PE42660 PEREGRINE | Alldatasheet

Document overview

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Technical content

Features

  • Three pin CMOS logic control with integral decoder/driver
  • Exceptional harmonics performance: 2fo = -88 dBc and 3fo = -85 dBc
  • Low TX insertion loss: 0.55 dB at 900 MHz, 0.65 dB at 1900 MHz
  • TX – RX Isolation of 48 dB at 900 MHz, 40 dB at 1900 MHz
  • 1500 V HBM ESD tolerance all ports
  • 41 dBm P1dB
  • No blocking capacitors required

©2005 Peregrine Semiconductor Corp. All rights reserved. Table 1. Electrical Specifications @ +25 °C, VDD = 2.75 V (ZS = ZL = 50 Ω) Table 2. Operating Ranges Note: 1. Assumes RF input period of 4620 µs and duty cycle of 50%.

Document No. 70-0192-02 │www.psemi.com ©2005 Peregrine Semiconductor Corp. All rights reserved. TX1 PE42660 Die ANT TX2 RX1 RX2 VDD GND GND GND GND GND RX3 GND GND GND GND RX4 GND Table 3. Pin Descriptions ground plane for best performance.

  1. Blocking capacitors needed only when non-zero DC

Figure 3. Pin Configuration (Top View) exceeding the specified rating. devices are immune to latch-up. Table 5. Truth Table

Description

RF Common – Antenna TX1 RF I/O - TX1 GND Ground (Requires two bond wires) TX2 RF I/O – TX2 GND Ground GND Ground VDD Supply Switch control input, CMOS logic level GND Ground Switch control input, CMOS logic level Switch control input, CMOS logic level 122 GND Ground 132 GND Ground 143 RX4 RF I/O – RX4 152 GND Ground 163 RX3 RF I/O – RX3 172 GND Ground 183 RX2 RF I/O – RX2 192 GND Ground 203 RX1 RF I/O – RX1 Table 4. Absolute Maximum Ratings Notes: 4. Assumes RF input period of 4620 µs and duty cycle of 50%.

  1. VDD within operating range specified in Table 2.

©2005 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0192-02 │ UltraCMOS™ RFIC Solutions Die Handling All die products must be handled only at ESD safe workstations using standard ESD precautions. It is recommended that the die be handled only in a class 10,000 or better designated clean room environment. Singulated dice are not to be handled with tweezers. A vacuum wand with a non-metallic ESD protected tip must be used. Recommended Dice Assembly Procedure Cleaning Dice do not require cleaning prior to assembly. Die Attach The PE42660 die substrate is sapphire – the recommended die attach operation for sapphire is epoxy die attach adhesive. An eutectic die attach method does not work with sapphire substrates. Bonding Thermo compression gold ball or aluminum ultrasonic bonding may be used. The ball should cover the bonding pad, but not excessively, or it may short out the surrounding metallization. Aluminum or gold 1-mil wire is recommended. Note the bonding pad material is aluminum. Shipping Method Standard die carrier packages and wafer film frames are placed in a wafer container and then vacuum- sealed inside an ESD shielded bag. Sealed product is then placed inside a corrugated cardboard box surrounded by bubble wrap or foam for maximum protection during shipment.

©2005 Peregrine Semiconductor Corp. All rights reserved. Table 6. Mechanical Specifications Table 7. Pad Coordinates All pad openings are 60 x 60 µm except for Pad #3 which is 140 x 60 µm. Note 1. - Double pad, requires two bond wires. Figure 9. Pad Numbering

©2005 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0192-02 │ UltraCMOS™ RFIC Solutions Table 9. Ordering Information meet the levels as specified in the IEC spec. Figure 10. ESD Protection Circuit Table 8. PE42660 Antenna Application Test Results C9807_01 PE42660-DIE-D Film Frame Wafer (Gross Die / Wafer Quantity) 42660-99 C9807_01 PE42660-DIE-400G Waffle Pack

400 Dice / Waffle Pack

C9807_01 PE42660-DIE-1H Evaluation Kit 1/ box

Document No. 70-0192-02 │www.psemi.com ©2005 Peregrine Semiconductor Corp. All rights reserved. Sales Offices The Americas Peregrine Semiconductor Corp.

9450 Carroll Park Drive

San Diego, CA 92121 Tel 858-731-9400 Fax 858-731-9499 North Asia Pacific Peregrine Semiconductor K.K. 5A-5, 5F Imperial Tower 1-1-1 Uchisaiwaicho, Chiyoda-ku Tokyo 100-0011 Japan Tel: +81-3-3502-5211 Fax: +81-3-3502-5213 Europe Peregrine Semiconductor Europe Commercial Products: Bâtiment Maine 13-15 rue des Quatre Vents F- 92380 Garches, France Space and Defense Products:

180 Rue Jean de Guiramand

13852 Aix-En-Provence cedex 3, France

Tel: +33(0) 4 4239 3361 Fax: +33(0) 4 4239 7227 For a list of representatives in your area, please refer to our Web site at: www.psemi.com Data Sheet Identification Advance Information The product is in a formative or design stage. The data sheet contains design target specifications for product development. Specifications and features may change in any manner without notice. Preliminary Specification The data sheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification The data sheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a DCN (Document Change Notice). The information in this data sheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user’s own risk. No patent rights or licenses to any circuits described in this data sheet are implied or granted to any third party. Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, and UTSi are registered trademarks and UltraCMOS and HaRP are trademarks of Peregrine Semiconductor Corp. South Asia Pacific Peregrine Semiconductor 28G, Times Square, No. 500 Zhangyang Road, Shanghai, 200122, P.R. China Tel: +86-21-5836-8276 Fax: +86-21-5836-7652