ACL4275T2 ASB | Alldatasheet

Document overview

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Technical content

Features

  • S 21 = 21.8 dB @ 4200 MHz = 20.2 dB @ 4350 MHz
  • NF of 1.25 dB over Frequency
  • Unconditionally Stable
  • Single 5V Supply
  • High OIP3 @ Low Current Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins fo r better RF and thermal performance, as shown in the drawing at the left side. Website: www.asb.co.kr E-mail: sales@asb.co.kr Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 ASB Inc., 4th Fl. Venture Town Bldg., 367-17 Goijeong-Dong, Seo-Gu, Daejon 302-716, Korea More Information

Description

(Recommended Footprint) ACL4275T2 ASB Inc. (Top View) (Bottom View) Ø0.4 plated thru holes to ground plane plerow (Side View) Solder Stencil Area Specifications (in Production) Typ. @ T = 25°C, Vs = 5 V, Freq. = 4275 MHz, Zo.sys = 50 ohm

2/3 www.asb.co.kr November 2008 plerowTM ACL4275T2 Internally Matched LNA Module S-parameters OIP3 P1dB 4200~4350 +5 V Typical Performance (Measured) Noise Figure S-parameters & K Factor

3/3 www.asb.co.kr November 2008 plerowTM ACL4275T2 Internally Matched LNA Module 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The ca- pacitor should be placed as close as possible to V s pin and be connected directly to the ground plane for the best electrical performance. 2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are in- cluded inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. Application Circuit Recommended Soldering Reflow Process 20~40 sec 260°C 200°C 150°C 60~180 sec Ramp-up (3˚C/sec) Ramp-down (6°C/sec) + - ACL OUT IN C1 C2 VS Tantal or MLC (Multi Layer Ceramic) Capacitor IN OUT Vs Size 25x25mm (for ACL-T Series – 10x10mm) Evaluation Board Layout