ICS85211I ICST | Alldatasheet

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www.icst.com/products/hiperclocks.html REV. B ARPIL 8, 2003 ICS85211I LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER BLOCK DIAGRAM PIN ASSIGNMENT GENERAL DESCRIPTION The ICS85211I is a low skew, high perfor- mance 1-to-2 Differential-to-LVHSTL Fanout Buffer and a member of the HiPerClockS™ family of High Performance Clock Solutions from ICS. The CLK, nCLK pair can accept most standard differential input levels.The ICS85211I is charac- terized to operate from a 3.3V power supply. Guaran- teed output and part-to-part skew characteristics make the ICS85211I ideal for those clock distribution appli- cations demanding well defined performance and re- peatability. For optimal performance, terminate all outputs.

FEATURES

  • 2 differential LVHSTL compatible outputs
  • 1 differential CLK, nCLK input pair
  • CLK, nCLK pair can accept the following differential input levels: LVDS, LVPECL, LVHSTL, SSTL, HCSL
  • Maximum output frequency: 700MHz
  • Translates any single-ended input signal to LVHSTL levels with resistor bias on nCLK input
  • Output skew: 30ps (maximum)
  • Part-to-part skew: 250ps (maximum)
  • Propagation delay: 1ns (maximum)
  • Output duty cycle: 49% - 51% up to 266.6MHz
  • VOH = 1.2V (maximum)
  • 3.3V operating supply
  • -40°C to 85°C ambient operating temperature HiPerClockS™ ,&6 ICS85211I 8-Lead SOIC 3.90mm x 4.90mm x 1.37mm package body M Package Top View nQ0 nQ1 VDD CLK nCLK GND nQ0 nQ1 CLK nCLK

TABLE 1. PIN DESCRIPTIONS TABLE 2. PIN CHARACTERISTICS TABLE 3. CLOCK INPUT FUNCTION TABLE

conditions for extended periods may affect product reliability. TABLE 5. AC CHARACTERISTICS, VDD = 3.3V ± 5%, TA = -40°C TO 85°C

www.icst.com/products/hiperclocks.html REV. B ARPIL 8, 2003 ICS85211I LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER Clock Outputs 20% 80% 80% 20% t R t F VSWING Pulse Width tPERIOD tPW tPERIOD odc = nQ0, nQ1 Q0, Q1 tPD nCLK CLK nQ0, nQ1 Q0, Q1 Qx nQx Qy nQy PART 1 PART 2 tsk(pp) 3.3V OUTPUT LOAD AC TEST CIRCUIT DIFFERENTIAL INPUT LEVEL PART-TO-PART SKEW OUTPUT SKEW odc & tPERIOD OUTPUT RISE/FALL TIME PROPAGATION DELAY PARAMETER MEASUREMENT INFORMATION tsk(o) nQx Qx nQy Qy VCMR Cross Points VPP nCLK CLK GND VDD SCOPE LVHSTL Qx nQx VDD = 3.3V±5% GND = 0V

This section provides information on power dissipation and junction temperature for the ICS85211I. Equations and example calculations are also provided. The total power dissipation for the ICS85211I is the sum of the core power plus the power dissipated in the load(s). The following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results. NOTE: Please refer to Section 3 for details on calculating power dissipated in the load. device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C. moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 103.3°C/W per Table 6 below. and the type of board (single layer or multi-layer). NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs. TABLE 6. THERMAL RESISTANCE JA FOR 8-PIN SOIC, FORCED CONVECTION

  1. Calculations and Equations.

The purpose of this section is to derive the power dissipated into the load. LVHSTL output driver circuit and termination are shown in Figure 7. To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load. Pd_H is power dissipation when the output drives high. Pd_L is the power dissipation when the output drives low. FIGURE 7. LVHSTL DRIVER CIRCUIT AND TERMINATION

TABLE 7. θJAVS. AIR FLOW TABLE NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.

TABLE 8. PACKAGE DIMENSIONS

TABLE 9. ORDERING INFORMATION or critical medical instruments.

www.icst.com/products/hiperclocks.html REV. B ARPIL 8, 2003 ICS85211I LOW SKEW, 1-TO-2 DIFFERENTIAL-TO-LVHSTL FANOUT BUFFER T E E H S Y R O T S I H N O I S I V E R v e R e l b a T e g a P e g n a h C f o n o it p ir c s e D e t a D B A T I m u m ix a m d e g n a h c elb a t ylp p u S r e w o P D D A m m o rf A m o t c e p s I d e g n a h c n oit a r e dis n o C r e w o P X A M D D d e t alu cla c e r d n a A m m o rf A m o t n oit a u q e