AG606

AG606 WJCI | Alldatasheet

Document overview

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Technical content

Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 1 of 5 April 2006 The Communications Edge TM AG606 Push-Pull CATV Amplifier Product Information Product Features x 50 – 860 MHz x ±0.7 dB Gain Flatness x +20 dBm P1dB x +37 dBm Output IP3 x +73 dBm Output IP2 x -68 dBc CTB +34 dBmV/channel, 79 channels x -80 dBc CSO +34 dBmV/channel, 79 channels xMatched amplifiers for a push-pull configuration x+7V Single Positive Supply xMTTF > 1000 Years

Applications

The AG606 is a dual amplifier containing two internal matched amplifiers optimal for a push-pull configuration. The internal amplifiers employ InGaP HBT technology for a cost-effective low-distortion solution. The AG606 is ideal for drop amplifiers, splitters, and other low to moderate power outside plant CATV applications. The amplifier can also be useful in low power headend applications such as linear laser drivers. The AG606 has excellent VSWR when used in a 75 : push-pull configuration. It is provided in a low-cost environmentally-friendly lead-free/green/RoHS-compliant SOIC-8 package. Functional Diagram Function Pin No. Amp 1 Input 1 Amp 2 Input 4 Amp 2 Output 5 Amp 1 Output 8 Ground 2, 3, 6, 7, Backside paddle Single-ended Device Specifications(1) Parameter Units Min Typ Max Test Frequency MHz 800 Gain dB 13.2 14.3 15.5 Output IP3 (2) dBm +33.5 +36 Device Current mA 76 82.5 90 Device Voltage V 5.25 1. Test conditions unless otherwise noted: T = 25 ºC, 800 MHz on each individual single-branch amplifier in a 50 test fixture using a +7V supply and a 20.5 dropping resistor. 2. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Typical parameters reflect performance in a push-pull application circuit. 4. Balun, board, and connector losses have not been extracted, but typically account of 0.4 dB loss midband and 1.1 dB loss at 860 MHz. 5. Measured at +34 dBmV/channel, 79 channels Flat Loading. 6. OIP2 is measured at f1 + f2 at +5 dBm / tone. Typical Performance (3) Parameter Units Typical Frequency MHz 50 250 450 860 Gain (4) dB 14.3 14.2 13.9 12.9 Input Return Loss dB 21 28 18 11 Output Return Loss dB 17 18 16 18 CTB (5) dBc -69 -67 -67 CSO (5) dBc -81 -87 -80 XMOD (5) dBc -60 -61 -60 Output P1dB dBm +20.7 +20.5 +20.3 +22 Output IP2 (6) dBm +73.6 +76.1 +76.4 +76.6 Output IP3 (2) dBm +37.5 +37.5 +37.3 +39.2 Noise Figure (4) dB 5 5 5.3 5.9 Device Bias V +5.25 V @ 165 mA Absolute Maximum Rating Parameter Rating Operating Case Temperature -40 to +85 qC Storage Temperature -55 to +125 qC Supply Voltage +7 V RF Input Power (continuous) +13dBm Junction Temperature +250 qC Operation of this device above any of these parameters may cause permanent damage.

Ordering Information

Part No. Description AG606-G Push-pull CATV Amplifier (lead-free/green/RoHS-compliant SOIC8 Pkg) AG606-PCB Fully Assembled CATV Evaluation Board

Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 2 of 5 April 2006 The Communications Edge TM AG606 Push-Pull CATV Amplifier Product Information Typical Device Data – 50: Z0 S-Parameters (Vdev = +5.25 V, Icc = 82.5 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads) These represent a single-ended amplifier in the AG606, with there being two matched amplifiers inside the package. Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) Typical Device Data – 50: Z0 S-Parameters (Vdev = +5.25 V, Icc = 82.5 mA, T = 25 C, unmatched 37.5 ohm system, calibrated to device leads) These represent a single-ended amplifier in the AG606, with there being two matched amplifiers inside the package. Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)

Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 3 of 5 April 2006 The Communications Edge TM AG606 Push-Pull CATV Amplifier Product Information Application Circuit PC Board Layout Circuit Board Material: .028” FR4, 4 - layer, 1 oz copper, Microstrip line details: width = .021” , spacing = .021” . C1, C2, R3, C3, R4 and C4 are shown in the silkscreen but are not required in the schematic. Typical RF Performance at 25 qC 1. Balun, board, and connector losses have not been extracted, but typically account for 0.4 dB loss midband and 1.1 dB loss at 860 MHz. 2. CSO, CTB, & XMOD are measured at +34 dBmV/channel, 79 channels Flat Loading. 3. OIP2 is measured at f1 + f2 at 5 dBm / tone. 4. OIP3 is measured at +5 dBm / tone with 1 MHz spacing. Recommended Bias Resistor Values Supply Voltage R1/R2 Value Size 7 V 20.5 ohms 1206 8 V 32.5 ohms 1210 9 V 44.5 ohms 2010 10 V 56.5 ohms 2010

12 V 81 ohms 2010

24 V 227 ohms 2 Watts

75 : Push-Pull Application Circuit Performance (Vsupply = +7 V, Rbias= 20.5 :, 25 qC) S21 vs. Frequency 0 200 400 600 800 1000 Frequency (MHz) S21 (dB) +25°C -40°C +85°C S11 vs. Frequency -40 -30 -20 -10 0 200 400 600 800 1000 Frequency (MHz) S11 (dB) +25°C -40°C +85°C S22 vs. Frequency -40 -30 -20 -10 0 200 400 600 800 1000 Frequency (MHz) S22 (dB) +25°C -40°C +85°C Frequency MHz 50 250 450 860 Gain(1) dB 14.3 14.2 13.9 12.9 Input R.L. dB 21 28 18 11 Output R.L. dB 17 18 16 18 CTB(2) dBc -69 -67 -67 CSO(2) dBc -81 -87 -80 XMOD(2) dBc -60 -61 -60 Output P1dB dBm +20.7 +20.5 +20.3 +22 Output IP2(3) dBm +73.6 +76.1 +76.4 +76.6 Output IP3(4) dBm +37.5 +37.5 +37.3 +39.2 Noise Figure(1) dB 5 5 5.3 5.9 Device Current mA 165 Device Voltage V +5.25 T1: M/A Com ETC1-1-13 T2: M/A Com ETC1-1-13 5. All components are 0603 in size unless otherwise noted. 6. 1% tolerance is for R1 and R2. 7. The dc resistance of L1 and L2 should be less than 1 ohm.

Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 4 of 5 April 2006 The Communications Edge TM AG606 Push-Pull CATV Amplifier Product Information 75 : Push-Pull Application Circuit Performance (Cont’d) (Vsupply=7V, Rbias= 20.5 :, 25 qC) P1dB vs. Frequency 0 200 400 600 800 1000 Frequency (MHz) P1dB (dBm) +25°C -40°C +85°C Noise Figure vs. Frequency (Application Board) 0 200 400 600 800 1000 Frequency (MHz) NF (dB) +25°C -40°C +85°C Noise Figure vs. Frequency at 25°C (Device) 0 200 400 600 800 1000 Frequency (MHz) NF (dB) OIP3 vs. Frequency

1 MHz Spacing, +5dBm / Tone

Frequency (MHz) OIP3 (dBm) +25°C -40°C +85°C OIP2 vs. Frequency

1 MHz Spacing, +5 dBm / Tone

Frequency (MHz) OIP2 (dBm) +25°C -40°C +85°C XMOD, CTB and CSO vs. Frequency @ 34 dBmV at 25°C -100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 Frequency (MHz) XMOD,CTB and CSO (dBc) XMOD CTB CSO CSO vs. Frequency

79 Channel Flat Loading, 34 dBmV

-100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 Frequency (MHz) CSO (dBc) -40°C +25°C +85°C CTB vs. Frequency -100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 Frequency (MHz) CTB (dBc) -40°C +25°C +85°C XMOD vs. Frequency -100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 Frequency (MHz) XMOD (dBc) -40°C +25°C +85°C CSO vs. Frequency

79 Channel Flat Loading at 25°C

-100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 Frequency (MHz) CSO (dBc) 30 dBmV 32 dBmV 34 dBmV 36 dBmV 38 dBmV CTB vs. Frequency -100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 Frequency (MHz) CTB (dBc) 30 dBmV 32 dBmv 34 dBmV 36 dBmV 38 dBmV XMOD vs. Frequency -100 -90 -80 -70 -60 -50 0 100 200 300 400 500 600 Frequency (MHz) XMOD (dBc) 30 dBmV 32 dBmV 34 dBmV 36 dBmV 38 dBmV

Specifications and information are subject to change without notice. WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com Page 5 of 5 April 2006 The Communications Edge TM AG606 Push-Pull CATV Amplifier Product Information AG606-G (Lead-Free Package) Mechanical Information This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 qC reflow temperature) and lead (maximum 245 qC reflow temperature) soldering processes. Outline Drawing Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature -40 to +85 qC Thermal Resistance, Rth (1) 63 qC/W Junction Temperature, Tj (2) 142 qC Notes: 1. The thermal resistance is referenced from the hottest part of the junction to ground tab underneath the device. 2. This corresponds to the typical biasing condition of +5.16V, 175 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 177 Product Marking The component will be marked with an “ AG606G” designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an “ AG606” designator followed by an alphanumeric lot code. Tape and reel specifications for this part are located on the website in the “ Application Notes” section. ESD / MSL Information ESD Rating: Class 1C Value: 1000 to 2000 V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: Class IV Value Passes greater than 1000 V Test: Charge Device Model (CDM) Standard: JEDEC Standard JESD22-C101 MSL Rating: Level 2 at +260 C convection reflow Standard: JEDEC Standard J-STD-020A Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80/.0135º ) diameter drill and have a final plated through diameter of .25mm (.010º ) 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. To ensure reliable operation, device ground paddle-to- ground pad solder joint is critical. 4. Add mounting screws near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 5. For optimal thermal performance, expose soldermask on backside where it contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8. If the PCB design rules allow, ground vias should be placed under the land pattern for better RF and thermal performance. Otherwise ground vias should be placed as close to the land pattern as possible. 9. All dimensions are in mm. Angles are in degrees. MTTF vs. GND Tab Temperature 100 1000 10000 50 60 70 80 90 100 Tab Temperature (°C) MTTF (Million Hrs)