ALN3800T2_13 ASB | Alldatasheet
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Technical content
Features
Specifications (in Production) Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side.
Description
ASB Inc. (Top View) (Bottom View) Solder Stencil Area Ø 0.4 plated thru holes to ground plane plerow (Side View) (Recommended Footprint) Typ. @ T = 25C, Vs = 5 V, Freq. = 3800 MHz, Zo.sys = 50 ohm C o u pl er Website: www.asb.co.kr E-mail: sales@asb.co.kr Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 More Information C o u pl er C o u pl er C o u pl er 2-stage Single Type
2/3 www.asb.co.kr November 2008 plerowTM ALN3800T2 Internally Matched LNA Module S-parameters OIP3 P1dB 3400~4200 MHz +5 V Typical Performance (Measured) S-parameters & K Factor Noise Figure
3/3 www.asb.co.kr November 2008 plerowTM ALN3800T2 Internally Matched LNA Module 1) The tantal capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. 2) So-called DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the D C component in the signal. The DC blocking capacitors are included inside the LNA module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. Application Circuit Recommended Soldering Reflow Process Evaluation Board Layout + - ALN OUT IN C1 C2 Tantal Capacitor V DC 20~40 sec 260C 200C 150C 60~180 sec Ramp-up (3˚C/sec) Ramp-down (6C/sec) Size 25 x 25mm IN OUT +Vcc (for ALN-AT, BT, T Series – 10x10mm)