880094_15 TRIQUINT | Alldatasheet
Document overview
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- PDF pages: 6
Technical content
1575.42 MHz GPS L1 BAW Filter
Data Sheet: Rev B 12/2011 - 1 of 6 - Disclaimer: Subject to change without notice e © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network ®
Applications
For GPS L1 Applications For high-selectivity applications Product Features Functional Block Diagram Usable bandwidth 25 MHz Low loss High selectivity Single-ended operation Ceramic chip-scale Package (CSP) Small Size Hermetic RoHS compliant, Pb-free I/O I/O GND Pin Configuration Pin # SE-Balanced Description I/O Input/Output GND Ground
Ordering Information
Part No. Description 880094 packaged part
880094 Eval Board evaluation board
Overall width, length, and thickness are the only critical dimensions. All other dimensions are for reference only. Dimensions shown are nominal in millimeters All tolerances are 0.13mm except overall length and width 0.25mm Body: Sapphire Package: Alumina Terminations: Au plating 0.5 - 2.5m, over a 2.0 – 6.0 m Ni plating
Data Sheet: Rev B 12/2011 - 2 of 6 - Disclaimer: Subject to change without notice e © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network ® Specifications Electrical Specifications (1) Specified Temperature Range: (2) -40 to +85 ºC Parameter (3) Conditions Min Typical (4) Max Units Center Frequency - 1575.42 - MHz Maximum Insertion Loss @ 1575.42 MHz - 1.8 2.5 dB 3dB Bandwidth Reference loss at 1575.42 MHz 30 35 - MHz 20dB Lower Frequency Edge 1543.42 1548 - MHz 20dB Upper Frequency Edge - 1602 1607.42 MHz VSWR @ 1575.42 MHz - 1.6 2.0 - Source Impedance (single-ended) (5) - 50 - Load Impedance (single-ended) (5) - 50 - Notes: 1. All specifications are based on the TriQuint schematic for the main reference design shown on page 3 2. In production, devices will be tested at room temperature to a guardbanded specification to ensure electrical compliance over temperature 3. Electrical margin has been built into the design to account for the variations due to temperature drift and manufacturing tolerances 4. Typical values are based on average measurements at room temperature 5. This is the optimum impedance in order to achieve the performance shown
Data Sheet: Rev B 12/2011 - 3 of 6 - Disclaimer: Subject to change without notice e © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network ® Reference Design Schematic 50 Single-ended Input I/O 50 50 I/O GND 50 Single-ended Input PC Board Mounting Configuration Refer to PCB Layout for more information. Notes: 1. All dimensions are in millimeters. 2. This footprint represents a recommendation only.
Data Sheet: Rev B 12/2011 - 4 of 6 - Disclaimer: Subject to change without notice e © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network ® Typical Performance (at room temperature) -60.0 -50.0 -40.0 -30.0 -20.0 -10.0 0.0 Frequency (MHz) d B S21 Amplitude Response -10.0 -5.0 0.0 Frequency (MHz) d B S21 Amplitude Response 0.0000 0.0100 0.0200 0.0300 0.0400 Frequency (MHz) µ s e c S21 Group Delay Response 1.0 1.5 2.0 2.5 3.0 Frequency (MHz) L i n e a r m a g S11 VSWR S11 Smith Chart
Data Sheet: Rev B 12/2011 - 5 of 6 - Disclaimer: Subject to change without notice e © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network ® Mechanical Information Marking TFR logo Date code YYWW 880098 Part no. The date code consists of: YY = last digit of year, WW = 2 digit week Tape and Reel Information Tape and Reel available upon request EIA-481 Tinning available per J-STD-001 Absolute Maximum Ratings Parameter Rating Operating Temperature -40 to +85 oC Storage Temperature -55 to +100 oC Maximum Input Power +23 dBm Operation of this device outside the parameter ranges given above may cause permanent damage. 880094
Data Sheet: Rev B 12/2011 - 6 of 6 - Disclaimer: Subject to change without notice e © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network ® Product Compliance Information ESD Information Value: Passes 8000 V min. Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 Value: Passes 1600 V min. Test: Machine Model (MM) Standard: JEDEC Standard JESD22-A115 Refer to ESD Sensitivity for data Solderability Compatible with th e latest version of J -STD-020, l ead free solder, 260°C Refer to Soldering Profile for recommended guidelines. This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br402) Free PFOS Free SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Email: info-sales@tqs.com Fax: +1.407.886.7061 For technical questions and application information: Email: info-defense@tqs.com Important Notice The information contained herein is believed to be reliable . TriQuint makes no warranties regarding the information contain herein. TriQuint assumes no responsibility or liability w hatsoever for any of the information contained her ein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual pro perty rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life -saving, or life -sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.