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Technical content

2535 MHz BAW Filter

Data Sheet: Rev D 9/20/12 - 1 of 9 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network

Applications

  • General purpose wireless
  • Wireless infrastructure
  • 4G, Multi-standard
  • Repeaters Product Features Functional Block Diagram Top view
  • Usable bandwidth 70 MHz
  • High attenuation
  • Low Loss
  • Excellent power handling
  • Single-ended operation
  • Matching is required for optimum performance at 50 Ω
  • Small Size: 3.00 x 3.00 x 1.22 mm
  • Ceramic Surface Mount Package (SMP)
  • Hermetically sealed
  • RoHS compliant, Pb -free General Description Pin Configuration 885009 is a general purpose Uplink filter for band 7. This filter was specifically designed in a 3x3mm hermeti c package for base station applications and is part o f our wide portfolio of RF filters in the same package. Low insertion loss, coupled with high attenuation a nd excellent power handling, makes this filter a natur al choice for our customers Uplink RF filtering needs. Pin # SE Description

2 Input

5 Output

1,3,4,6 Case Ground

Ordering Information

Part No. Description 885009 packaged part 885009-EVB evaluation board Standard T/R size = 5000 units/reel. 1 6 5Input Output Gnd Gnd Gnd Gnd

Data Sheet: Rev D 9/20/12 - 2 of 9 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Specifications for Matched Condition Electrical Specifications (1) Specified Temperature Range: (2) -30 to +85 ºC Parameter (3) Conditions Min Typical (4) Max Units Center Frequency - 2535 - MHz Insertion Loss At Center Frequency - 1.3 2.5 dB Maximum Insertion Loss 2500 – 2570 MHz - 2.2 3.5 dB 3.5 dB Bandwidth (7) 2500 – 2570 MHz 70 91.5 - MHz Lower 3.5 dB Band edge (7) Upper 3.5 dB Band edge (7) 2570 2489 2580 2500 MHz MHz Amplitude Variation (5) 2500 – 2570 MHz - 0.92 1.6 dB Amplitude Ripple (6) 2500 – 2570 MHz - 0.41 1.4 dB p-p Amplitude Ripple (any 5 MHz in passband) (6) 2500 – 2570 MHz - 0.36 0.8 dB p-p Phase Ripple 2500 – 2570 MHz - 36 55 deg p-p Group Delay Ripple 2500 – 2570 MHz - 14 25 ns p-p Absolute Group Delay 2500 – 2570 MHz - 0.014 0.0 2 µs Temperature Drift (8) 2500 – 2570 MHz - 0.25 0.35 dB EVM (Any 3.84 MHz Channel ) 2502.5 to 2567.5 MHz - 1.2 2 % IIP3 (Tones 5 MHz separated, power > 5 dBm per tone) 2500 – 2570 MHz 44 47 - dBm Stopband Attenuation (7) 70 – 120 MHz 300 – 500 MHz 1784 – 1854 MHz 2110 – 2170 MHz 2321 – 2391 MHz 2620 – 2673 MHz 2673 – 2695 MHz 3926 – 4782 MHz dB dB dB dB dB dB dB dB Input/Output VSWR 2500 – 2570 MHz - 1.5 2.1 - Source/Load Impedance (9) Single-ended - 50 - Ω Notes: 1. All specifications are based on the TriQuint schematic for the main reference design shown on page 4 2. In production, devices will be tested at room temperature to a guardbanded specification to ensure electrical compliance over temperature 3. Electrical margin has been built into the design to account for the variations due to temperature drift and manufacturing tolerances 4. Typical values are based on average measurements at room temperature 5. Describes the total variation over the defined frequency range 6. This is defined as the worst difference between a peak and adjacent valley within defined frequency points 7. Relative to zero dB 8. Temperature Drift specification is defined on Page 4 and is guaranteed by design and won’t be measured in production. 9. This is the optimum impedance in order to achieve the performance shown Absolute Maximum Ratings (Operation of this device outside the parameter ranges given above may cause permanent damage.) Parameter Rating 10. This filter is also able to sustain an instantaneous 35 dBm signal without decay. Operable Temperature -40 to +125 oC Storage Temperature -40 to +125 oC o Input Power (10Khrs @ 55 oC under CW signal) (10) +30 dBm

Data Sheet: Rev D 9/20/12 - 3 of 9 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Specifications for Matched Condition Electrical Specifications (1) Specified Temperature Range: (2) -40 to +85 ºC Parameter (3) Conditions Min Typical (4) Max Units Center Frequency - 2535 - MHz Insertion Loss At Center Frequency - 1.3 2.75 dB Maximum Insertion Loss 2500 – 2570 MHz - 2.2 3.75 d B 3.75 dB Bandwidth (7) 2500 – 2570 MHz 70 92.2 - MHz Lower 3.75 dB Band edge (7) Upper 3.75 dB Band edge (7) 2570 2490 2582 2500 MHz MHz Amplitude Variation (5) 2500 – 2570 MHz - 0.92 1.7 dB Amplitude Ripple (6) 2500 – 2570 MHz - 0.41 1.5 dB p-p Amplitude Ripple (any 5 MHz in passband) (6) 2500 – 2570 MHz - 0.36 0.9 dB p-p Phase Ripple 2500 – 2570 MHz - 36 60 deg p-p Group Delay Ripple 2500 – 2570 MHz - 14 30 ns p-p Absolute Group Delay 2500 – 2570 MHz - 0.014 0.0 2 µs Temperature Drift (8) 2500 – 2570 MHz - 0.25 0.38 dB IIP3 (Tones 5 MHz separated, power > 5 dBm per tone) 2500 – 2570 MHz 44 47 - dBm Stopband Attenuation (7) 70 – 120 MHz 300 – 500 MHz 1784 – 1854 MHz 2110 – 2170 MHz 2321 – 2391 MHz 2620 – 2673 MHz 2673 – 2695 MHz 3926 – 4782 MHz dB dB dB dB dB dB dB dB Input/Output VSWR 2500 – 2570 MHz - 1.5 2.2 - Source/Load Impedance (9) Single-ended - 50 - Ω Notes: 1. All specifications are based on the TriQuint schematic for the main reference design shown on page 4 2. In production, devices will be tested at room temperature to a guardbanded specification to ensure electrical compliance over temperature 3. Electrical margin has been built into the design to account for the variations due to temperature drift and manufacturing tolerances 4. Typical values are based on average measurements at room temperature 5. Describes the total variation over the defined frequency range 6. This is defined as the worst difference between a peak and adjacent valley within defined frequency points 7. Relative to zero dB 8. Temperature Drift specification is defined on Page 4 and is guaranteed by design and won’t be measured in production. 9. This is the optimum impedance in order to achieve the performance shown Temperature Drift Equations: Temp Drift /g2918/g2919/g2917/g2918 = │max(T/g2911/g2923/g2912/g2919/g2915/g2924/g2930 −T/g2918/g2925/g2930 ) − min(T /g2911/g2923/g2912/g2919/g2915/g2924/g2930 − T/g2918/g2925/g2930 ) 2 │ Temp Drift /g2922/g2925/g2933 = │max (T/g2911/g2923/g2912/g2919/g2915/g2924/g2930 −T/g2913/g2925/g2922/g2914 ) − min (T/g2911/g2923/g2912/g2919/g2915/g2924/g2930 − T/g2913/g2925/g2922/g2914 ) 2 │ Temperature Drift Terms Defined: T/g2911/g2923/g2912/g2919/g2915/g2924/g2930 - Transmission power in dB measured at +25 degrees C. T/g2918/g2925/g2930 - Transmission power in dB measured at +85 degrees C. T/g2913/g2925/g2922/g2914 - Transmission power in dB measured at -40 degrees C. Temperature Drift - Greater of Temp Drift /g2918/g2919/g2917/g2918 vs Temp Drift /g2922/g2925/g2933

Data Sheet: Rev D 9/20/12 - 4 of 9 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Reference Design Schematic 50 Ω Single-ended Input 50 Ω Single-ended Output PC Board Mounting Configuration Notes: Top, middle & bottom layers: 1 oz copper Substrates: FR4 dielectric, .031” thick Finish plating: Nickel: 3-8µm thick, Gold: .03-.2 µm thick Hole plating: Copper min .0008µm thick Notes: 1. All dimensions are in millimeters. 2. This footprint represents a recommendation only. Bill of Material Reference Des g. Value Description Manufacturer Part Number L1 2.2nH Coil Wire-wound, 0402, 5% Murata LQW15AN2N 2J00 L2 2.2nH Coil Wire-wound, 0402, 5% Murata LQW15AN2N 7J00 C1 0.4pF Chip Capacitor, 0402, 5% Murata GRM1555C1H R40WA01 C2 0.5pF Chip Capacitor, 0402, 5% Murata GRM1555C1H R50WA01 SMA N/A SMA connector Radiall USA Inc. 9602-1111-0 18 PCB N/A 3-layer multiple 960700 1,3,4,6 50 ΩΩ ΩΩ 0.4pF 2.2nH 0.5pF 2 5 2.2nH 50 ΩΩ ΩΩ 960700 EX JJJYM L1 L2 C1 C2 .96 3.20 SQ 1.27 .38 .81 1.70

Data Sheet: Rev D 9/20/12 - 5 of 9 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Specifications for Unmatched Condition Electrical Specifications (1) Specified Temperature Range: (2) -30 to +85 ºC Parameter (3) Conditions Min Typical (4) Max Units Center Frequency - 2535 - MHz Insertion Loss At Center Frequency - 1.9 2.75 dB Maximum Insertion Loss 2500 – 2570 MHz - 2.4 3.5 dB 3.5 dB Bandwidth (7) 2500 – 2570 MHz 70 93.2 - MHz Lower 3.5 dB Band edge (7) Upper 3.5 dB Band edge (7) 2570 2489 2582 2500 MHz MHz Amplitude Variation (5) 2500 – 2570 MHz - 1.05 1.8 dB Amplitude Ripple (6) 2500 – 2570 MHz - 0.5 1.5 dB p-p Amplitude Ripple (any 5 MHz in passband) (6) 2500 – 2570 MHz - 0.4 0.9 dB p-p Phase Ripple 2500 – 2570 MHz - 36 65 deg p-p Group Delay Ripple 2500 – 2570 MHz - 14 30 ns p-p Absolute Group Delay 2500 – 2570 MHz - 0.014 0.0 2 µs Stopband Attenuation (7) 70 – 120 MHz 300 – 500 MHz 1784 – 1854 MHz 2110 – 2170 MHz 2321 – 2391 MHz 2391 – 2465 MHz 2620 – 2673 MHz 2673 – 2695 MHz 2695 – 5000 MHz dB dB dB dB dB dB dB dB dB Input/Output VSWR 2500 – 2570 MHz - 2.4 - - Source/Load Impedance (8) Single-ended - 50 - Ω Notes: 1. All specifications are based on the TriQuint schematic for the main reference design shown below 2. In production, devices will be tested at room temperature to a guardbanded specification to ensure electrical compliance over temperature 3. Electrical margin has been built into the design to account for the variations due to temperature drift and manufacturing tolerances 4. Typical values are based on average measurements at room temperature 5. Describes the total variation over the defined frequency range 6. This is defined as the worst difference between a peak and adjacent valley within defined frequency points 7. Relative to zero dB 8. This is the optimum impedance in order to achieve the performance shown 50 Ω Single- ended Input 50 Ω Single- ended Output 1,3,4,6 2 5 50 50 ΩΩ ΩΩ ΩΩ ΩΩ 960700 JJJYM XX

Data Sheet: Rev D 9/20/12 - 6 of 9 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Typical Performance Matched (at room temperature)

Data Sheet: Rev D 9/20/12 - 7 of 9 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Typical Performance Unmatched (at room temperature)

Data Sheet: Rev D 9/20/12 - 8 of 9 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Mechanical Information Package Information, Dimensions and Marking Package Style: SMP-12A Dimensions: 3.00 x 3.00 x 1.22 mm Body: Al 2O3 ceramic Lid: Kovar , Ni plated Terminations: Au plating 0.5 - 1.0 µm, over a 2-6µm Ni plating All dimensions shown are nominal in millimeters All tolerances are ±0.15mm except overall length and width ±0.10mm The date code consists of day of the current year (Julian, 3 digits), Y = last digit of the year, and M = manufacturing site code Tape and Reel Information Standard T/R size = 5000 units/reel. All dimensions are in millimeters 0.69 1.22 NOM. 1.32 MAX. 0.75 0.60 1.50 0.75 3.00 3.00 EX code Marking Date code JJJYM logo ID dot TriQuint 3.25 Section A-A 1.75 Ø1.5 4.0 A 12.0 5.5 Ø1.5 4.0 2.0 3.25 1.4 0.21 A Ø102 Ø20.2 Ø13.0 2.0 Direction of travel Ø330 12.8 2.7 logo ID dot TriQuint

Data Sheet: Rev D 9/20/12 - 9 of 9 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Product Compliance Information ESD Information ESD Rating: 0 Value: Passes ≥ 200 V min. Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: A Value: Passes ≥ 150 V min. Test: Machine Model (MM) Standard: JEDEC Standard JESD22-A115 Solderability Compatible with the latest version of J-STD-020, le ad free solder, 260°C Refer to Soldering Profile for recommended guidelines. This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazar dous Substances in Electrical and Electronic Equipment). This product also has the following attributes:

  • Halogen Free (Chlorine, Bromine)
  • Antimony Free
  • TBBP-A (C

15 H12 Br 402) Free

  • PFOS Free
  • SVHC Free MSL Rating Devices are Hermetic, therefore MSL is not applicab le Contact Information For the latest specifications, additional product i nformation, worldwide sales and distribution locati ons, and information about TriQuint: Email: info-sales@tqs.com Fax: +1.407.886.7061 For technical questions and application information: Email: flapplication.engineering@tqs.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding t he information contained herein. TriQuint assumes no responsibility or liab ility whatsoever for any of the information contain ed herein. TriQuint assumes no responsibility or liability whatsoever f or the use of the information contained herein. Th e information contained herein is provided "AS IS, WHERE IS" and with all f aults, and the entire risk associated with such inf ormation is entirely with the user. All information contained herein is subj ect to change without notice. Customers should obt ain and verify the latest relevant information before placing orders for TriQ uint products. The information contained herein or any use of such information does not grant, explicitly or implicitl y, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized f or use as critical components in medical, life-savi ng, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe perso nal injury or death. Caution! ESD-Sensitive Device