AM1

AM1 WJCI | Alldatasheet

Document overview

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Technical content

Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 1 of 6 June 2006 AM1 High Dynamic Range Gain Block Product Information The Communications Edge TM Product Features x 60 – 3000 MHz x 14 dB Gain x 2.4 dB Noise Figure x +39 dBm OIP3 x Single +3.3 or +4.5 Supply x Internally matched to 50 : x Lead-free/Green/RoHS- compliant SOT-89 Package x MTTF > 1000 years

Applications

x Defense / Homeland Security x Fixed Wireless Product Description The AM1 is a general-purpose gain block that offers good dynamic range and low noise figure in a low-cost surface- mount package. The combination of near-constant OIP3 and low noise figure performance over frequency makes it attractive for both narrowband and broadband applications. The device combines dependable performance with superb quality to maintain MTTF values exceeding 1000 years at mounting temperatures of +85 qC and is available in the environmentally-friendly lead-free/green/RoHS-compliant SOT-89 package. The AM1 uses a high reliability GaAs MMIC technology and only requires DC-blocking and bypass capacitors, and an inductive RF choke for operation. Internal matching provides a 50 ohm input / output impedance minimizing the number of required external components. The broadband MMIC amplifier is well suited for various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the AM1 will work for other applications within the 60 to 3000 MHz frequency range such as fixed wireless. Functional Diagram RF IN GND RF OUT GND 1 2 3 Function Pin No. Input 1 Output/Bias 3 Ground 2, 4 Specifications (1) Parameter Units Min Typ Max Operational Bandwidth MHz 60 3000 Test Frequency MHz 800 Gain dB 13 14 16 Input Return Loss (5) dB 8.5 Output Return Loss dB 20 Output P1dB dBm +18 Output IP3 (2) dBm +36 +39 Noise Figure (3) dB 2.4 Operating Current Range mA 55 78 100 Supply Voltage V 4.5 1. Test conditions unless otherwise noted: T = 25 ºC, 50 system. 2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 10 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Noise figure can be optimized by matching the input for optimal return loss. Absolute Maximum Rating Parameter Rating Operating Case Temperature -40 to +85 qC Storage Temperature -55 to +150 qC DC Voltage +5.5 V RF Input Power (continuous) +7 dBm Junction Temperature +220 qC Operation of this device above any of these parameters may cause permanent damage. Typical Performance (4) Parameter Units Typical Frequency MHz 900 1900 900 1900 S21 dB 14 12.8 14 12.5 S11 (5) dB -10 -9 -10 -9 S22 dB -27 -22 -28 -19 Output P1dB dBm +18 +18 +16 +16 Output IP3 dBm +39 +39 +38 +38 Noise Figure dB 2.4 2.6 2.3 2.6 Supply Voltage V +4.5 +3.3 Device Current mA 78 75 4. Parameters reflect performance in an AM1-PCB application circuit, as shown on page 4. 5. Input return loss can be dramatically improved (<-20 dB) for narrowband applications as shown on page 5 of this datasheet.

Ordering Information

Part No. Description AM1-G High Dynamic Range Gain Block (lead-free/green/RoHS-compliant SOT-89 Pkg) AM1-PCB 0.8 – 2.6 GHz Fully Assembled Application Circuit

Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 2 of 6 June 2006 AM1 High Dynamic Range Gain Block Product Information The Communications Edge TM Typical Device Data S-Parameters (VDS = +4.5 V, IDS = 78mA, T = 25 C, 50 ohm system) Input return loss can be improved with the appropriate input matching network shown later in this datasheet. Gain vs. Frequency 0 500 1000 1500 2000 2500 3000 Frequency (MHz) Gain (dB) -40c +25c +85c S11 vs. Frequency -30 -25 -20 -15 -10 0 500 1000 1500 2000 2500 3000 Frequency (MHz) S11 (dB) -40c +25c +85c S22 vs. Frequency -40 -30 -20 -10 0 500 1000 1500 2000 2500 3000 Frequency (MHz) S22 (dB) -40c +25c +85c Noise Figure vs. Frequency 0 500 1000 1500 2000 2500 3000 Frequency (MHz) NF (dB) Output Power / Gain vs. Input Power frequency = 900 MHz, Temp = +25° C 0 2 4 6 8 10 12 14 Input Power (dBm) Gain (dB) Output Power (dBm) Output Power Gain Output Power / Gain vs. Input Power frequency = 1900 MHz, Temp = +25° C 0 2 4 6 8 10 12 14 Input Power (dBm) Gain (dB) Output Power (dBm) Output Power Gain Output IP3 vs. Output Power frequency = 900 / 910 MHz 0 2 4 6 8 10 Output Power (dBm) -40c +25c +85c Output IP3 vs. Output Power frequency = 1900 / 1910 MHz 0 2 4 6 8 10 Output Power (dBm) -40c +25c +85c ACPR vs. Channel Power 25 °C, IS-95, 9 Ch. Forward, ±885 kHz offset, 30 kHz Meas BW -75 -65 -55 -45 -35 6 7 8 9 10 11 12 13 Output Channel Power (dBm) ACPR (dBc) freq = 1900 MHz S-Parameters (VD = +4.5 V, ID = 78 mA, T = 25 C, calibrated to device leads) Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)

Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 3 of 6 June 2006 AM1 High Dynamic Range Gain Block Product Information The Communications Edge TM Typical Device Data S-Parameters (VDS = +3.3 V, IDS = 75 mA, T = 25 C, 50 ohm system) Input return loss can be improved with the appropriate input matching network shown later in this datasheet. Gain vs. Frequency 0 500 1000 1500 2000 2500 3000 Frequency (MHz) Gain (dB) -40c +25c +85c S11 vs. Frequency -30 -25 -20 -15 -10 0 500 1000 1500 2000 2500 3000 Frequency (MHz) S11 (dB) -40c +25c +85c S22 vs. Frequency -40 -30 -20 -10 0 500 1000 1500 2000 2500 3000 Frequency (MHz) S22 (dB) -40c +25c +85c Noise Figure vs. Frequency 0 500 1000 1500 2000 2500 3000 Frequency (MHz) NF (dB) Output IP3 vs. Output Power frequency = 900 / 910 MHz 0 2 4 6 8 10 Output Power (dBm) -40c +25c +85c Output Power / Gain vs. Input Power frequency = 900 MHz, Temp = +25° C 0 2 4 6 8 10 12 14 Input Power (dBm) Gain (dB) Output Power (dBm) Output Power Gain Output Power / Gain vs. Input Power frequency = 1900 MHz, Temp = +25° C 0 2 4 6 8 10 12 14 Input Power (dBm) Gain (dB) Output Power (dBm) Output PowerGain

Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 4 of 6 June 2006 AM1 High Dynamic Range Gain Block Product Information The Communications Edge TM ID= 1.8e4 pF ID= 12 nH ID= 10 nH ID= 56 pF CAP ID= 56 pF F0= Loss= Eeff= Z0= ID=

1 GHz

3.52 170 mil

50 Ohm

NET="AM1" +4.5V Circuit Board Material: .014” FR-4, 4 layers, .062” total thickness Frequency (GHz) S21 (dB) -25 -20 -15 -10 S11, S22 (dB) DB(|S[1,1]|) * (R) DB(|S[2,1]|) * (L) DB(|S[2,2]|) * (R) Reference Design: 70 MHz C=1e4 pF L=180 nH C=1e4 pF C=1e4 pF L=180 nH C=5.6 pF NET="AM1" +4.5 V Frequency (GHz) S21 (dB) -25 -20 -15 -10 S11, S22 (dB) Reference Design: 170 MHz C=1000 pF L=220 nH C=1000 pF C=1e4 pF L=39 nH C=3.9 pF NET="AM1" +4.5 V Frequency (GHz) S21 (dB) -25 -20 -15 -10 S11, S22 (dB)

Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 5 of 6 June 2006 AM1 High Dynamic Range Gain Block Product Information The Communications Edge TM Reference Design: 450 MHz C=1000 pF L=82 nH C=1000 pF C=1e4 pF L=15 nH C=1.2 pF NET="AM1" +4.5 V Frequency (GHz) S21 (dB) -25 -20 -15 -10 S11, S22 (dB) Reference Design: 800 MHz C=100 pF IND L=33 nH C=100 pF C=100 pF C=1e4 pF L=6.8 nH NET="AM1" PORT +4.5 V Frequency (GHz) S21 (dB) -25 -20 -15 -10 S11, S22 (dB)DB(|S(1,1)|) (R) DB(|S(2,1)|) (L) DB(|S(2,2)|) (R) Reference Design: 1900 / 2140 MHz CAP ID=C3 C=56 pF IND ID=L2 L=33 nH CAP C=56 pF CAP ID=C1 C=3.9 pF IND ID=L1 L=3.3 nH CAP C=1e4 pF TLINP ID=TL1 Z0=50 Ohm L=150 mil Eeff=3.4 Loss=0 F0=2 GHz SUBCKT NET="AM1" +4.5 V Frequency (GHz) S21 (dB) -25 -20 -15 -10 S11, S22 (dB) Reference Design: CATV Single-ended Operation L=4.7 nH C=1.8e4 pF L=100 nH C=1000 pF R=5 Ohm NET="AM1" Z=75 Ohm Z=75 Ohm +4.5 V 0 0.2 0.4 0.6 0.8 1 Frequency (GHz) S21 (dB) -25 -20 -15 -10 S11, S22 (dB)

Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 6 of 6 June 2006 AM1 High Dynamic Range Gain Block Product Information The Communications Edge TM AM1-G (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded (maximum 245 qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 qC Thermal Resistance, Rth (1) 88 qC/W Junction Temperature, Tj (2) 116 qC 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5V, 78 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 160 Product Marking The AM1-G will be marked with an “ A1G” designator. An alphanumeric lot code (“ XXXX-X” ) is also marked below the part designator on the top surface of the package. A “ 0 will be lasermarked in the upper right- hand corner. The obsolete tin-lead package is marked with an “ A1” designator followed by an alphanumeric lot code. Tape and reel specifications for this part are located on the website in the “ Application Notes” section. MSL / ESD Rating ESD Rating: Class 1B Value: Passes 500V to <1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: Class IV Value: Passes 1000V to <2000V Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135º ) diameter drill and have a final plated thru diameter of .25 mm (.010º ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Tab Temperature 100 1000 10000 60 70 80 90 100 110 Tab Temperature (°C)