COMH-CAAP KONTRON | Alldatasheet
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Technical content
COM HPC/Client module size A with 12th Generation Intel® Core™ Processors COMh-caAP * Up to 64 GByte DDR5 memory * Up to 2.5Gb Ethernet with TSN support * Optional NVMe SSD onboard
www.kontron.com COMh-caAP Technical Information COMPLIANCE COM HPC® Client 2x 400 pin connector DIMENSIONS (H x W) 95 x 120 mm CPU Intel® 12th Generation Core™ family For details see table (CPU variants) given below CHIPSET lntel® 600/700 Series Chipset Family - On-Package Platform Controller Hub MAIN MEMORY 2x DDR5 SODIMM dual channel up to 32 GByte GRAPHICS CONTROLLER Intel® Iris Xe Graphics architecture with up to 96 EUs, 4 Independent Displays (up to 8K) ETHERNET CONTROLLER Intel® i226 ETHERNET Up to 2x 2.5 Gb Ethernet with TSN & WOL support (depending on SKU) STORAGE 2x SATA 6Gb/s (optional) FLASH ONBOARD Up to 1 TByte NVMe SSD (on request) PCI EXPRESS® 1x 8 PCIe Gen 4.0 (Alder Lake H-Series, 35-45 W) 2x 4 PCIe Gen 4.0 -> 1x4 shared with onboard NVMe 8x PCIe Gen3.0 Optional 1x PCIe for BMC DISPLAY DDI1: DP++, DDI2: DP++, DDI3: DP++, eDP (DSI, BIOS option), MIPI DSI USB 2x USB 4.0/ Thunderbolt ™; 2x USB 3.2; 8x USB 2.0 SERIAL 2x serial interface (RX/TX only) AUDIO HD Audio OTHER FEATURES (G) SPI, SMB, Fast I²C, Staged Watchdog, RTC SPECIAL FEATURES Trusted Platform Module TPM 2.0 FEATURES ON REQUEST vPRO (AMT/TXT/AES Support), up to 3x PCIe x1 additional w/o Ethernet & SATA, NVMe SSD, Fail Save via 2nd SPI Flash POWER MANAGEMENT ACPI 6.0 POWER SUPPLY 8.5 V – 20 V Wide Range, Single Supply Power BIOS AMI UEFI OPERATING SYSTEM Windows®10, Linux, VxWorks TEMPERATURE Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Extended temperature (planned): -25 °C to +75 °C operating, -30 °C to +85 °C non-operating Industrial temperature (planned): -40 °C to +85 °C operating, -40 °C to +85 °C non-operating HUMIDITY 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) CPU Variants 12th GENEREATION ALDER LAKE SERIES H-SERIES P-SERIES CPU i7-12800HE i5-12600HE i3-12300HE i7-1270PE i5-1250PE i3-1220PE CORES 14 12 8 14 12 8 NUMBER OF P-CORES 6 4 4 6 4 4 NUMBER OF E-CORES 8 8 4 8 8 4 TDP 45/ 35 W 45/ 35 W 45/ 35 W 28/ 20 W 28/ 20 W 28/ 20 W CACHE 24 MByte 18 Mbyte 12 Mbyte 24 MByte 12 MByte 12 Mbyte IBECC no no no no no no TCC/TSN no no no no no no
www.kontron.com COMh-caAP Block Diagram Variants PCIe Gen . X DDI0 DDI1 SER0 SER1 DDI2 PCIe Gen . 4 #16-23 (Group 1) SPI GSPI I2C GPIO PwrCtr l SysMg mt LID Sleep GPIO Ctrl MgmtSMB Sound- Wi re/ HD-Audi o/ I2S PCIe Gen . X SER0 SER1eDP/D SI eSPI GbE #0USB #0-1 (USB 4.0) Tunderbolt USB #0-7 (USB 2.0) SATA#1 PCIe Gen . 4 #8-15 (Group 0 High) SATA#0 PCIe Gen . #0-7 (Group 0 Low) USB #2-3 (USB 3.2) MIPI CSI (IPU) GbE #1 COM-HPC® connector J 1– Pin-out Client COM-HPC® connector J 2 – Pin-out Client Intel® 12th Generation Core Alder Lake-P Series Module Management Controller UART Connector OptionSt andard component Alder Lake- P 35-45 W NVMe 1x4 #12-15 HWMFAN1 DDR5 SODIMM non-ECC I2C EEPROM Watchdog I2C GPIO Buffer SPI BI OS Flash 2nd Gen. TPM SLB967 LAN Intel® I226 LAN Intel® I226 DDR5 SODIMM non-ECC 2nd SPI Flash RTC Power sequencing Power sequencing PART NO. CPU PCH MEM. DOWN SO-DIMM FLASH OP. TEMPERATURE HCA01-0000-80-7 i7-12800HE - - 0 °C - 60 °C HCA01-0000-60-5 i5-12600HE - - 0 °C - 60 °C HCA01-0000-30-3 i3-12300HE - - 0 °C - 60 °C HCA01-0000-70-7 i7-1270PE - - 0 °C - 60 °C HCA01-0000-50-5 i5-1250PE - - 0 °C - 60 °C HCA01-0000-20-3 i3-1220PE - - 0 °C - 60 °C HCA01-0000-45-5 i5-1245UE - - 0 °C - 60 °C
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Tel.: + 49 821 4086-0 info@kontron.com www.kontron.com Copyright © 2023 Kontron. All rights reserved. All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully checked and is believed to be accurate;however, no responsibility is assumed for inaccuracies. Kontron and the Kontron logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized.Specifications are subject to change without notice. COMh-caAP-20230706 - bmy Carrier Cooling Memory ARTICLE PART NO. DESCRIPTION COM-HPC CLIENT CARRIER 10MM HCT01-0000-10-0 COM-HPC Client Carrier with 10mm Connector Height ARTICLE PART NO. DESCRIPTION HSP COMe-caAP CU-CORE THREADED HCA01-0000-99-0 Heatspreader for COMh-caAP, Cu-core, threaded mounting holes HSP COMe-caAP CU-CORE THROUGH HCA01-0000-99-1 Heatspreader for COMh-caAP, Cu-core, through mounting holes COMh Size A Active Uni Cooler (w/o HSP) HCA99-0000-99-0 COM-HPC Size A Universal Active Cooler for Heatspreader Mounting (120 x 95 x 17 mm) COMh Size A Passive Uni Cooler (w/o HSP) HCA99-0000-99-1 COM-HPC Size A Universal Passive Cooler for Heatspreader Mounting (120 x 95 x 17 mm) PART NO. MIN. SPEC. SIZE ECC OP. TEMPERATURE 79040-3248-CAAP DDR5-4800 32 GByte no 0 °C - 60 °C 97040-1648-CAAP DDR5-4800 16 GByte no 0 °C - 60 °C 97040-0848-CAAP DDR5-4800 8 GByte no 0 °C - 60 °C