HMC561LP3_08 HITTITE | Alldatasheet
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Technical content
Features
High Output Power: +14 dBm Low Input Power Drive: 0 to +6 dBm Fo Isolation: 15 dBc @ Fout= 16 GHz
100 KHz SSB Phase Noise: -139 dBc/Hz
RoHS Compliant 3x3 mm SMT Package Parameter Min. Typ. Max. Units Frequency Range, Input 4 - 10.5 GHz Frequency Range, Output 8 - 21 GHz Output Power 11 14 dBm Fo Isolation (with respect to output level) 15 dBc 3Fo Isolation (with respect to output level) 15 dBc 4Fo Isolation (with respect to output level) 20 dBc Input Return Loss 16 dB Output Return Loss 8d B SSB Phase Noise (100 kHz Offset) -139 dBc/Hz Supply Current (Idd) (Vdd = 5V, Vgg = -1.7V Typ.) 98 mA *Adjust Vgg between -2.0 and -1.2V to achieve Idd = 98 mA v01.0407
FREQ. MULTIPLIERS - ACTIVE - SMT 7 - 83 For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com HMC561LP3 / 561LP3E Output Power vs. Temperature @ 5 dBm Drive Level Output Power vs. Supply Voltage @ 5 dBm Drive Level Output Power vs. Drive Level SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT Output Power vs. Input Power Isolation @ 5 dBm Drive Level 7 9 11 13 15 17 19 21 23 +25 C +85 C -40 C OUTPUT POWER (dBm) FREQUENCY (GHz) -35 -30 -25 -20 -15 -10 7 9 11 13 15 17 19 21 23 Fo 2 Fo 3 Fo 4 Fo OUTPUT POWER (dBm) FREQUENCY (GHz) -20 -15 -10 -5 -2 1 4 7 10
8 GHz
14 GHz
20 GHz
OUTPUT POWER (dBm) INPUT POWER (dBm) 7 9 11 13 15 17 19 21 23 4.5 V 5.0 V 5.5 V OUTPUT POWER (dBm) FREQUENCY (GHz) -10 7 9 11 13 15 17 19 21 23 -2 dBm 0 dBm 2 dBm 4 dBm 6 dBm OUTPUT POWER (dBm) FREQUENCY (GHz) SSB Phase Noise Performance, Fout= 16 GHz, Input Power = +3 dBm -180 -150 -120 -90 -60 -30 SSB PHASE NOISE (dBc/Hz) OFFSET FREQUENCY (Hz) v01.0407
FREQ. MULTIPLIERS - ACTIVE - SMT 7 - 84 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: Order On-line at www.hittite.com Absolute Maximum Ratings RF Input (Vdd = +5V) +10 dBm Supply Voltage (Vdd) +5.5 Vdc Channel Temperature 150 °C Continuous Pdiss (T= 85 °C) (derate 9.8 mW/°C above 85 °C) 635 mW Thermal Resistance (channel to ground paddle) 102 °C/W Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C Typical Supply Current vs. Vdd Vdd (Vdc) Idd (mA) 4.5 97 5.0 98 5.5 99 Note: Multiplier will operate over full voltage range shown above. ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Input Return Loss vs. Temperature Output Return Loss vs. Temperature HMC561LP3 / 561LP3E SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT -20 -16 -12 7 9 11 13 15 17 19 21 23 +25 C +85 C -40 C RETURN LOSS (dB) FREQUENCY (GHz) -40 -35 -30 -25 -20 -15 -10 3456789 1 0 1 1 1 2 25 C +85 C -40 C RETURN LOSS (dB) FREQUENCY (GHz) Supply Current vs. Input Power 100 110 120 130 -10 -6 -2 2 6 10 Idd (mA) INPUT POWER (dBm) v01.0407
FREQ. MULTIPLIERS - ACTIVE - SMT 7 - 85 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: Order On-line at www.hittite.com Outline Drawing HMC561LP3 / 561LP3E SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE. 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN. Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC561LP3 Low Stress Injection Molded Plastic [4] Sn/Pb Solder MSL1 [1] 561 XXXX HMC561LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] 561 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX [4] For availability on Non-RoHS HMC561LP3 products please contact Hittite Microwave sales directly.
Package Information
v01.0407
FREQ. MULTIPLIERS - ACTIVE - SMT 7 - 86 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: Order On-line at www.hittite.com Pin Number Function Description Interface Schematic to RF/DC ground. 2R F I N Pin is AC coupled and matched to 50 Ohms. 4 - 9, 14, 16 N/C These pins are internally not connected; however, this product was specifi ed with these pins connected to RF/ DC ground.
11 RFOUT Pin is AC coupled and
matched to 50 Ohms. 13 Vdd Supply voltage 5V ± 0.5V. External bypass capacitors of 100 pF, 1,000 pF and 2.2 μF are required.
15 Vgg
Gate control for multiplier. Adjust to achieve Idd of 98 mA. Please follow “MMIC Amplifi er Biasing Procedure” Application note. Pin Description Application Circuit Component Value C1, C2 100 pF C3, C4 1,000 pF C5, C6 2.2 μF HMC561LP3 / 561LP3E SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT v01.0407
FREQ. MULTIPLIERS - ACTIVE - SMT 7 - 87 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: Order On-line at www.hittite.com Evaluation PCB List of Materials for Evaluation PCB 115556 [1] Item Description J1, J2 PCB Mount SRI K Connector J3 - J5 DC Pin C1, C2 100 pF Capacitor, 0402 Pkg. C3, C4 1,000 pF Capacitor, 0603 Pkg. C5, C6 2.2 μF Tantalum Capacitor U1 HMC561LP3E x2 Active Multiplier PCB [2] 115555 Eval Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 The circuit board used in the fi nal application should be generated with proper RF circuit design tech- niques. Signal lines should have 50 ohm imped- ance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. HMC561LP3 / 561LP3E v01.0407 SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 8 - 21 GHz OUTPUT