ALE2350T2_13 ASB | Alldatasheet
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Technical content
1/3 www.asb.co.kr July 2009 plerowTM ALE2350T2 Internally Matched LNA Module The plerow TM ALN-series is the compactly designed surface -mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wireless (C DMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite commun i- cation terminals, CATV and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept more than un ity over the application band in order to ensure its unconditionally stable implementation to the application system environment. The surface -mount module package including the completed matching circuit and other components necessary just in case allows v ery simple and convenient implementation onto the system board in mass production level. Parameter Unit Specifications Min Typ Max Frequency Range MHz 2300 2400 Gain dB 23.5 24.5 Gain Flatness dB 0.3 0.4 Noise Figure dB 0.75 0.80 Output IP3 (1) dBm 39 42 Output P1dB dBm 23 24 Switching Time (3) sec - Supply Current mA 200 220 Supply Voltage V 5 Impedance 50 Max. RF Input Power dBm C.W 29~31 (before fail) Package Type & Size mm Surface Mount Type, 10Wx10Lx3.8H Operating temperature is -40C to +85C. 1) OIP3 is measured with two tones at an output power of 7 dBm/tone separated by 1 MHz. 2) S11/S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS. Pin Number Function
2 RF In
5 RF Out
Outline Drawing (Unit: mm)
- S21 = 24.8 dB@2300 MHz = 24.2 dB@2400 MHz
- NF of 0.75 dB over Frequency
- Unconditionally Stable
- Single 5V Supply
- High OIP3@Low Current Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. (Recommended Footprint) ALE2350T2 ASB Inc. (Top View) (Bottom View) Ø 0.4 plated thru holes to ground plane plerow (Side View) Solder Stencil Area C o u pl er Website: www.asb.co.kr E-mail: sales@asb.co.kr Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 More Information C o u pl er C o u pl er C o u pl er C o u pl er 2-stage Single Type Specifications (in Production) Typ.@T = 25C, Vs = 5 V, Freq. = 2350 MHz, Zo.sys = 50 ohms Features Description
2/3 www.asb.co.kr July 2009 plerowTM ALE2350T2 Internally Matched LNA Module S-parameters Noise Figure OIP3 P1dB 2300~2400 MHz +5 V Typical Performance (Measured) S-parameters & K Factor
3/3 www.asb.co.kr July 2009 plerowTM ALE2350T2 Internally Matched LNA Module 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The ca- pacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. 2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are inclu d- ed inside the ALE module. Therefore, C1 & C2 capa citors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application fr e- quency. Application Circuit Recommended Soldering Reflow Process 20~40 sec 260C 200C 150C 60~180 sec Ramp-up (3˚C/sec) Ramp-down (6C/sec) + - ALE OUT IN C1 C2 VS Tantal or MLC (Multi Layer Ceramic) Capacitor IN OUT Vs Size 25x25mm (for ALE-T Series – 10x10mm) Evaluation Board Layout