68008-0000-35-1

COME-BID7 KONTRON | Alldatasheet

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Technical content

COM Express® basic Type 7 with Intel® XEON® D-1700/D-1800 SOC processors * Server-grade platform * Quad 10 GbE interfaces * High-speed connectivity 16x PCIe 4.0 + 16x PCIe 3.0, SATA, USB 3.0 * Up to 1 TByte NVMe SSD onboard * Industrial grade versions COMe-bID7 (E2)

www.jumptec.com Technical Information COMPLIANCE COM Express® Basic, Pin-out Type 7 - COM.0 R3.1 by default, COM.0 R3.0 on request DIMENSIONS 95 mm x 125 mm CPU (SoC) Intel® Xeon® D-1700/D-1800 Processor Series For details see table “CPU variants” given below CHIPSET - MAIN MEMORY 2x DDR4 SODIMM for up to 64 GByte ECC (non ECC on request) on request: 4x DDR4 SODIMM for up to 128 GByte ECC (non ECC on request) ETHERNET CONTROLLER Intel® I225LM/IT Intel® Quad 10GbE LAN integrated in SoC ETHERNET 1x 1/2.5 Gb (1/2.5 GBASE-T) 4x 10GbE (10 GBASE-KR) according COM.0 R3.1 STORAGE 2x SATA 6Gb/s FLASH ONBOARD Up to 1 TByte NVMe SSD (on request) PCI EXPRESS® 16x PCIe Gen4 (1 x16, 2 x8, 4 x4) according COM.0 R3.1 16x PCIe Gen3 (2 x8, 4 x4, 8 x2) USB 4x USB 3.0 / USB 2.0 SERIAL 2x serial interface (RX/TX only) OTHER FEATURES SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC SPECIAL FEATURES TPM 2.0 FEATURES ON REQUEST 4x 10G Ethernet PICMG COM.0 R3.0 compliance 4x 10G Ethernet-LEK Configurations for: SFI native: LEK 1.0-4ports (COM.0 R3.0) 10GBASE-T: LEK 2.1-4ports (COM.0 R3.0) CEI: LEK 7.0-4ports (COM.0 R3.1) PCI Express® COMe #16-31 PICMG COM.0 R3.0 compliance PCI Express® COMe #0-7 Enable PCIe x1 lanes on COMe PCIe #1, #3, #5 NVMe SSD Up to 1 TByte NVMe PCIe SSD NAND Flash 2nd SPI Flash On-module fail-safe 2nd SPI flash implemented for additional safety SODIMM sockets 4x SODIMM sockets (2x on top side + 2x on bottom side) SODIMMs Non-ECC SODIMMs CPU other CPUs than offered as standard versions BIOS custom BIOS configurations POWER MANAGEMENT ACPI 6.0 POWER SUPPLY Commercial temperature: 8.5 V - 20 V Wide Range Industrial temperature: 12 V BIOS AMI UEFI OPERATING SYSTEM Linux, Windows 10/11, Windows Server 2022 TEMPERATURE Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating HUMIDITY 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) SUPPORTED MODULES COMe-bID7 xxxxx commercial grade COMe-bID7 E2 xxxxx industrial grade COMe-bID7 (E2)

www.kontron.com3 www.jumptec.com CPU Variants CPU STD FOR COMe-bID7 GROUP TDP NO. OF CORES IOTG Extend. T emp DDR4 Freq (MT/s) BASE FREQ (GHZ) ALL/ MAX TURBO (GHZ) LAN BAND- WIDTH (GBE) QAT BAND- WIDTH (GBE) D-1746TER standard NIC 67/56 10 Yes Yes 2667 2.0 2.5/3.1 100G OFF D-1848TER on request NIC 57 10 Yes Yes 2667 2,0 2,5/3,1 100G OFF D-1749NT standard QAT 90 10 No No 2667 3.0 3.5/3.5 100G 20G D-1748TE on request NIC 65 10 No Yes 2400 2.3 2.8/3.4 50G OFF D-1747NTE standard QAT 80 10 No Yes 2933 2.5 3.0/3.5 100G 20G D-1844NT on request QAT 55 10 No No 2667 2,0 2,6/3,1 50G 20G D-1735TR standard NIC 59 8 Yes No 2933 2.2 2.7/3.4 50G OFF D-1732TE standard NIC 52 8 Yes Yes 2667 1.9 2.4/3.0 50G OFF D-1734NT on request QAT 50 8 No No 2667 2.0 2.5/3.1 50G 20G D-1736NT on request QAT 67 8 No No 2667 2.7 3.2/3.5 50G 20G D-1733NT on request QAT 53 8 No No 2400 2.0 2.5/3.1 50G 20G D-1823NT on request QAT 55 6 No No 2400 2,8 3,3/3,5 50G 10G D-1715TER standard NIC 50 4 Yes Yes 2667 2.4 2.9/3.5 50G OFF D-1712TR standard NIC 40 4 Yes No 2400 2.0 2.5/3.1 50G OFF D-1718T on request NIC 46 4 No No 2933 2.6 3.1/3.5 50G OFF D-1713NT on request QAT 45 4 No No 2400 2.2 2.9/3.5 50G 10G D-1713NTE on request QAT 45 4 No Yes 2400 2.2 2.7/3.3 50G 10G D-1813NT on request QAT 42 4 No No 2400 2,2 2,4/2,4 50G 10G D-1846 on request No LAN 55 10 No No 2933 2,0 2,6/3,1 0G OFF D-1739 on request No LAN 83 8 No No 2933 3.0 3.5/3.5 0G OFF D-1736 on request No LAN 55 8 No No 2933 2.3 2.8/3.4 0G OFF D-1834 on request No LAN 42 8 No No 2667 1,8 2,4/2,9 0G OFF D-1726 on request No LAN 70 6 No No 2933 2.9 3.4/3.5 0G OFF D-1722NE on request No LAN 36 6 No Yes 2400 1.7 2.1/2.7 0G 10G D-1714 on request No LAN 38 4 No No 2667 2.3 2.8/3.4 0G OFF D1702 on request No LAN 25 2 No No 2400 1.6 1.7/1.7 0G OFF DTR applies to these processors. See user guide for further information COMe-bID7 (E2)

www.jumptec.com Variants Carrier PART NO. COM.0 REV CPU 1 GbE SOC-LAN SOC-LEK SO-DIMM SOCKETS NVMe OP. TEMPERATURE 68008-0000-12-1 3.1 D-1712TR I225LM 4x 10GBASE 7.6 2 no 0 °C to 60 °C 68008-0000-35-1 3.1 D-1735TR I225LM 4x 10GBASE 7.6 2 no 0 °C to +60 °C 68008-0000-49-2 3.1 D-1749NT I225LM 4x 10GBASE 7.6 2 no 0 °C to +60 °C 68009-0000-15-1 3.1 D-1715TER I225IT 4x 10GBASE 7.6 2 no -40 °C to +85 °C 68009-0000-32-1 3.1 D-1732TE I225IT 4x 10GBASE 7.6 2 no -40 °C to +85 °C 68009-0000-46-1 3.1 D-1746TER I225IT 4x 10GBASE 7.6 2 no -40 °C to +85 °C 68009-0000-47-2 3.1 D-1747NTE I225IT 4x 10GBASE 7.6 2 no -40 °C to +85 °C Please contact your sales representative for other CPU versions or LAN configurations Please contact tech support for custom UEFI firmware ARTICLE PART NO. DESCRIPTION COME EVAL CARRIER T7 G2 68301-0001-00-8 COM Express® Eval Carrier Type 7 G2 ADA-COME-T7-G2 4X10G RJ45 - DEV-TOOL 68301-0000-01-4 Adapter Card with 4x RJ45 ports for use with COM Express® Eval Carrier Type 7 G2 – X557 PHY ADA-COME-T7-G2 4X10G DAC - DEV-TOOL 68301-0000-04-4 Adapter Card with 4x 10G-KR ports for use with COM Express® Eval Carrier Type 7 G2 – no PHY ADA-COME-T7-G2 4X10G SFP+ - C827-IM1 68301-0000-05-4 Adapter Card with 4x SFP+ ports for use with COM Express® Eval Carrier Type

7 G2 – C827-IM1 PHY

HSIO #22 PCIe #1 HSIO #18 HSIO #1 2nd SPI BIOS Flash LPC PCIe x1 PCIe #0,2,4 GB LAN PCIe #8-15 4x 10GbE KR PCIe #6,7 PCIe #16-31 SMB USB #0-3 (USB 3.0) GPIO Ctrl Mgmt LPC SATA#0-1 SPI GPIOPwrCtrl SysMgmt PCIe#0 PWM FAN2 I2C Xeon D-1700 / D-1800 SPI BIOS Flash Connector OptionStandard component Embedded Controller HWM NCT7802 FAN1 COM Express® connector AB – Pin-out Type 7 GBLan Intel® VCC 5VSB VBAT HWM Power sequencing Watchdog eSPI/I2C GPIO Buffer I2C EEPROM TPM 2.0 Ind. grade COM Express® connector CD – Pin-out Type 7 DDR4 Memory Controller PCIe 4.0 DDR4 SODIMM Socket max. 2933 MHz ECC 4 x LAN DDR4 SODIMM Socket max. 2933 MHz ECC HSIO #17,19 SATA 0/1 PCIe x1 SODIMM on bottom side SODIMM on bottom side NVMe HSIO #8-15 PCIe 3.0 HSIO #18 PCIe 3.0 HSIO #16 PCIe 3.0 HSIO #6,7 PCIe 3.0 HSIO #0-5 PCIe 3.0 SER0 SER1 HSIO #16 USB #0-3 (USB2.0) xHCI HSIO #20-23 HSIO #5HSIO #3 HSIO #18 PCIe #3 PCIe #5 COMe-bID7 (E2)

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Tel.: + 49 991 37024-0 contact@jumptec.de www.jumptec.com Copyright © 2025 JUMPtec. All rights reserved. All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully checked and is believed to be accurate;however, no responsibility is assumed for inaccuracies. JUMPtec and the JUMPtec logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized.Specifications are subject to change without notice. COMe-bID7 (E2)-20250218 - bmy Memory PART NO. MIN. SPEC. SIZE ECC/NON-ECC OP. TEMPERATURE 97030-0832-BID7 DDR4-3200 8 GByte ECC 0 °C to +60 °C 97030-1632-BID7 DDR4-3200 16 GByte ECC 0 °C to +60 °C 97030-3232-BID7 DDR4-3200 32 GByte ECC 0 °C to +60 °C 97031-0832-BID7 DDR4-3200 8 GByte ECC -40 °C to +85 °C 97031-1632-BID7 DDR4-3200 16 GByte ECC -40 °C to +85 °C 97031-3232-BID7 DDR4-3200 32 GByte ECC -40 °C to +85 °C Cooling ARTICLE PART NO. DESCRIPTION HSP COME-BID7 (E2) THREAD 68009-0000-99-0 Heatspreader for COMe-bID7 commercial and E2, threaded mounting holes HSP COME-BDV7 (E2) THROUGH 68009-0000-99-1 Heatspreader for COMe-bID7 commercial and E2, through holes HSK COME-BASIC ACTIVE (W/O HSP) 38025-0000-99-0C05 Active Cooler for COMe-bxL6/bDV7/bID7 to be mounted on HSP HSK COME-BASIC PASSIVE (W/O HSP) 38025-0000-99-0C06 Passive Cooler for COMe-bxL6/bDV7/bID7 to be mounted on HSP COMe-bID7 (E2)