ALN1220AT ASB | Alldatasheet
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Technical content
1/4 www.asb.co.kr June 2009 plerowTM ALN1220AT Internally Matched LNA Module The plerowTM ALN-series is the compactly designed surface-mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-cation terminals, CATV and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. The surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. Pin Number Function 2 RF In 5 RF Out 6 Vs Others Ground Features · S21 = 19.0 dB @ 940 MHz = 16.0 dB @ 1500 MHz · NF of 0.65 dB over Frequency · Unconditionally Stable · Single 5V Supply · High OIP3 @ Low Current Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. (Recommended Footprint) ALN1220AT ASB Inc. (Top View) (Bottom View) Ø0.4 plated thru holes to ground plane plerow (Side View) 1-stage Single Type
Description
Specifications (in Production) Typ. @ T = 25°C, Vs = 5 V, Freq. =1220 MHz, Zo.sys = 50 ohm Outline Drawing (Unit: mm) Solder Stencil Area
2/4 www.asb.co.kr June 2009 plerowTM ALN1220AT Internally Matched LNA Module S-parameters Noise Figure OIP3 P1dB 940~1500 MHz +5 V Typical Performance (Measured) S-parameters & K Factor
3/4 www.asb.co.kr June 2009 plerowTM ALN1220AT Internally Matched LNA Module 1. S-parameter 2. OIP3, P1dB & NF Note: tested at room temperature. 1. S-parameter 2. OIP3, P1dB & NF Note: tested at Vs= 5V. RF Performance with Operating Temperature RF Performance with Voltage Change
4/4 www.asb.co.kr June 2009 Application Circuit Recommended Soldering Reflow Process 20~40 sec 260°C 200°C 150°C 60~180 sec Ramp-up (3˚C/sec) Ramp-down (6°C/sec) IN OUT Vs Size 25x25mm (for ALN-AT, BT, T Series – 10x10mm) + - ALN OUT IN C1 C2 VS Tantal or MLC (Multi Layer Ceramic) Capacitor Evaluation Board Layout