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Technical content

826 MHz Notch Filter

Data Sheet: Rev B 01/19/12 - 1 of 7 - © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network

Applications

  • BC0 notch filter for SVLTE applications
  • Applicable passbands: 751 MHz B13 LTE, 782 MHz B13 LTE
  • Handsets Product Features Functional Block Diagram Top view
  • High linear notch filter
  • Usable reject band 4 MHz
  • Low loss in 746-756 MHz/777-787 MHz
  • High BC0 attenuation
  • Ceramic chip-scale Package (CSP)
  • Small Size: 2.5 x 2.00 x 0.56 mm
  • Hermetic RoHS compliant, Pb -free General Description Pin Configuration The 857031 is a high performance Surface Acoustic Wave (SAW) Notch Filter designed to reject emissions in the BC0 band while passing Band 13 LTE band. 857031 is specifically designed to enable simultaneous voice and LTE for Band 13 application. It is specifie d to support Band 13 requirements in the entire 746 - 787 MHz ba nd. The 857031 uses advanced packaging techniques to achieve an industry-leading 2.5 x 2.0 x 0.56 mm package. The filter exhibits excellent power handling capabilities. Pin # SE -Balanced Description

3 Input

9 Output

1,2,4,5,7,8,10,11 Ground 6,12,13 Case Ground

Ordering Information

Part No. Description 857031 packaged part 857031-EVB evaluation board Standard T/R size = 10,000 units/reel. Input 1 2 3 4 5 11 10 9 8 7 12 13 6 Output Gnd Gnd GndGnd Gnd Gnd Gnd Gnd Gnd Gnd Gnd

Data Sheet: Rev B 01/19/12 - 2 of 7 - © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Specifications Electrical Specifications (1) Specified Temperature Range: (2) -30 to +85 ºC Parameter (3) Conditions Min Typical (4) Max Units Center Frequency - 826 - MHz Maximum Insertion Loss 746 – 756 MHz 777– 787 MHz 0.5 0.65 0.75 0.9 dB dB Amplitude Variation 746 – 756 MHz 777– 787 MHz 0.05 0.15 0.1 0.25 dB p-p dB p-p Absolute Attenuation 824 – 828 MHz 1564 – 1574 MHz 1574 – 1577 MHz 2331 – 2361 MHz 2400 – 2484 MHz dB dB dB dB dB Input /Output Return Loss 746 – 756 MHz 777– 787 MHz dB dB IMD3 product (5) - -105 dBm Source Impedance (single-ended) (5) - 50 - Ω Load Impedance (single-ended) (5) - 50 - Ω Notes : 1. All specifications are based on the TriQuint schematic for the main reference design shown on page 3 2. In production, devices will be tested at room temperature to a guardbanded specification to ensure electrical compliance over temperature 3. Electrical margin has been built into the design to account for the variations due to temperature drift and manufacturing tolerances 4. Typical values are based on average measurements at room temperature 5. All power levels are referenced to the antenna port. Two CW tones are applied at frequencies f1 and f2, and the resultant intermodulation product in the 746-756 MHz band is measured. The first tone (f1 = 785 to 787 MHz, 24 dBm referenced to the antenna port) is applied at the input port. The second tone (f2 = 824 to 828 MHz, 13 dBm referenced to the antenna port) is applied at the output port. The intermodulation product is measured at 746 to 750 MHz Absolute Maximum Ratings (6) Parameter Rating Operating Temperature -30 to +85 oC Storage Temperature -40 to +85 oC Input Power (7) +29 dBm 6. Operation of this device outside the parameter ranges given above may cause permanent damage. 7. All ports matched to 50 Ohms. (55 oC, equivalent 5000 hours).

Data Sheet: Rev B 01/19/12 © 2011 TriQuint Semiconductor, Inc. Reference Design 50 ΩΩ ΩΩ SE In Schematic Input Single-ended FRONT END ANTENNA Notes: Actual matching values may vary due to PCB layout and parasitic PC Board Notes: Top, middle & bottom layers: 1 oz copper Substrates: FR4 dielectric, .031” thick Finish plating: Nickel: 3-8µm thick, Gold: .03- .2µm thick Hole plating: Copper min .0008µm thick Bill of Material Reference Des g. Value Description L1 10 nH Coil Wire L2 10 nH Coil Wire SMA N/A SMA connector PCB N/A 3-layer 50 ΩΩ ΩΩ - 3 of 7 - Connecting the Digital World to the Global Network SE In , 50 ΩΩ ΩΩ SE Out due to PCB layout and parasitic Mounting Configuration .2µm thick Notes: 1. Top view of the product. 2. All dimensions are in millimeters. 3. This footprint represents a recommendation only. Description Manufacturer Part Number Coil Wire -wound, 0402, y% MuRata LQW15AN Coil Wire -wound, 0402, y% MuRata LQW15AN SMA connector Radiall USA Inc. 9602 layer Multiple 960 1,2,4,5,6,7,8 10,11,12,13 3 9 50 ΩΩ ΩΩ10 nH 10 nH 2.35 1.85 0.40 0.19x45° CHAMF. 0.31 1.33 1 2 3 4 11 10 9 8 12 13 Connecting the Digital World to the Global Network Output Single-ended Mounting Configuration This footprint represents a recommendation only. Part Number LQW15AN 10NH00 LQW15AN 10NH00 9602 -1111-018 960 930 ΩΩ ΩΩ 0.20 0.55

Data Sheet: Rev B 01/19/12 - 4 of 7 - © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Typical Performance (at room temperature)

Data Sheet: Rev B 01/19/12 - 5 of 7 - © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Mechanical Information Package Information, Dimensions and Marking Package Style: CSP-10GT Dimensions: 2.5 x 2.00 x 0.56 mm Body: Al 2O3 ceramic Lid: Kovar or Alloy 42, Au over Ni plated Terminations: Au plating 0.5 - 1.0 µm, over a 2-6µm Ni plating All dimensions shown are nominal in millimeters All tolerances are ±0.15mm except overall length and width ±0.10mm The date code consists of: WW = 2 digit week, Y = last digit of year, M = manufacturing site code Tape and Reel Information Standard T/R size = 10,000 units/reel. All dimensions are in millimeters Direction of travel ID dot 2.0 Ø13.0 Ø20.2 Ø102 Ø330 8.8 2.7 1.75 3.5 8.0 A A2.0 4.0 4.0 Ø1.0 Ø1.5 2.75 1.1 0.3 Section A-A 2.23 Marking Code MFG site *GJ M W W Y ID dot Date code

Data Sheet: Rev B 01/19/12 - 6 of 7 - © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network Product Compliance Information ESD Information ESD Rating: 0 Value: Passes ≤ 150 V min. Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: M1 Value: Passes ≤ 100 V min. Test: Machine Model (MM) Standard: JEDEC Standard JESD22-A115 Solderability Compatible with the latest version of J-STD-020, le ad free solder, 260°C Refer to Soldering Profile for recommended guidelines. This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazar dous Substances in Electrical and Electronic Equipment). This product also has the following attributes:

  • Halogen Free (Chlorine, Bromine)
  • Antimony Free
  • TBBP-A (C

15 H12 Br 402) Free

  • PFOS Free
  • SVHC Free MSL Rating Devices are Hermetic, therefore MSL is not applicab le Contact Information For the latest specifications, additional product i nformation, worldwide sales and distribution locati ons, and information about TriQuint: Email: info-sales@tqs.com Fax: +1.407.886.7061 For technical questions and application information: Email: fl.product.engineering@tqs.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding t he information contain herein. TriQuint assumes no responsibility or liab ility whatsoever for any of the information contain ed herein. TriQuint assumes no responsibility or liability whatsoever f or the use of the information contained herein. Th e information contained herein is provided "AS IS, WHERE IS" and with all f aults, and the entire risk associated with such inf ormation is entirely with the user. All information contained herein is subj ect to change without notice. Customers should obt ain and verify the latest relevant information before placing orders for TriQ uint products. The information contained herein or any use of such information does not grant, explicitly or implicitl y, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. Caution! ESD-Sensitive Device

Data Sheet: Rev B 01/19/12 - 7 of 7 - © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network TriQuint products are not warranted or authorized f or use as critical components in medical, life-savi ng, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe perso nal injury or death.