COME-BV26 KONTRON | Alldatasheet
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Technical content
COM Express® Basic Type 6 with AMD Ryzen™ Embedded V-Series V2000 SoCs COMe-bV26 * Up to 64 GByte DDR4 memory * Up to 2.5 Gb Ethernet * Optional NVMe SSD onboard
www.kontron.com COMe-bV26 Technical Information COMPLIANCE COM Express® basic Pin-out type 6 DIMENSIONS (H X W X D) 95 x 125 mm CPU AMD Ryzen™ Embedded V-Series V2000 SoCs: AMD V2748, 8x 2.9 GHz, 35-54 W AMD V2718, 8x 1.7 GHz, 12-25 W AMD V2546, 6x 3.0 GHz, 35-54 W AMD V2516, 6x2.1 GHz, 12-25 W CHIPSET Integrated SoC MAIN MEMORY 2x DDR4 SO-DIMM with up to 32 GByte per channel (non-ECC/ECC) GRAPHICS CONTROLLER AMD Radeon™ GPU ETHERNET CONTROLLER Intel® i225 ETHERNET Up to 2.5 Gb Ethernet STORAGE 2x SATA 6Gb/s FLASH ONBOARD Up to 1 TByte NVMe SSD (on request) PCI EXPRESS® 4x PCIe 3.0 (up to 8 GT/s) 4x PCIe 2.0 (up to 5 GT/s) via PCIe switch 1x PEG x8 DISPLAY DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, eDP USB 4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0 SERIAL 2x serial interface (RX/TX only) AUDIO High Definition Audio interface OTHER FEATURES SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC SPECIAL FEATURES POSCAP capacitors, Trusted Platform Module TPM 2.0 FEATURES ON REQUEST LVDS (Dual Channel 18/24bit) instead of eDP, VGA, NVMe SSD, Fail Safe via 2nd SPI Flash, Industrial grade -40 °C to +85 °C POWER MANAGEMENT ACPI 6.0 POWER SUPPLY 8.5 V – 20 V Wide Range, Single Supply Power BIOS AMI Aptio V OPERATING SYSTEM Windows®10, Linux TEMPERATURE Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating HUMIDITY 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) Block Diagram USB #1-3 (USB2.0) USB #1-3 (USB3.1) SPI SATA#1/3 SATA#0/2 PCIe PCIe #6-7 PCIe #4-5 PCIe Switch PCIe USB #4-7 (USB2.0) SATA#0 LAN SER0 SER1 GPIO VGA PEG #0-7 SMB UART GPIO Ctrl Mgmt LPC HDA SATA#1 USB #0 (USB3.1) PwrCtrl SysMgmt USB #0 (USB2.0) PWM FAN2 I2C eDP PCIe #0-3 AMD Embedded V-Series V2000 SoCs Chipset integrated LID Sleep eDP / LVDS Connector OptionStandard component Embedded Controller HWM GFX FAN1 VCC 5VSB VBAT HWM Power sequencing Watchdog I2C GPIO Buffer I2C EEPROM UART COM Express® connector CD – Pin-out Type 6 VCC DP(++) SPD eDP2 LVDS DP2 VGA LAN Intel® I225 COM Express® connector AB – Pin-out Type 6 DDR4 SODIMM ECC/non-ECC DDR4 SODIMM ECC/non-ECC SMB NVMe MUX 2nd SPI BIOS Flash SPI BIOS Flash TPM USB Hub
www.kontron.com COMe-bV26 CPU Variants Carrier Variants CPU V2748 V2718 V2546 V2516 CORES 8 8 6 6 TDP 35/54 W 12/25 W 35/54 W 12/25 W CACHE 4 MByte 4 MByte 3 MByte 3 MByte PART NO. CPU PCH MEM. DOWN SO-DIMM FLASH OP. TEMPERATURE 38036-0000-29-8 * V2748 integrated - non-ECC/ECC - 0 °C - 60 °C 38036-0000-17-8 * V2718 integrated - non-ECC/ECC - 0 °C - 60 °C 38036-0000-30-6 * V2546 integrated - non-ECC/ECC - 0 °C - 60 °C 38036-0000-21-6 * V2516 integrated - non-ECC/ECC - 0 °C - 60 °C * Qualified for E1 temperature range (-25 °C to +75 °C) and available project based only ARTICLE PART NO. DESCRIPTION COME EVAL CARRIER2 T6 38116-0000-00-5 COM Express® Evaluation Carrier Type 6
Gutenbergstraße 2
85737 Ismaning, Germany
Tel.: + 49 821 4086-0 info@kontron.com www.kontron.com Copyright © 2023 Kontron. All rights reserved. All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully checked and is believed to be accurate;however, no responsibility is assumed for inaccuracies. Kontron and the Kontron logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized.Specifications are subject to change without notice. COMe-bV26-20230301 - bmy Cooling Memory ARTICLE PART NO. DESCRIPTION HSP COME-BV26 CU-CORE THREADED 38036-0000-99-0 Heatspreader for COMe-bV26, Cu-core, threaded mounting holes HSP COME-BV26 CU-CORE THROUGH 38036-0000-99-1 Heatspreader for COMe-bV26, Cu-core, through mounting holes HSK COME-BASIC ACTIVE (W/O HSP) 38025-0000-99-0C05 Active Cooler for COMe-bxL6/bDV7 to be mounted on HSP HSK COME-BASIC PASSIVE (W/O HSP) 38025-0000-99-0C06 Passive Cooler for COMe-bxL6/bDV7 to be mounted on HSP PART NO. MIN. SPEC. SIZE ECC OP. TEMPERATURE 97020-3232-BV26 DDR4-3200 32 GByte no 0 °C - 60 °C 97020-1632-BV26 DDR4-3200 16 GByte no 0 °C - 60 °C 97020-0832-BV26 DDR4-3200 8 GByte no 0 °C - 60 °C 97020-0432-BV26 DDR4-3200 4 GByte no 0 °C - 60 °C 97030-3232-BV26 DDR4-3200 32 GByte yes 0 °C - 60 °C 97030-1632-BV26 DDR4-3200 16 GByte yes 0 °C - 60 °C 97030-0832-BV26 DDR4-3200 8 GByte yes 0 °C - 60 °C 97030-0432-BV26 DDR4-3200 4 GByte yes 0 °C - 60 °C 97021-3232-BV26* DDR4-3200 32 GByte no -40 °C - 85 °C 97021-1632-BV26* DDR4-3200 16 GByte no -40 °C - 85 °C 97021-0832-BV26* DDR4-3200 8 GByte no -40 °C - 85 °C 97021-0432-BV26* DDR4-3200 4 GByte no -40 °C - 85 °C * Corresponding memory modules in case of project based E1 temperature range variants