APM0866-P29_17 ASB | Alldatasheet
Document overview
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Technical content
Features
Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. Website: www.asb.co.kr E-mail: sales@asb.co.kr Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 More Information 1-stage Single Type
- S21 = 32.2 dB @ 865 MHz = 31.8 dB @ 868 MHz
- NF of 6.6 dB over Frequency
- Unconditionally Stable
- Single 5V Supply
- High OIP3 @ Low Current
Description
- S21 = 32.2 dB @ 865 MHz = 31.8 dB @ 868 MHz
- NF of 6.6 dB over Frequency
- Unconditionally Stable
- Single 5V Supply
- High OIP3 @ Low Current Typ. @ T = 25C, Vs = 5 V, Freq. = 866.5 MHz, Zo.sys = 50 ohm Specifications (in Production) APM0866-P29 ASB Inc. (Top View) Solder Stencil Area Ø 0.3 plated thru holes to ground plane (Side View) 2 x Ø 2.0 plated thru holes to screw on heat sinker (Recommended Footprint) (Bottom View) plerow Outline Drawing (Unit: mm) The plerow TM APM-Series is an internally matched amplifier mini -module for such application band in SMD package with the output P1dB of 29 dBm. It is compactly designed for low current consum ption and high OIP3. Integrating all the components for biasing and matching within the module e nhances production yield and throughput as well. It passes through the stringent DC, RF, and reliability tests. Not sample test but 100% quality control test is made before packing.
2/5 www.asb.co.kr August 2017 plerowTM APM0866-P29 High OIP3 Medium Power Amplifier Module S-parameters OIP3 P1dB 865~868 MHz +5 V Stability Factor (K) Typical Performance (Measured) Noise Figure
3/5 www.asb.co.kr August 2017 plerowTM APM0866-P29 High OIP3 Medium Power Amplifier Module Output Channel Power (@ ACLR=-45dBc, +/-5MHz Offset) ** Test Source : Agilent E4433B (3GPP W-CDMA Test Model-1 64DPCH) OIP3 vs Output Power (@ 1MHz offset, 1-tone power) ACLR vs Channel Power
4/5 www.asb.co.kr August 2017 plerowTM APM0866-P29 High OIP3 Medium Power Amplifier Module 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The ca- pacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. 2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are in clud- ed inside the APM module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application fr e- quency. Copyright 2009-2017 ASB Inc. All rights reserved. Datasheet subject to change without notice. ASB assumes no re- sponsibility for any errors which may appear in this datasheet. No part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of ASB. Application Circuit Recommended Soldering Reflow Process 20~40 sec 260C 200C 150C 60~180 sec Ramp-up (3˚C/sec) Ramp-down (6C/sec) + - APM OUT IN C1 C2 VS Tantal or MLC (Multi Layer Ceramic) Capacitor IN OUT Vs Evaluation Board Layout Size 40x40mm (for APM Series – 10x10mm)
5/5 www.asb.co.kr August 2017 plerowTM APM0866-P29 High OIP3 Medium Power Amplifier Module Channel Power vs. ACLR Test Configuration APM0866 – P29 Evaluation Board attached with Heat Sink Evaluation Board * In order to prevent damage of D.U.T (APM -Series) from heating, you must to use a properly sized heat sink for testing a module.