ALN1502CT ASB | Alldatasheet
Document overview
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- PDF pages: 3
Technical content
Features
- S21 = 15.0 dB@1400 MHz = 14.0 dB@1600 MHz
- NF of 0.6 dB over Frequency
- Unconditionally Stable
- Single 5 V Supply
- High OIP3@Low Current Note: 1. The number and size of ground via holes i n a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. Website: www.asb.co.kr E-mail: sales@asb.co.kr More Information (Recommended Footprint) ALN1502CT ASB Inc. (Top View) (Bottom View) Ø 0.4 plated thru holes to ground plane plerow (Side View) 1-stage Single Type
Description
Specifications (in Production) Typ.@T = 25 C, Vs = 5 V, Freq. = 1500 MHz, Zo.sys = 50 ohms Outline Drawing (Unit: mm) Solder Stencil Area
2/3 www.asb.co.kr August 2017 plerowTM ALN1502CT Internally Matched LNA Module S-parameters Noise Figure OIP3 P1dB 1400~1600 +5 V Typical Performance (Measured) S-parameters & K Factor
3/3 www.asb.co.kr August 2017 plerowTM ALN1502CT Internally Matched LNA Module 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The ca- pacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. 2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are i nclud- ed inside the ALN module. Therefore, C1 & C2 c apacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application fre- quency. Copyright 2016-2017 ASB Inc. All rights reserved. Datasheet subject to change without notice. ASB assumes no re- sponsibility for any errors which may appear in this datasheet. No part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of ASB. Application Circuit Recommended Soldering Reflow Process 20~40 sec 260C 200C 150C 60~180 sec Ramp-up (3˚C/sec) Ramp-down (6C/sec) IN OUT Vs Size 25x25mm (for ALN-AT, BT, T Series – 10x10mm) + - ALN OUT IN C1 C2 VS Tantal or MLC (Multi Layer Ceramic) Capacitor Evaluation Board Layout