HMC183QS24_08 HITTITE | Alldatasheet

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Technical content

Features

Low Insertion Loss (1 GHz): 0.8dB Integrated 3:8 Decoder

24 Lead QSOP Package

Electrical Specifi cations, TA = +25° C, For 0/-5V Control and Vee = -5V in a 50 Ohm System Typical Applications The HMC183QS24 / HMC183QS24E is ideal for:

  • Basestation Infrastructure The HMC183QS24 & HMC183QS24E are low-cost non-refl ective SP8T switches in 24-lead QSOP pack- ages for use in antenna diversity, switched fi lter banks, gain/attenuation selection, and general chan- nel multiplexing applications. A 3:8 decoder is inte- grated on the switch, requiring only 3 control lines with a negative bias to select an RF path. The 3:8 decoder replaces 1 6 control lines normally required by GaAs SP8T switches. Switch outputs are terminated when “off”. The QSOP24 package occupies the same area as a 14-lead SOIC. See positive bias/TTL version HMC253QS24. Parameter Frequency Min. Typ. Max. Units Insertion Loss DC - 1.0 GHz DC - 1.5 GHz DC - 2.0 GHz 0.8 1.0 1.3 1.2 1.5 1.8 dB dB dB Isolation DC - 0.5 GHz DC - 1.0 GHz DC - 1.5 GHz DC - 2.0 GHz dB dB dB dB Return Loss RFC DC - 1.0 GHz DC - 1.5 GHz DC - 2.0 GHz dB dB dB Return Loss RF 1-8 ‘ON’ and ‘OFF’ DC - 1.0 GHz DC - 1.5 GHz DC - 2.0 GHz dB dB dB Input Power for 1 dB Compression 50 MHz 0.5 - 2.0 GHz dBm dBm Input Third Order Intercept (Two-Tone Input Power = +7 dBm Each Tone)

50 MHz

0.5 - 2.0 GHz dBm dBm Switching Characteristics DC - 2.0 GHz tRISE, tFALL (10/90% RF) tON, tOFF (50% CTL to 10/90% RF) ns ns

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com Insertion Loss Isolation Return Loss Isolation Between Several RF l/Os Bias Voltage & Current Control Voltages Vee Range = -5.0 Vdc ± 10% Vee (Vdc) Iee (Typ.) (mA) Iee (Max.) (mA) -5.0 6.0 9.0 State Bias Condition Low 0 to -3 VDC 2 70 uA Typ. High -5 to -4.2 VDC @ 5 uA Typ. HMC183QS24 / 183QS24E GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 2 GHz v02.0805 -2.5 -1.5 -0.5 0 0.5 1 1.5 2 2.5 3 +25 C -40 C +85 C INSERTION LOSS (dB) FREQUENCY (GHz) -60 -50 -40 -30 -20 0 0.5 1 1.5 2 2.5 3 RF 8-7 RF 7-6 RF 5-4 RF 4-3 RF 3-2 RF 2-1 ISOLATION (dB) FREQUENCY (GHz) -30 -25 -20 -15 -10 0 0.5 1 1.5 2 2.5 3 S11 RFC S22 "On" S22 "Off" RETURN LOSS (dB) FREQUENCY (GHz) -60 -50 -40 -30 -20 -10 0 0.5 1 1.5 2 2.5 3 ISOLATION (dB) FREQUENCY (GHz)

For price, delivery, and to place orders, please contact Hittite Microwave Corporation: Order On-line at www.hittite.com Truth TableAbsolute Maximum Ratings Outline Drawing Bias Voltage Range (Port Vee) -7.0 Vdc Control Voltage Range (A & B) Vee -0.5 to +1.0 Vdc Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C Maximum Input Power +26 dBm (<500 MHz) +29 dBm (>500 MHz) Control Input Signal Path State AB C R F C O M t o : High High High RF1 Low High High RF2 High Low High RF3 Low Low High RF4 High High Low RF5 Low High Low RF6 High Low Low RF7 Low Low Low RF8 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS HMC183QS24 / 183QS24E GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 2 GHz v02.0805 NOTES: 1 . LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Part Number Package Body Material Leadframe Plating MSL Rating Package Marking [3] HMC183QS24 Low Stress Injection Molded Plastic Silica and Silicon Impregnated Sn/Pb Solder MSL1 [1] HMC183 XXXX HMC183QS24E RoHS-compliant Low Stress Injection Molded Plastic Silica and Silicon Impregnated 100% Matte Tin MSL1 [2] HMC183 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX

Package Information

For price, delivery, and to place orders, please contact Hittite Microwave Corporation: Order On-line at www.hittite.com Evaluation Circuit Board The circuit board used in the fi nal application should be generated with proper RF circuit design tech- niques. Signal lines at the RF port should have 50 ohm impedance and the package ground leads and package bottom should be connected directly to the ground plane similar to that shown above. The eval- uation circuit board shown above is available from Hittite Microwave Corporation upon request. Item Description J1 - J9 PCB Mount SMA RF Connector J10 - J14 DC Pin C1 - C9 100 pF capacitor, 0402 Pkg. C10 10,000 pF capacitor, 0603 Pkg. U1 HMC183QS24 / HMC183QS24E SP8T Switch PCB* 103704 Evaluation PCB [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 HMC183QS24 / 183QS24E GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 2 GHz v02.0805 List of Materials for Evaluation PCB 103706 [1]