A4K300-RE-10 SUPERWORLD | Alldatasheet
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(a) (c)(b) (e) (d) 1. PART NO. EXPRESSION : (b) Dimension code (c) Material code (a) Series code 2. CONFIGURATION & DIMENSIONS : 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Body : Ferrite (b) Termination : Ag/Ni/Sn a 3. SCHEMATIC : (e) R : Reel (f) Current code : E = 500mA 5. GENERAL SPECIFICATION : b) Rated current : Base on temp. rise a) Temp. rise : 30°C Max. A4K SERIESFERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 18.06.2008 PCB Pattern 1.60±0.20 BD 1 D2 P G Unit:m/m 3.20±0.20 A C b Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) c) Storage temp. : -55°C to +125°C d) Operating temp. : -55°C to +125°C e) Resistance to solder heat : 260°C.10secs (f) (g) (g) 10 : Lead Free C D1 P B A J I L G H H IJ L (d) Impedance code : 300 = 30ȍ
SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 18.06.2008 6. ELECTRICAL CHARACTERISTICS : A4K601-RB-10 A4K102-RB-10 A4K121-RD-10 A4K301-RC-10 A4K600-RD-10 A4K300-RE-10 Part Number 60 ±25% 1000 ±25% 300 ±25% 600 ±25% 120 ±25% 30 ±25% Impedance ( ȍ ) DC ResistanceTest 100 100 100 100 ( MHz ) Frequency 100 100 0.50 0.75 0.30 0.40 Max. ( ȍ ) 0.25 0.20 Rated Current 200 150 350 250 400 500 Max. ( mA ) FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES
NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 18.06.2008 7. IMPEDANCE VS. FREQUENCY CURVES : A4K300-RE-10 A4K600-RD-10 A4K121-RD-10 A4K301-RC-10 A4K601-RB-10 A4K102-RB-10 FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES
NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 18.06.2008 8. RELIABILITY & TEST CONDITION : 40(1.575) 100(3.937) 10±0.5 seconds seconds not be damaged by the forces applied on the The terminal electrode & the dielectric must Bending not be damaged by the forces applied on the The terminal electrode & the dielectric must W Flexture Strength right conditions. 45(1.772) 20(.787) 45(1.772) W Terminal Strength Solderability 150°C 4±1.0 seconds right conditions. seconds More than 90% of the terminal electrode should be covered with solder. Preheating 230°C Dipping Natural cooling Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. > 25 Force (Kfg)Size 4 0.5 For A Series : Time (sec) Solder : Sn-Ag3.0-Cu0.5 Flux for lead free : rosin Dip Time : 4±1sec. Preheat : 150°C, 60sec. Solder Temperature : 230±5°C Refer to standard electrical characteristics list Temperature Rise Test Solder Heat Resistance Electrical Characteristics Test Rated Current Impedance DC Resistance Impedance change : Within ±30% Appearance : No significant abnormality Preheating 260°C 150°C NaturalDipping cooling 30°C max. (ǻt) ITEM PERFORMANCE 2. Temperature measured by digital surface thermometer. Dip Time : 10±0.5sec. Solder Temperature : 260±5°C Solder : Sn-Ag3.0-Cu0.5 Preheat : 150°C, 60sec. Flux for lead free : rosin HP4291A, HP4287A+16192A 1. Applied the allowed DC current. HP4338B TEST CONDITION No mechanical damage Remaining terminal electrode : 70% Min. FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES
SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 5 18.06.2008 8. RELIABILITY & TEST CONDITION : Low temperature storage test Thermal Shock Temperature Loading at High ITEM Humidity Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs. Step1 : -55±2°C 30±3 min.Temperature (°C)Phase Times (min.) Measured : 5 times -55±2°C +125±5°C Duration : 500±12hrs Temperature : -55±2°C Step2 : +125±5°C 30±3 min. Number of cycles : 530±3 30±3 Impedance : Within ±30% of initial value. Impedance : Within ±30% of initial value. Appearance : No damage. Appearance : No damage. Duration : 500±12hrs Condition for 1 cycle For A Series : Temperature : 40±2°C Humidity : 90~95% RH. Duration : 500±12hrs Temperature : 125±5°C Applied Current : rated current PERFORMANCE TEST CONDITION FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES
SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 7 18.06.2008 may cause the failure of mechanical or electrical perform ance. Solder shall be used not to be exceed as shown in Fig. 4. Accordingly increasing the solder volume, the mechanical st ress to product is also increased. Exceeding solder volume Figure 4 Recommendable Upper limit t 9-3. Solder Volume FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES
- PACKAGING INFORMATION : SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 8 18.06.2008 10-1. Reel Dimension10-1. Reel Dimension 0.30±0.05 0.22±0.05 0.24±0.05 0.24±0.05 10-3. Packaging Quantity 10-2.1 Tape Dimension / 12mm P Bulk (Bags) 7000 Carton Middle Box 20000 40000 8Chip Size Inner Box Chip / Reel 1000 4000 Po:4±0.1 E:1.75±0.1 D1:1.5±0.1 A F:5.5±0.05 D:1.5+0.1 A 3 (12) 100000 50000 10000 100000 125000 62500 300002000012000 20000 40000 80000 40000 50000 150000 75000 12500 2500 4000 1000 2000 8000 3000 15000 2000 150000 200000 100000 200000 200000 100000 300000 500000 250000 23 (09) 4000 20000 4000 20000 50000 10000 Size W:12.0±0.1 P2:2±0.05 Bo Ko Section A-A Ao Z Series t 2.00±0.1 1.85±0.1 1.93±0.1 5.40±0.16.10±0.1 4.95±0.1 4.95±0.1 3.66±0.1 1.93±0.1 8.0±0.1 8.0±0.1 4.0±0.1 1.55±0.10 Ko(mm)Bo(mm) Ao(mm) P(mm) t(mm) 4.0±0.1 1.5±0.1 1.5±0.1 1.5±0.1 D1(mm) 1.0±0.1 D(mm) 178.0±2.0 0.22±0.05 0.22±0.05 0.23±0.05 178.0±2.0 0.22±0.05 0.22±0.05 7" x 8mm 10-2 Tape Dimension / 8mm D1:1±0.1 Po:4±0.1 P2:2±0.05 E:1.75±0.1 P F:3.5±0.05 C B D A R0.5 3 (09) Size 3 (12) W:8.0±0.1 Bo Section A-A KoAoA Z t A D:1.5+0.1 Series 120° 0.54±0.05 1.02±0.10 1.04±0.10 1.45±0.10 1.27±0.10 2.35±0.10 3.50±0.10 1.50±0.10 1.88±0.10 1.80±0.10 1.01±0.10 4.0±0.1 4.0±0.1 4.0±0.1 2.0±0.1 4.0±0.1 Ko(mm)Bo(mm) Ao(mm) P(mm) t(mm) 7" x 12mm 2±0.5 R1.9 60.0±2.0 13.5±0.5 R10.5 Type A(mm) C(mm) B(mm) 1.0±0.1 1.0±0.1 1.0±0.1 none none D1(mm) FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES
NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9 18.06.2008 Base tape a) Temperature and humidity conditions : -10 ~ 40°C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. To maintain the solderabililty of terminal electrodes : 1. Storage Conditions : Application Notice 2. Transportation : 10-4. Tearing Off Force Top cover tape 165° to 180° F Tearing Speed in the arrow direction under the following conditions. The force for tearing off cover tape is 15 to 60 grams 45~855~35 860~1060 Room Humidity (°C) Room Temp. (%) (hPa) Room atm 300 (mm/min) FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE) A4K SERIES