HMC182S14_08 HITTITE | Alldatasheet

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Technical content

Features

Low Insertion Loss: 0.8dB Integrated 2:4 Decoder

14 Lead SOIC Package

Electrical Specifi cations, TA = +25° C, For 0/-5V Control and Vee = -5V in a 50 Ohm System Typical Applications The HMC182S14 / HMC182S14E is ideal for:

  • 800 - 1000 MHz Basestation The HMC182S14 & HMC182S14E are low-cost terminated SP4T switches in 14-lead SOIC packages for use in antenna diversity, switched fi lter banks, gain/attenuation selection, and general channel multiplexing applications. The switch can control signals up to 2 GHz. A 2:4 decoder is integrated on the switch, requiring only 2 control lines and a neg- ative bias to select each RF path. The 2:4 decoder replaces 4 to 8 control lines normally required by GaAs SP4T switches. The HMC182S14(E) are drop-in replacements for the HMC165S14 in applications requiring low “off state” VSWR. See positive bias / TTL SP4T HMC241QS16. Parameter Frequency Min. Typ. Max. Units Insertion Loss DC - 1.0 GHz DC - 2.0 GHz 0.7 0.8 1.1 1.2 dB dB Isolation DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz dB dB dB Return Loss “On State” “On State” “Off State” “Off State” DC - 1.0 GHz DC - 2.0 GHz DC - 1.0 GHz DC - 2.0 GHz dB dB dB dB Input Power for 1 dB Compression 50 MHz 0.5 - 2.0 GHz dBm dBm Input Third Order Intercept (Two-Tone Input Power = 7 dBm Each Tone).

50 MHz

0.5 - 1.0 GHz 0.5 - 2.0 GHz dBm dBm dBm Switching Characteristics DC - 2.0 GHz tRISE, tFALL (10/90% RF) tON, tOFF (50% CTL to 10/90% RF) ns ns

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com Insertion Loss Isolation Return Loss Isolation Between Several RF l/Os -60 -50 -40 -30 -20 0123 ISOLATION (dB) FREQUENCY (GHz) RF1-2 RF4-1 RF2-4 RF3-1 Bias Voltage & Current Control Voltages Vee Range = -5.0 Vdc ± 10% Vee (Vdc) Iee (Typ.) (mA) Iee (Max.) (mA) -5.0 4.0 7.0 State Bias Condition Low 0 to -3 VDC @ 70 uA Typ. High -5 to -4.2 VDC @ 5 uA Typ. Truth Table Control Input Signal Path State A B RFCOM to: High High RF1 Low High RF2 High Low RF3 Low Low RF4 HMC182S14 / 182S14E GaAs MMIC SP4T NON-REFLECTIVE SWITCH, DC - 2 GHz v03.0805 -1.5 -0.5 0 0.5 1 1.5 2 2.5 3 RF1 On RF2 On RF3 On RF4 On INSERTION LOSS (dB) FREQUENCY (GHz) -35 -30 -25 -20 -15 -10 0 0.5 1 1.5 2 2.5 3 RFC RF1,2,3,4 On RF1,2,3,4 Off RETURN LOSS (dB) FREQUENCY (GHz) -60 -50 -40 -30 -20 -10 0 0.5 1 1.5 2 2.5 3 RF1 Off RF2 Off RF3 Off RF4 Off ISOLATION (dB) FREQUENCY (GHz)

For price, delivery, and to place orders, please contact Hittite Microwave Corporation: Order On-line at www.hittite.com Absolute Maximum Ratings Outline Drawing Bias Voltage Range (Port Vee) -7 Vdc Control Voltage Range (A & B) Vee -0.5V to +1.0 Vdc Channel Temperature 150 °C Thermal Resistance (Insertion Loss Path) 123 °C/W Thermal Resistance (Terminated Path) 260 °C/W Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C Maximum Input Power +27 dBm (<500 MHz) +30 dBm (>500 MHz) ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS HMC182S14 / 182S14E GaAs MMIC SP4T NON-REFLECTIVE SWITCH, DC - 2 GHz v03.0805 NOTES: 1 . LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Part Number Package Body Material Leadframe Plating MSL Rating Package Marking [3] HMC182S14 Low Stress Injection Molded Plastic Silica and Silicon Impregnated Sn/Pb Solder MSL1 [1] HMC182 XXXX HMC182S14E RoHS-compliant Low Stress Injection Molded Plastic Silica and Silicon Impregnated 100% Matte Tin MSL1 [2] HMC182 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX

Package Information

For price, delivery, and to place orders, please contact Hittite Microwave Corporation: Order On-line at www.hittite.com Note: Control inputs A and B can be driven directly with TTL logic with -5 Volts applied to theHCT logic gate Vee pin and to Vee (pin 10) of the RF switch. TTL Interface Circuit HMC182S14 / 182S14E GaAs MMIC SP4T NON-REFLECTIVE SWITCH, DC - 2 GHz v03.0805

For price, delivery, and to place orders, please contact Hittite Microwave Corporation: Order On-line at www.hittite.com Evaluation PCB The circuit board used in the fi nal application should be generated with proper RF circuit design techniques. Signal lines at the RF port should have 50 ohm impedance and the package ground leads should be connected directly to the ground plane similar to that shown above. The evaluation circuit board shown above is available from Hittite Micro- wave Corporation upon request. Item Description J1 - J5 PCB Mount SMA RF Connector J6 - J9 DC Pin C1 - C5 330 pF capacitor, 0402 Pkg. C6 - C8 10,000 pF capacitor, 0603 Pkg. U1 HMC182S14 / HMC182S14E SP4T Switch PCB [2] 101656 Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 HMC182S14 / 182S14E GaAs MMIC SP4T NON-REFLECTIVE SWITCH, DC - 2 GHz v03.0805 List of Materials for Evaluation PCB 101672 [1]

For price, delivery, and to place orders, please contact Hittite Microwave Corporation: Order On-line at www.hittite.com Notes: HMC182S14 / 182S14E GaAs MMIC SP4T NON-REFLECTIVE SWITCH, DC - 2 GHz v03.0805