A564

2SA564A FOSHAN | Alldatasheet

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2SA564(A) Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 1 / 5 TO-92 塑封封装 PNP 半导体三极管。Silicon PNP transistor in a TO-92 Plastic Package. hFE 高。 High hFE. 用于普通放大。 General amplifier application. PIN1：Base PIN 2 ：Collector PIN 3 ：Emitter 放大及印章代码 / hFE Classifications & Marking 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 内部等效电路 / Equivalent Circuit 引脚排列 / P i n n i n g hFE Classifications Symbol Q R S hFE Range 130~260 180~360 260~520 1 2 3

2SA564(A) Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 2 / 5 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO 2SA564 -25 V 2SA564A -45 Collector to Emitter Voltage VCEO 2SA564 -25 V 2SA564A -45 Emitter to Base Voltage V EBO -7.0 V Collector Current - Continuous I C -100 mA Collector Current – Continuous(Pulse) I CP -200 mA Collector Power Dissipation P C 400 mW Junction Temperature Tj 150 ℃ Storage Temperature Range Tstg -55～150 ℃ 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 Min 典型值 Typ 最大值 Max 单位 Unit Collector Cut-Off Current I CBO VCB=-10V I E=0 -0.001 -1.0 μA Collector Cut-Off Current I CEO VCE=-10V I B=0 -10 μA Collector to Base Breakdown Voltage VCBO 2SA564 IC=-10uA I E=0 -25 V 2SA564A -45 Collector to Emitter Breakdown Voltage VCEO 2SA564 IC=-10uA I E=0 -25 V 2SA564A -45 Emitter to Base Breakdown Voltage VEBO I E=-10μA I C=0 -5.0 V DC Current Gain h FE V CE=-10V I C=-2.0mA 130 250 520 Collector to Emitter Saturation Voltage VCE(sat) IC=-100mA I B=-10mA -0.3 V Output capacitance C ob VCB=-10V I E=0 f=1.0MHz 3.5 pF 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)

2SA564(A) Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 3 / 5 外形尺寸图 / Package Dimensions

2SA564(A) Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 4 / 5 印章说明 / Marking Instructions 说明： A564：  为型号代码 Q :   为 h FE 分档代码 Note: BR: Company Code. A564:  Product Type. Q:   h FE Classifications Symbol **: Lot No. Code,code change with Lot No. BR ** A564 Q

2SA564(A) Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 5 / 5 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：270±5℃ 时间：10±1 sec. Temp:270±5 ℃ Time:10±1 sec 包装规格 / Packaging SPEC. 散件包装 / B U L K Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm3) Units/Bag 只/袋 Bags/Inner Box 袋/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Bag 袋 Inner Box 盒 Outer Box 箱 TO-92 1,000 10 10,000 5 50,000 135×190 237×172×102 560×245×195 1,000 10 10,000 10 100,000 135×190 237×172×102 560×245×375 编带包装 / A M M O Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm3) Units/tape 只/纸带 Tape/Inner Box 纸带/盒 Rows/Inner Box 纸带层/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Inner Box 盒 Outer Box 箱 TO-92 3,000 1 120 10 30,000 328×230×42 小箱 480×346×235， 大箱 547×407×268 使用说明 / N o t i c e s