ALN2352_17 ASB | Alldatasheet
Document overview
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- PDF pages: 3
Technical content
Features
- S21 = 35.5 dB @ 2300 MHz = 34.5 dB @ 2400 MHz
- NF of 0.90 dB over Frequency
- Unconditionally Stable
- Single 4.5V Supply
- High OIP3 @ Low Current Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes b e placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side.
Description
ASB Inc. (Top View) (Bottom View) Solder Stencil Area Ø 0.4 plated thru holes to ground plane plerow (Side View) (Recommended Footprint) Website: www.asb.co.kr E-mail: sales@asb.co.kr Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 More Information 2-stage Single Type Specifications (in Production) Typ. @ T = 25C, Vs = 4.5 V, Freq. = 2350 MHz, Zo.sys = 50 ohm
2/3 www.asb.co.kr June 2017 plerowTM ALN2352 Internally Matched LNA Module Application Circuit S-parameters Noise Figure OIP3 P1dB 2300~2400 MHz +4.5 V Typical Performance (Measured) S-parameters & K Factor
3/3 www.asb.co.kr June 2017 plerowTM ALN2352 Internally Matched LNA Module 1) The tantal capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. 2) So-called DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking t he DC component in the signal. The DC blocking capacitors are included inside the LNA module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. Copyright 2007-2017 ASB Inc. All rights reserved. Datasheet subject to change without notice. ASB assumes no re- sponsibility for any errors which may appear in this datasheet. No part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of ASB. Recommended Soldering Reflow Process Evaluation Board Layout + - ALN OUT IN C1 C2 Tantal Capacitor V DC 20~40 sec 260C 200C 150C 60~180 sec Ramp-up (3˚C/sec) Ramp-down (6C/sec) Size 25 x 25mm IN OUT +Vcc (for ALN Series – 13x13mm)