DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
184.32 MHz SAW Filter
Data Sheet: Rev A 9/20/12 - 1 of 6 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network
Applications
- General purpose wireless
- WCDMA/LTE applications
- 3G, 4G, Multistandard Product Features Functional Block Diagram Top view
- Usable bandwidth 25 MHz
- Low loss
- High attenuation
- Low EVM
- Balanced operation
- Ceramic Surface Mount Package (SMP)
- Small Size: 7.01 x 5.51 x 1.63 mm
- Hermetically Sealed
- RoHS compliant, Pb -free General Description Pin Configuration The 857124 is a high performance IF filter specifically designed for the demanding requirements of 4G wirel ess infrastructure systems. Designed for versatile drive configurations, this f ilter is optimized for a balanced input and output, leading to elimination of baluns. Low insertion loss, excellent attenuation and flat in- band performance leading to low EVM contribution, makes this filter an effective choice for our customers LTE an d Multi- standard platforms. Pin # Bal/Bal Description
10 Input +
12 Input -
4 Output +
6 Output -
1,2,3,5 Ground 7,8,9,11 Ground
Ordering Information
Part No. Description 857124 packaged part 857124-EVB evaluation board Standard T/R size = 3000 units/reel. 89 7 321 Output + Input + Gnd Gnd Gnd Gnd Gnd Gnd Gnd Gnd Input - Output - Pb
Data Sheet: Rev A 9/20/12 - 2 of 6 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Specifications Electrical Specifications (1) Specified Temperature Range: (2) -40 to +85 ºC Parameter (3) Conditions Min Typical (4) Max Units Center Frequency - 184.32 - MHz Insertion Loss at 184.32 MHz - 7.8 9.0 dB Amplitude Variation (5) 171.82 – 196.82 MHz (P1dB) Over any 5 MHz span within P1dB 0.5 0.3 1.0 0.8 dB dB Group Delay Variation (5 ) 171.82 – 196.82 MHz - 25 40 ns p-p Absolute Group Delay at 184.32 MHz - 0.50 0.55 µ s EVM Over any 3.84 MHz span within P1dB - 1.3 2.5 % IIP3 Tones 5 MHz separated, power >5 dBm per tone 45 54 - dBm Temperature Drift (6 ) - 0.23 0.3 dB Input VSWR 171.82 – 196.82 MHz - 1.6 2.5 - Output VSWR 171.82 – 196.82 MHz - 2.0 2.5 - Relative Attenuation (7) 10.0 – 75.0 MHz 75.0 – 151.82 MHz 151.82 – 161.82 MHz 161.82 – 166.82 MHz 202.82 – 206.82 MHz 206.82 – 216.82 MHz 216.82 – 290.0 MHz 290.0 – 330.0 MHz 330.0 – 410.0 MHz 410.0 – 2000 MHz dB dB dB dB dB dB dB dB dB dB Source Impedance (balanced) (8) - 200 - Ω Load Impedance (balanced) (8) - 150 - Ω Notes: 1. All specifications are based on the TriQuint schematic shown on page 3 2. In production, devices will be tested at room temperature to a guardbanded specification to ensure electrical compliance over temperature 3. Electrical margin has been built into the design to account for the variations due to temperature drift and manufacturing tolerances 4. Typical values are based on average measurements at room temperature 5. Variation is defined as the total peak to peak variation over the defined frequency range 6. Temperature Drift specification is defined on Page 3 and is guaranteed by design and won’t be measured in production 7. Relative to insertion loss at center frequency 8. This is the optimum impedance in order to achieve the performance shown Absolute Maximum Ratings Parameter Rating Operating Temperature -40 to + 85 oC Storage Temperature -40 to + 85 oC Input Power +22 dBm (max) CW for 24 hours at +55 °C Operation of this device outside the parameter ranges given above may cause permanent damage.
Data Sheet: Rev A 9/20/12 - 3 of 6 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Temperature Drift Specification Temperature Drift Equations: Temp Drift /g2918/g2919/g2917/g2918 = │max(T/g2911/g2923/g2912/g2919/g2915/g2924/g2930 −T/g2918/g2925/g2930 ) − min(T /g2911/g2923/g2912/g2919/g2915/g2924/g2930 − T/g2918/g2925/g2930 ) 2 │ Temp Drift /g2922/g2925/g2933 = │max (T/g2911/g2923/g2912/g2919/g2915/g2924/g2930 −T/g2913/g2925/g2922/g2914 ) − min (T/g2911/g2923/g2912/g2919/g2915/g2924/g2930 − T/g2913/g2925/g2922/g2914 ) 2 │ Temperature Drift Terms Defined: T/g2911/g2923/g2912/g2919/g2915/g2924/g2930 - Transmission power in dB measured at +25 degrees C. T/g2918/g2925/g2930 - Transmission power in dB measured at +85 degrees C. T/g2913/g2925/g2922/g2914 - Transmission power in dB measured at -40 degrees C. Temperature Drift - Greater of Temp Drift /g2918/g2919/g2917/g2918 vs Temp Drift /g2922/g2925/g2933 Reference Design – 200 ΩΩ ΩΩ Bal Input, 150 ΩΩ ΩΩ Bal Output Schematic 200 Ω Balanced Input 150 Ω Balanced Output Notes: 1. Actual matching values may vary due to PCB layout and parasitic PC Board Mounting Configuration Notes: Top, middle & bottom layers: 1 oz copper Substrates: FR4 dielectric, .031” thick Finish plating: Nickel: 3-8µm thick, Gold: .03-.2 µm thick Hole plating: Copper min .0008µm thick Notes: 1. All dimensions are in millimeters. 2. This footprint represents a recommendation only. Bill of Material Reference Desg. Value Description Manufacturer Part Number L1 56nH Coil Wire-wound, 0603, 5% Coilcraft 0603CS- 56NXJBC L2 56nH Coil Wire-wound, 0603, 5% Coilcraft 0603CS- 56NXJBC L3 47nH Coil Wire-wound, 0603, 5% Coilcraft 0603CS- 47NXJBC L4 33nH Coil Wire-wound, 0603, 5% Coilcraft 0603CS- 33NXJBC C1 8pF Chip Ceramic, 0603, 5% Panasonic ECU-V1H080D CV C2 120pF Chip Ceramic, 0603, 5% Panasonic ECU-V1H12 1KCV C3 120pF Chip Ceramic, 0603, 5% Panasonic ECU-V1H12 1KCV SMA N/A SMA connector Johnson Components 142-0701-8 01 PCB N/A 3-layer multiple 960686 1,2,3,5 7,8,9,11 200 ΩΩ ΩΩ 56nH 33nH 150 ΩΩ ΩΩ 56nH 120pF 120pF 8pF 47nH 857124 TriQuint JJJYHH 960686 C1 L3 C3 L4 5.71 .99 7.21 1.34 1.34 .99 .28 .28
Data Sheet: Rev A 9/20/12 - 4 of 6 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Typical Performance (at room temperature)
Data Sheet: Rev A 9/20/12 - 5 of 6 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Mechanical Information Package Information, Dimensions and Marking Package Style: SMP-28B Dimensions: 7.01 x 5.51 x 1.63 mm Body: Al 2O3 ceramic Lid: Kovar , Ni plated Terminations: Au plating 0.5 - 1.0 µm, over a 2-6µm Ni plating All dimensions shown are nominal in millimeters All tolerances are ±0.15mm except overall length and width ±0.10mm The date code consists of: day of the year (Julian, 3 digits), Y = last digit of the year (1 digit), HH = hour of the day (Military) and M=Manufacturing Site Code Tape and Reel Information Standard T/R size = 3000 units/reel. All dimensions are in millimeters 1.63 NOM. 1.78 MAX. 5.51 0.76 1.14 1.27 1.70 0.79 1.27 7.01 Date code 857124 TriQuint ID dot JJJYHHM Pad 1 ID dot 2.0 Ø13.0 Ø20.2 Ø330 16.8 2.7 Direction of travel Ø102 Section A-A 0.3 2.2 7.3 5.8 Ø1.5 8.0 4.0 2.0 A AØ1.5 16.0 7.5 1.75
Data Sheet: Rev A 9/20/12 - 6 of 6 - Disclaimer: Subject to change without n otice © 2012 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Product Compliance Information ESD Information ESD Rating: 1B Value: Passes ≥ 800 V min. Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: B Value: Passes ≥ 300 V min. Test: Machine Model (MM) Standard: JEDEC Standard JESD22-A115 Solderability Compatible with the latest version of J-STD-020, le ad free solder, 260°C Refer to Soldering Profile for recommended guidelines. This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazar dous Substances in Electrical and Electronic Equipment). This product also has the following attributes:
- Halogen Free (Chlorine, Bromine)
- Antimony Free
- TBBP-A (C
15 H12 Br 402) Free
- PFOS Free
- SVHC Free MSL Rating Devices are Hermetic, therefore MSL is not applicab le Contact Information For the latest specifications, additional product i nformation, worldwide sales and distribution locati ons, and information about TriQuint: Email: info-sales@tqs.com Fax: +1.407.886.7061 For technical questions and application information: Email: flapplication.engineering@tqs.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding t he information contained herein. TriQuint assumes no responsibility or liab ility whatsoever for any of the information contain ed herein. TriQuint assumes no responsibility or liability whatsoever f or the use of the information contained herein. Th e information contained herein is provided "AS IS, WHERE IS" and with all f aults, and the entire risk associated with such inf ormation is entirely with the user. All information contained herein is subj ect to change without notice. Customers should obt ain and verify the latest relevant information before placing orders for TriQ uint products. The information contained herein or any use of such information does not grant, explicitly or implicitl y, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized f or use as critical components in medical, life-savi ng, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe perso nal injury or death. Caution! ESD-Sensitive Device