 AFI Always 0 Not supported b5 NBSLOTS 16 slots 1 slot b6 OPTION Always 0 RFU b7 RFU Always 0 RFU Bit 7 6 5 4 3 2 1 0 NFLAGS 0 OPTION ADDR SELECT 0 0 DRATE SUBCAR

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description OPTION – Command option flag. The meaning of this bit depends on the command. If the command description below does not specify a meaning for th is bit, this flag is ignored. Non-Inventory Command Flags Figure 46: Non-Inventory Command Flags Command Response Structure The RFID command response structure also follows the standard ISO15693 format. The Response Structure from the Tag is: where SOF is the ISO15693 start-of-frame, the Flags are the protocol response flags described below, parameters and data are zero or more bytes depending on the command, the CRC is the error check code, and EOF is the ISO15693 end-of-frame. The Response Flags are: Flag Bits Flag Name Bit Value Meaning 0 1 b0 SUBCAR Single Double b1 DRATE Low High b2 Inventory 0 X b3 Protocol ext. Always 0 RFU b4 SELECT All tags Selected tag b5 ADDR Unaddressed Addressed b6 OPTION Command dependent Command dependent b7 RFU Always 0 RFU SOF Flags Parameters Data CRC EOF 8 bits n*8 bits m*8 bits 16 bits B i t 765 43 210 RFLAGS 000 E X T E N 0 00 E R R

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Where: ERR – Error flag. 0 = No error detected. 1 = Error detected. The normal command response parameters and data will be replaced with an 8-bit error code. EXTEN – Command extension enabled. This will always be 0 in the AS39513. When an error occurs, the response parameter and data fields will be replaced with a one-byte error code from the list below. The Response Structure from Tag in Error case is: Figure 47: Error Handling SOF Flags Error Code CRC EOF 8 bits 8 bits 16 bits Error Code Description 0x01 Command code invalid or not supported. 0x02 Command not recognized; format error. 0x03 Command option not supported. 0x0F Unknown error. 0x10 The specified block is no t available (doesnot exist). 0x11 The specified block is already locked and cannot be locked again. 0x12 The specified block is already locked and cannot be written. 0xA0 Incorrect password or memory access not opened. 0xA2 Battery measurement error. 0xA3 A/D conversion error. 0xA6 EEPROM collision.

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description The details of the AS39513 commands are given in the sections below. Inventory Command Inventory Command Request: Inventory Command Reply: After receiving an inventory request, the AS39513 responds with its data storage format identifier (DSFID) and its 64-bit unique identifier (UID), both of which are stored in EEPROM. One slot and multiple slots for anti-collision are supported. The parameters are a mask length, and a mask value. The mask length is one byte, and valid values are 0 to 60 when 16 slots are used and 0 to 64 when 1 slot is used. The length of the mask value is the number of bits specified in the mask length, rounded up to the nearest intege r number of bytes, with the MSBs padded with zeros as needed. The ISO 15693-3 specific ation, in section 9.2 2, describes a modulation ignore time (t mit) after the reception of an EOF from the reader. This is the time for which 10% modulation will be ignored after an EOF sequence. Manufacturers vary as to which commands implement this specif ication and how the ignore time varies by command. In the AS39513, the t mit parameter is only applied to the Inventory command. No modulation masking is used for any of the other commands. SOF Flags Command Mask Length Mask Value CRC EOF IFLAGS 0x01 8 bits 0 to 64 bits 16 bits SOF Flags DSFID UID CRC EOF RFLAGS 8 bits 64 bits 16 bits 2. For more information, please refer to the respective section of ISO/IEC 15693-3 specification (second edition, 2009-04-15).

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Stay Quiet Command Stay Quiet Command Request: There is no response to the st ay quiet command. The stay quiet command must be executed in addressed mode (In NFLAGS, SELECT = 0 and ADDR = 1), so the UID is mandatory. After receiving the stay quiet comman d, the AS39513 will remain in the quiet state until the device is reset, it receives a select request, or it receives a reset to ready request. In the quiet state, the device will not process any command where IFLAGS are used. It will process an addressed request. Read Block Command Read Block Command Request: Read Block Command Reply: The read block command reads four bytes from the EEPROM’s Application and Measurement areas. The starting byte address to read is 4*BADDR. If the OPTION flag is 1, a security status is returned. If the OPTION flag is 0, no security status is returned. In either case, the four bytes in the block are returned, lowest address and LSB first. The security status will be 0x00 if the block is not locked, and 0x01 if the block is locked either through the lock bits or the LKALL flag. SOF Flags Command UID CRC EOF NFLAGS* 0x02 64 bits 16 bits SOF Flags Command UID BADDR CRC EOF NFLAGS 0x20 64 bits 8 bits 16 bits SOF Flags Security Status Block Data CRC EOF RFLAGS 8 bits 4*8 bits 16 bits

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Write Block Command Write Block Command Request: Write Block Command Reply: The write block command writes the four bytes of Block Data to the EEPROM’s Application and Measurement areas. The starting byte address to write is 4*BADDR. The block data is sent lowest address and LSB first. In order to be written, the access state must allow access to the block being written, and the block must not have been locked. The OPTION flag controls the response timing according to the ISO 15693 standard, section 10.4.2 3. If the Option flag is set to 1 an error will be sent as the reply. Lock Block Command Lock Block Command Request: Lock Block Command Reply: The lock block command sets the bit in System EEPROM to mark as “read-only” the four-byte block beginning at 4*BADDR. No access passwords need to be set prior to using this command. The OPTION flag controls the response timing according to the ISO 15693 standard, section 10.4.3 3. SOF Flags Command UID BADDR Block Data CRC EOF NFLAGS 0x21 64 bits 8 bits 4*8 bits 16 bits SOF Flags CRC EOF RFLAGS 16 bits 3. For more information, please refer to the respective section of ISO/IEC 15693-3 specification (second edition, 2009-04-15). SOF Flags Command UID BADDR CRC EOF NFLAGS 0x22 64 bits 8 bits 16 bits SOF Flags CRC EOF RFLAGS 16 bits

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Read Multiple Blocks Command Read Multiple Blocks Command Request: Read Multiple Blocks Command Reply: The read multiple blocks command reads multiple four-byte blocks from the EEPROM’s Application and Measurement areas. The command reads NUMBLK+1 of blocks of data starting from block number BADDR. If the OPTION flag is 1, a security status is retu r n ed. I f th e O P TIO N fl ag is 0 , n o se cu r it y statu s is retu r n ed. In either case, the four bytes in each block are returned, lowest address and LSB first. The security status will be 0x00 if the block is not locked, and 0x01 if the block is locked. If the last byte to read would have an address that is greater than 0x3FF, error code 0x10 is returned and no data is read. SOF Flags Command UID BADDR NUMBLK CRC EOF NFLAGS 0x23 64 bits 8 bits 8 bits 16 bits SOF Flags Security Status Block Data CRC EOF RFLAGS 8 bits 4*8 bits 16 bits Repeat as needed

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Select Command Select Command Request: The select command must be executed in addressed mode (In NFLAGS, SELECT = 0 and ADDR = 1), so the UID is mandatory. There are three possible actions for the select command. 1. If the UID in the command is equal to the device UID, the AS39513 will enter the selected state and send the reply: 2. If the UID in the command is different from the device UID, and the device is in the selected state, the AS39513 will return to the ready stat e and not send a response. 3. If the UID in the command is different from the device UID, and the device is not in the selected state, the AS39513 will remain in its current state (ready or quiet) and not send a response. Reset-to-Ready Command Reset-to-Ready Command Request: Reset-to-Ready Command Reply: The reset-to-ready command take s the RFID state machine out of the quiet state and move s it into the ready state. SOF Flags Command UID CRC EOF NFLAGS 0x25 64 bits 16 bits SOF Flags CRC EOF RFLAGS 16 bits SOF Flags Command UID CRC EOF NFLAGS 0x26 64 bits 16 bits SOF Flags CRC EOF RFLAGS 16 bits

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Write AFI Command Write AFI Command Request: Write AFI Command Reply: The write AFI command writes the one byte application family identifier (AFI) to the EEPROM’s System area. In order to be written, the access state must allow access to the System memory, and the AFI must not have been locked. The OPTION flag controls the response timing according to the ISO 15693 standard, section 10.4.8 4. Lock AFI Command Lock AFI Command Request: Lock AFI Command Reply: The lock AFI command sets the bit in System EEPROM, AFI_LK, to mark as “read-only” the one-byte AFI value. No access passwords need to be set prior to using this command. The OPTION flag controls the response timing according to the ISO 15693 standard, section 10.4.9 4. SOF Flags Command UID AFI CRC EOF NFLAGS 0x27 64 bits 8 bits 16 bits SOF Flags CRC EOF RFLAGS 16 bits 4. For more information, please refer to the respective section of ISO/IEC 15693-3 specification (second edition, 2009-04-15). SOF Flags Command UID CRC EOF NFLAGS 0x28 64 bits 16 bits SOF Flags CRC EOF RFLAGS 16 bits

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Write DSFID Command Write DSFID Command Request: Write DSFID Command Reply: The write DSFID command writes the one byte data storage format identifier (DSFID) to the EEPROM’s System area. In order to be written, the access state must allow access to the System memory, and the DSFID must not have been locked. The OPTION flag controls the response timing according to the ISO 15693 standard, section 10.4.10 5. Lock DSFID Command Lock DSFID Command Request: Lock DSFID Command Reply: The lock DSFID command sets the bit in System EEPROM, DSFID_LK, to mark as “read-only” the one-byte DSFID value. No access passwords need to be set prior to using this command. The OPTION flag controls the response timing according to the ISO 15693 standard, section 10.4.11 5. SOF Flags Command UID DSFID CRC EOF NFLAGS 0x29 64 bits 8 bits 16 bits SOF Flags CRC EOF RFLAGS 16 bits 5. For more information, please refer to the respective section of ISO/IEC 15693-3 specification (second edition, 2009-04-15). SOF Flags Command UID CRC EOF NFLAGS 0x2A 64 bits 16 bits SOF Flags CRC EOF RFLAGS 16 bits

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Get System Info Command Get System Info Command Request: Get System Info Command Reply: The system info command returns a number of the system parameters, including the UID, DSFID, AFI, memory size (MemSz), and chip revision (CHIPREV). The memory size is formatted in a two-byte word as shown below. Memory Size Format where: BLOCKCNT[7:0] – Number of memory blocks minus 1. 0xFF indicates 256 blocks, 0x00 indicates 1 block. BLOCKSZ[4:0] – Block size in bytes minus 1. 0x1F indicates a 32-byte block, 0x00 indicates a 1 byte block. The chip revision is an 8-bit value that is programmed in the EEPROM in production at the factory. SOF Flags Command UID CRC EOF NFLAGS 0x2B 64 bits 16 bits SOF Flags Info UID DSFID AFI MemSz CHIPREV CRC EOF RFLAGS 0x0F 64 bits 8 bits 8 bits 16 bits 8 bits 16 bits B i t 1 5 1 4 1 3 1 2 1 1 1 0 9876543210 MemSz 0 0 0 BLOCKSZ[4:0] BLOCKCNT[7:0]

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Set Access Command Set Access Command Request: Set Access Command Reply: The set access command opens a specific type of EEPROM area to be available for writing. Three of the four types of area access can be set with this command : System, Application, and Measurement. (The Factory areas can only be accessed through the SPI, except for limited an d specific commands like Set Password and Lock Block.) The access level field, Level, has the format below. Note, it is only necessar y to first send a Set Access command before a Write command if the password is non zero for a particular EEPROM area. Access Level Field where: ALEV[1:0] – Access level. 0 = Not allowed. 1 = System access level. 2 = Application access level. 3 = Measurement access level. Each access level is independent, and only affects write operations. If the set access command for a given level has the correct 32-bit password, the access for writing to that level is opened. The access remains open until the RF field is removed. (The access will close with the loss of RF field even if the logic is continuously powered by an external battery.) If the set access command has an incorrect password, an incorrect password error (error code 0xA0) is returned. The default passwords for an unprogrammed device are 0x00000000. The password values themselves are stored and EEPROM and can be written with the Set Password command below. SOF Flags Command IC Mfg. UID Level Password CRC EOF NFLAGS 0xA0 0x36 64 bits 8 bits 4*8 bits 16 bits SOF Flags CRC EOF RFLAGS 16 bits B i t 76543210 Level 000000 A L E V [ 1 : 0 ]

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Set Password Command Set Password Command Request: Set Password Command Reply: The Access Level Field Level has the Format Below: where: ALEV[1:0] – Access level. 0 = Not allowed. 1 = System access level. 2 = Application access level. 3 = Measurement access level. The set password command changes the password for the access level specified in ALEV, but only if the access to that level has been opened by the Set Access command. For example, to write the System password, system access must be allowed. If an attempt is made to set a password for an access level that is not open, the AS39513 will respond with an error code 0xA0. SOF Flags Command IC Mfg. UID Level Password CRC EOF NFLAGS 0xA1 0x36 64 bits 8 bits 4*8 bits 16 bits SOF Flags Access CRC EOF RFLAGS 8 bits 16 bits B i t 76543210 Level 000000 A L E V [ 1 : 0 ]

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Read System Block Command Read System Block Command Request: Read System Block Command Reply: The read system block command reads four bytes from the EEPROM and register System areas. The starting byte address to read is 0x400 + 4*BADDR. If the OPTION flag is 1, a security status is returned. If the OPTION flag is 0, no security status is returned. In either case, the four bytes in the block are returned, lowest address and LSB first. The security status will always be 0x00 because the System and Factory areas do not have lock bits. If the block address BADDR corresponds to a Factory access area, the error code 0x10 (specified block not available) will be returned instead of the block data. SOF Flags Command IC Mfg. UID BADDR CRC EOF NFLAGS 0xA2 0x36 64 bits 8 bits 16 bits SOF Flags Security Status Block Data CRC EOF RFLAGS 8 bits 4*8 bits 16 bits

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Write System Block Command Write System Block Command Request: Write System Block Command Reply: The write system block command writes the four bytes of Block Data to the EEPROM and register System areas. The starting byte address to write is 0x400 + 4*BADDR. The block data is sent lowest address and LSB first. In order to be written, the access state must allow access to the block being written. The OPTION flag controls the response timing according to the ISO 15693 standard for the Write Block command, section 10.4.2 6. If the Option flag is set to 1 an error will be sent as the reply. SOF Flags Command IC Mfg. UID BADDR Block Data CRC EOF NFLAGS 0xA3 0x36 64 bits 8 bits 4*8 bits 16 bits SOF Flags CRC EOF RFLAGS 16 bits 6. For more information, please refer to the respective section of ISO/IEC 15693-3 specification (second edition, 2009-04-15).

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Read Multiple System Blocks Command Read Multiple System Blocks Command Request: Read Multiple System Blocks Command Reply: The read multiple blocks command reads multiple four-byte blocks from the EEPROM and register System areas. The starting byte address to read is 0x400 + 4*BADDR. The last byte read will be at the address 0x403 + 4*(BADDR + NUMBLK). If the OPTION flag is 1, a security status is returned. If the OPTION flag is 0, no security status is returned. In either case, the four bytes in each block are returned, lowest address and LSB first. The security status will always be 0x00 because the System and Factory areas do not have lock bits. If the block address BADDR corresponds to a Factory access area, the data will simply read back as all zeros with no error. SOF Flags Command IC Mfg. UID BADDR NUMBLK CRC EOF NFLAGS 0xA4 0x36 64 bits 8 bits 8 bits 16 bits SOF Flags Security Status Block Data CRC EOF RFLAGS 8 bits 4*8 bits 16 bits Repeat as needed

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Lock All Blocks Command Lock All Blocks Command Request: Lock All Blocks Command Reply: The lock all blocks command se ts the LKALL bit in System EEPROM to mark as “read-only” the entire Measurement area of the EEPROM. (The Application area is not locked by this bit.) No access passwords need to be set prior to using this command. The OPTION flag controls the response timing according to the ISO 15693 standard, section 10.4.3 7. Set Mode Command Set Mode Command Request: Set Mode Command Reply: The Set Mode command can change the mode of the chip directly to ACTIVE mode (where logging events can take place) or initially to a WAIT mode (where there is a programmed delay before entering ACTIVE mode). This is the key command to start logging. SOF Flags Command IC Mfg. UID CRC EOF NFLAGS 0xA6 0x36 64 bits 16 bits SOF Flags CRC EOF RFLAGS 16 bits 7. For more information, please refer to the respective section of ISO/IEC 15693-3 specification (second edition, 2009-04-15). SOF Flags Command IC Mfg. UID Mode CRC EOF NFLAGS 0xA8 0x36 64 bits 8 bits 16 bits SOF Flags CRC EOF RFLAGS 16 bits

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description The Set Mode command sets the controller mode according to the value in the Mode parameter. The format of the Mode parameter is below. Mode Parameter Format where: CMODE[1:0] – New controller mode. 0 = Go to the Idle mode. 1 = Go to the Wait mode. 2 or 3 = Go to the Active mode. The OPTION flag controls the response timing in a manner similar to the ISO 15693 standard for the Write Block command, section 10.4.2 8. If OPTION = 0, the change in mode will occur after the EOF in the command request, using the same delay as in 10.4.2. The response will be at the completion of the mode change, which can vary depending on the transition. If OPTION = 1, the response will be immediately after the EOF and it will not wait for the comp letion of the mode transition. Do Measurement Command Do Measurement Command Request: Do Measurement Command Reply: B i t 76543210 Level 000000 C M O D E [ 1 : 0 ] 8. For more information, please refer to the respective section of ISO/IEC 15693-3 specification (second edition, 2009-04-15). SOF Flags Command IC Mfg. UID Meas CRC EOF NFLAGS 0xA9 0x36 64 bits 8 bits 16 bits SOF Flags ADC CRC EOF RFLAGS 16 bits 16 bits

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description The do measurement command initiates a specific measurement outside the normal logging loop. The command reply will wait for the ADC conversion to complete. The ADC algorithm will use a mode that always takes the same amount of time for a given oscillator clock frequency, independent of the conversion value. The format of the Meas parameter is below. Measurement Parameter Format where: DOMEAS[1:0] – Measurement type to initiate. 0 = Do a temperature measurement. 1 = Do a battery level measurement. 2 = Do a sensor measurement. 3 = Reserved; do not use. Note the Do Measurement -Temperature command results in some self heating of the chip due to the presence of the RF field from the reader, so temperature accuracy cannot be guaranteed with this command. Temperature sensing is intended to be carried out in logging mode. The do measurement command returns the 10-bit ADC result, formatted in a two-byte word as shown below, ADC Result Format where: ADC_RES[9:0] – ADC measurement result. An example of a “good” reply is 0x0001AC (where 00 => no error in RFLAGs, and 01AC => ADC data). An ADC error reply is 01A3 (where 01 => error indicated in RFLAGS, A3 => ADC error code) B i t 76543210 Meas 000000D O M E A S [ 1 : 0 ] B i t 1 5 1 4 1 3 1 2 1 1 1 0 9876543210 ADC 000000 A D C _ R E S [ 9 : 0 ]

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Get Log Status Command Get Log Status Command Request: Get Log Status Command Reply: The get log status command returns the current value of the status bits, in the format shown below, Status Bits Format where: OVLIM – Limit count threshold exceeded. 0 = No limit count thresholds exceeded. 1 = One of the eight limit count thresholds have been exceeded. ACTPOR – Active wakeup after power-up reset. 0 = The AS39513 has not had a reset direct to ACTIVE mode event. 1 = The AS39513 has had a power on reset occur when WAKEMD = 1 and ACTIVE = 1. LOWBAT – Low battery condition. 0 = No low battery condition measured. 1 = The battery check operation (BATCHK = 1) resulted in a low battery indication. ADCERR – ADC error flag. 0 = No ADC error has occurred. 1 = An ADC error has occurred, either from an input signal out of range or a poorly chosen combination of reference voltage settings. OVWRT – Measurement overwrite flag. 0 = No measurements have been overwritten. 1 = At least one measurement has been overwritten. SOF Flags Command IC Mfg. UID CRC EOF NFLAGS 0xAA 0x36 64 bits 16 bits SOF Flags Log Stat CRC EOF RFLAGS 8 bits 16 bits Bit 7 6 5 4 3 2 1 0 Log Stat ACTIVE EEFULL OVWRT ADCERR LOWBAT ACTPOR 0 OVLIM

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description EEFULL – The EEPROM is full. 0 = More measurements can be logged. 1 = At least one measurement was not logged due to a lack of EEPROM space. ACTIVE – Controller state. 0 = Controller is in the IDLE or WAIT modes. 1 = Controller is in the ACTIVE mode. Security Levels The security level has mainly to do with what area of memory is being accessed rather than wh ich command is accessing it. See section Memory Access Levels . A couple of columns from the table can be eliminated with the following statements:

• All RFID commands can be used in the IDLE, WAIT, and ACTIVE states, but not during LOGGING or initialization.
• The only command that changes the log controller state is “Set Mode”.
• The ISO15693 state (Ready, Quiet, Selected) is independent of the log controller state (IDLE, WAIT, etc.) Figure 48: Summary of Security Levels Command Command Code Security Level Definition Inventory 0x01 None Tag identification, anticollision. Stay Quiet 0x02 None Stop responding; reader is communicating with other tags. Read Block 0x20 None Read the reques ted block from application or measurement memory. Write Block 0x21 A, M Write to the re quested block in application or measurement memory. Lock Block 0x22 None Mark a block in application or measurement memory as read only. Read Multiple Blocks 0x23 None Read multiple blocks from the application or measurement memory. Select 0x25 None Tag singulation. Reset to Ready 0x26 None Move tag out of quiet state. Write AFI 0x27 S Write AFI field. Lock AFI 0x28 None Prevent further writes to AFI field. Write DSFID 0x29 S Write DSFID field.

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description The access security levels are: A = Application access required to access application area of EEPROM. M = Measurement access required to access measurement area of EEPROM. S = System access required to access system area of EEPROM. Figure 49: Security Levels Lock DSFID 0x2A None Prevent further writes to DSFID field. Get System Info 0x2B None Return RFID system parameters. Set Access 0xA0 None Enable application, measurement, or system access with correct password. Set Password 0xA1 A, M, S Write a new password. Read System Block 0xA2 None Read the requested block from system memory. Write System Block 0xA3 S Write to the requested block in system memory. Read Multiple System Blocks 0xA4 None Read mu ltiple blocks from the system memory. Lock All Blocks 0xA6 None Mark all measurement blocks as read only. Do Measurement 0xA9 None Do an ADC measurement of one of the sensors. Set Mode 0xA8 None Change the controller state. Get Log Status 0xAA None Read the log controller status flags. Security Level Password Access None No All open S System Password System area A Application Password Application area M Measurement Password Measurement area Command Command Code Security Level Definition

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description SPI Commands The AS39513 has a serial peripheral interface (SPI) bus that enable full and unlimited EEPROM access. Its primary purpose is production calibration and UID programming, but it could also be used by an applicatio n to configure the chip during device test. The SPI bus uses four digital signals. Three of these signals are inputs: CE (SPI chip enable), SCLK (SPI clock), and DIN (SPI data input). One is an output: DOUT (SPI data output). The CE signal enables the SPI interface when high. (When CE is low, the DIN/DOUT pins are used by other application functions unless the SPI direct command “Set IO Mode” has locked the device in SPI mode). The CE in put includes an R D=100k ohm pull down to ground. If driven externally the CE pin should have a 1nF capacitor connected to ground. The SCLK is used to control the timing of the output data and determine when to capture the input data. The maximum SCLK clock frequency f SLCK is 100kHz. The SCLK input includes an R D= 100k ohm pull down to ground. DIN data is captured on the falling edge of SCLK. DOUT data will change on the rising edge of SCLK. The DIN input can be configured to have an R D=100k ohm pull down to ground or RU=30k ohm pull up resistor. See DIMD[1:0]. When CE is set high, a delay time is needed to allow the on-chip high-speed clock and the digital supply regulators to wake up. (If the device is locked in SPI mode through the “Set IO Mode” direct command, this delay is much shorter since the high-speed clock and regulators remain active.) The SPI interface also needs to check that DOUT is low. If DOUT is high, this is a busy signal that indicates that the interface is not ready to receive SPI commands. Once there has been sufficient delay and DOUT is low, the command and any additional input data are clocked in, MSB first, using SCLK and DIN. Fo r commands with a response, the DOUT pin will go high to indicate data is ready, and then SCLK pulses are used to clock out the data on DOUT. For write commands, DOUT pin acts as a memory busy indicator, going high while the write is in progress. Commands are not intended to be chained, that is, CE is expected to go low after each command. If a command requires additional processing time after CE goes low, such as an EEPROM write, the processing continues and the regulators and high-speed clock are not shut down until the command is processed. All SPI commands and data ar e grouped along 8-bit byte boundaries. There are three types of commands: write commands, read commands, and direct commands. The two MSBs in the 8 or 16-bit command word selects the command type. Each command type is described below.

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Write Command The write command is used to write to both EEPROM and on-chip registers that are memory mapped. The Write Command Format is below: where: ADDR[10:0] – Address of the memory to write to. See the description of the memory map below for details on what is mapped to the various memory addresses. The write command word will be followed by one or more bytes of data. The first byte will be written to address ADDR, the second at ADDR+1, and so on. Note that the EEPROM architecture can only write to one 16-byte page at a time. Care must be taken to limit the numb er of data bytes in the Write Command such that the page boundary is not passed. Specifically, the number of data bytes must be less than or equal to 16 – ADDR[3:0]. If the number of bytes written would go beyond the page boundary at address { ADDR[10:4], 4’b1111 }, then the address counter will effectively wrap around to the start of the page boundary at { ADDR[10:4], 4’b0000 } and overwrite bytes at the start of the page. The actual write operation is in itiated by setting CE low. The DOUT pin will go high when the write is beginning. If SPI mode has been enabled via the direct command “Set IO Mode” , the DOUT pin will go low when the write is complete. (If the SPI mode direct command has not se t the device to stay in SPI mode, the DOUT pin will revert to its non-SPI mode value when the write is complete.) As example, the signals for a one-byte write are shown below. Figure 50: One-Byte Write B i t 1 5 1 4 1 3 1 2 1 1 1 0 9876543210 Write 0 0 0 0 0 ADDR[10:0] CE SCLK DIN DOUT A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D00000 0

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description Read Command The read command is used to read from both EEPROM and on-chip registers that are memory mapped. The Read Command Format is below: where: ADDR[10:0] – Address of the memory to read from. See the description of the memory map below for details on what is mapped to the various memory addresses. After the read command word is complete, DOUT will go high when the read operation is ready. SCLK should then be pulsed 8 times for each byte of data, and the data will be output on DOUT. The output data will be stable on the falling edge of SCLK. The first byte will be read from ADDR, the second byte from ADDR+1, and so on. There is no limit to the number of bytes that can be read. For example, the signals for a one-byte read are shown below. The read operation is completed when CE goes low. As example, the signals for a one-byte read are shown below. Figure 51: One-Byte Read B i t 1 5 1 4 1 3 1 2 1 1 1 0 9876543210 Read 0 1 0 0 0 ADDR[10:0] CE SCLK DIN DOUT A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 0100 0

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Detailed Description Direct Commands The direct commands are used for operations that are not directly related or conveniently mapped to the memory. The Direct Command Format is below: where: DCOM[2:0] – Direct command index. See the table below. DPARAM[2:0] – Direct command parameter. Its use is command dependent as described in the table below. The direct commands that are available are listed in the table below. Figure 52: Direct Commands B i t 76543210 Direct Command 1 1 DCOM[2:0] DPARAM[2:0] DCOM Command Description 3’b000 Reset Create a master reset pulse that, like a POR, will reset all internal registers and cause the calibrations registers to be loaded from EEPROM. The DOUT signal will go high when the reset takes effect and will remain high while the calibration registers are loaded. This is implemented by generating a rising edge on the trig_rst input to the AFE. 3’b001 Set IO Mode Force the digital I/O into a fixed state. The I/O will remain in that state until a reset or changed by another command. The I/O state is set by DPARAM, with the following values: 3’b000 = Application mode. 3’b001 = SPI mode. (Also forces 1.92 MHz clock to stay running.) 3’b010 = Scan mode (requires factory access). 3’b010 Read Hardware ID Reads the one-byte hard-coded hardware identifier. DPARAM is ignored. The following identifiers are defined: 8’h11 = AS39513 version 2.0. 3’b100 Set Mode Duplicates the functionality of the RFID Set Mode command. (See that command for more details.) The CMODE[1:0] parameter for the Set Mode command is taken from DPARAM[1:0].

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Detailed Description For direct commands that do not have a response, the signals are as illustrated below. Figure 53: Direct Commands Without Response When a direct command has a response, the signaling is similar to the Read command, as shown below. 3’b110 Do Measurement Duplicates the functionality of the RFID Do Measurement command. (See that command for more details.) Before sending this Direct command it is necessary to send a Reset Direct command via SPI. The DOMEAS[1:0] parameter for the Do Measurement command is taken from DPARAM[1:0]. The response is the same 16-bit format as the RFID Do Measurement command, unless there is an ADC error. In the case of an ADC error, 16’hA300 is returned. Note if TV2SET<TV1SET-1 which is not a valid configuration, a Do Measurement command via SPI will result in 0x0000 being read; the ADC error code 0xA300 is not returned in this particular case. 3’b111 Get Log Status Duplicates the functionality of the RFID Get Log Status command. (See that command for more details.) The response is the same 8-bit format as the RFID Get Log Status command. DCOM Command Description CE SCLK DIN DOUT P2 P1 P011 C 2 C 1 C0

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Package Drawings & Markings Figure 65: Package Outline Drawings Gold-Bumped Die (SW) Note(s): 1. All dimensions are in μm. Package Drawings & Markings Green RoHS Die Thickness: 300μm ± 10μm Au bump height: 15μm ± 3μm

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Ordering & Contact Information Figure 66:

Ordering Information

Ordering Information: Order quantities should be a multiple of shipping form. Note(s): 1. Limited quantities of gold bumped die are also available as engineering samples in waffle packs (1 waffle pack = 50 gold bum ped die). Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbader Strasse 30

8141 Premstaetten

Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Ordering Code Package Marking Delivery Form Delivery Quantity AS39513-ZSWF-30 Gold bumped wafer(1) (3V trimmed) NA Sorted and sawn wafer on foil 1 wafer = ca. 3200 good die AS39513-ZSWF-15 Gold bumped wafer(1) (1.5V trimmed) NA Sorted and sawn wafer on foil 1 wafer = ca. 3200 good die Ordering & Contact Information

[v1-10] 2018-Apr-25 Document Feedback AS39513 − RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specif ied lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are unde rway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to prov ide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. RoHS Compliant & ams Green Statement

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used with out the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appe aring in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding th e information set forth herein. ams AG reserves the right to ch ange specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applic ations requiring extended temperature range, unusual environmental requirements, or high reliability applications , such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any th ird party shall arise or flow out of ams AG rendering of technical or other services. Copyrights & Disclaimer

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Document Status Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Document Status

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Revision Information Note(s): 1. Page and figure numbers for the previous version may diff er from page and figure numbers in the current revision. 2. Correction of typographical er rors is not explicitly mentioned. Changes from 1-00 (2017-Dec-06) to current revision 1-10 (2018-Apr-25) Page Updated Figure 1 1 Updated text under Pin and Pad Layout 4 Updated Figure 4 4 Updated Figure 5 6 Updated Figure 6 8 Updated Figure 7 10 Updated Figure 8 10 Updated text under Detailed Description 11 Updated text under Power Management 11 Updated text under Energy Harvesting 11 Updated text under Real-Time Clock (RTC) 12 Updated text under Temperature Sensor and External Sensor 13 Updated text under Initializing the Chip 16 Updated text under Battery Check 19 Updated text under Power Modes 24 Updated text under Logging Timer 26 Updated text under ADC Output and Range for Temperature Measurement 37 Updated EQ8 and EQ9 under ADC Output and Range for Battery Measurement 39 Updated text under ADC Output and Range for External Sensor Measurement 39 Updated Figure 30 to DOSRC[1:0]: DOUT Functional Options: Digital Output Source (when not in SPI communication). 41 Updated Figure 36 and parameter BATCHK under it 53 Updated text under Mirrored System Registers 65 Updated text under SPI Commands 91 Updated Figure 65 101 Updated Figure 66 102 Revision Information

[v1-10] 2018-Apr-25 Document Feedback AS39513 − Content Guide

1 General Description

1 Key Benefits & Features

2 Applications

3 Block Diagram

4 Pin and Pad Layout

4 Pin Description

6A b s o l u t e M a x i m u m R a t i n g s

8 Electrical Characteristics

11 Detailed Description

11 Power Management

11 Energy Harvesting

11 Analog Front End (AFE)

12 Processing and Digital Control

12 Slave Serial Interface (SPI-like)

12 Real-Time Clock (RTC)

13 Temperature Sensor

13 External Sensor

13 Analog to Digital Converter

14 Data Protection

15 System Description & Modes of Operation

16 Initializing the Chip

16 RESET Mode

17 IDLE Mode

17 WAIT Mode

18 ACTIVE Mode

18 COMMAND Mode

18 LOGGING Mode

25 Data Log Functions

25 Storage Mode

26 Logging Timer

26 Delay Time

27 Manual Log Start

27 Logging Mode Data Formats

33 Analog to Digital Conversion

34 Reference Voltage Generator

35 ADC Scaling

37 ADC Output and Range fo r Temperature Measurement

39 ADC Output and Range for Battery Measurement

39 ADC Output and Range for External Sensor Measure-

40 GPIO

42 Memory Map

44 Memory Access Levels

47 System EEPROM

47 Global System Parameters

49 Temperature Sensor Parameters

51 External Sensor Parameters

52 Logging Control Parameters

Document Feedback [v1-10] 2018-Apr-25 AS39513 − Content Guide

61 Factory EEPROM

61 Factory Trim and RFID Parameters

63 Passwords

64 Memory Lock Bits

65 System Registers

65 Mirrored System Registers

66 Factory Registers

66 Mirrored Factory Registers

67 RFID Commands

68 Request Command Structure

69 Inventory Command Flags

70 Non-Inventory Command Flags

70 Command Response Structure

72 Inventory Command

73 Stay Quiet Command

73 Read Block Command

74 Write Block Command

74 Lock Block Command

75 Read Multiple Blocks Command

76 Select Command

76 Reset-to-Ready Command

77 Write AFI Command

77 Lock AFI Command

78 Write DSFID Command

78 Lock DSFID Command

79 Get System Info Command

80 Set Access Command

81 Set Password Command

82 Read System Block Command

83 Write System Block Command

84 Read Multiple System Blocks Command

85 Lock All Blocks Command

85 Set Mode Command

86 Do Measurement Command

88 Get Log Status Command

89 Security Levels

91 SPI Commands

92 Write Command

93 Read Command

94 Direct Commands

96 SPI Timing

103 RoHS Compliant & ams Green Statement

104 Copyrights & Disclaimer

105 Document Status