36035-1600-11-5

COME-CAP6 KONTRON | Alldatasheet

Document overview

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Technical content

COM Express ® compact Type 6 with 12th Generation Intel® Core™ Processors  Up to 64 GByte LPDDR5 memory down  Up to 2.5 Gb Ethernet  Quad independent display support (up to 8k)  Optional NVMe SSD onboard

SATA#1 SATA#0 PCIe #0-4 PCIe #6-7 PCIe #5 Intel® Mobile RM590E / QM580E / HM570E PCH SER0 SER1 SER0 SER1 SPI GSPI GPIOLPC eSPI PCIe LVDS SMB SER0 SER1 GPIO Ctrl Mgmt HDA PEG USB #0-3 (USB3.2 Gen2) PwrCtrl SysMgmt USB #0-3 (USB2.0) PWM FAN2 I2C eDP USB #4-7 (USB 2.0) LID Sleep Connector OptionStandard component LAN Embedded Controller HWM FAN1 eDP2 LVDS COM Express® connector AB – Pin-out Type 6 VCC 5VSB VBAT HWM Power sequencing Watchdog I2C GPIO Buffer I2C EEPROM UART COM Express® connector CD – Pin-out Type 6 VCC xHCI DP++ PEG Config CPLD xHCI NVMe 2nd SPI BIOS Flash SPI BIOS Flash TPM Intel® 12th Generation Core™ Alder Lake-P Series SoCs Chipset integrated GFX 2x4 (+1x8) LAN Intel® I226 LPDDR5 memory down // 2 www.kontron.com TECHNICAL INFORMATIONˆ COMPLIANCE COM Express® Compact Pin-out Type 6 DIMENSIONS (H x W) 95 x 95 mm CPU Intel® 12th Generation Core™ family For details see table (CPU variants) given below CHIPSET Integrated SoC MAIN MEMORY Dual-Channel LPDDR5 memory down up to 64 GByte GRAPHICS CONTROLLER Intel® Iris® Xe Graphics on i7/i5 processors Intel® UHD Graphics on i3/Celeron® processors ETHERNET CONTROLLER Intel® i226LM/i226IT ETHERNET Up to 2.5Gb Ethernet STORAGE Up to 2x SATA 6Gb/s FLASH ONBOARD Up to 1 TByte NVMe SSD (on request) PCI EXPRESS® 5x PCIe 3.0 (On request: 6x without Ethernet, up to 8x without Ethernet & SATA) 2x 4 PCIe 4.0 on PEG Lanes #0-7 1x 8 PCIe 4.0 on PEG Lanes #8-15 (depending on SKU) DISPLAY DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit USB 4x USB 3.2 Gen2 (incl. USB 2.0) + 4x USB 2.0 SERIAL 2x serial interface (RX/TX only) AUDIO High Definition Audio interface OTHER FEATURES (G)SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC SPECIAL FEATURES POSCAP capacitors, Trusted Platform Module TPM 2.0 FEATURES ON REQUEST vPRO (AMT/TXT/AES Support), eDP instead of LVDS, USB-C, up to 3x PCIe x1 additional w/o Ethernet & SATA, NVMe SSD, Fail Safe via 2nd SPI Flash POWER MANAGEMENT ACPI 6.0 POWER SUPPLY 8.5 V – 20 V Wide Range, Single Supply Power BIOS AMI Aptio V OPERATING SYSTEM Windows®10, Linux, VxWorks (project based) TEMPERATURE 0 °C to +60 °C operating, -30 °C to +85 °C non-operating HUMIDITY 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) BLOCK DIAGRAMˆ

// 3 www.kontron.com CPU VARIANTSˆ 12th GEN ALDER LAKE H-SERIES (45 W) CPU i7-12800HE i5-12600HE i3-12300HE CORES 14 12 8 NUMBER OF P-CORES 6 4 4 NUMBER OF E-CORES 8 8 4 TDP 45/35 W 45/35 W 45/35 W CACHE 24 MByte 18 Mbyte 12 Mbyte IBECC no no no TCC/TSN no no no 12th GEN ALDER LAKE P-SERIES (28 W) CPU i7-1270PE i5-1250PE i3-1220PE CORES 12 12 8 NUMBER OF P-CORES 4 4 4 NUMBER OF E-CORES 8 8 4 TDP 28/20 W 28/20 W 28/20 W CACHE 18 MByte 12 Mbyte 12 Mbyte IBECC no no no TCC/TSN no no no 12th GEN ALDER LAKE U-SERIES (15 W) CPU i7-1265UE i5-1245UE i3-1215UE Celeron® 7305E CORES 10 10 6 5 NUMBER OF P-CORES 2 2 2 1 NUMBER OF E-CORES 8 8 4 4 TDP 15/12 W 15/12 W 15/12 W 15/12 W CACHE 12 MByte 12 Mbyte 10 Mbyte 8 Mbyte IBECC no no no no TCC/TSN no no no no

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T el.: + 49 821 4086-0 Fax: + 49 821 4086-111 info@kontron.com www.kontron.com Copyright © 2022 Kontron. All rights reserved. All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Kontron and the Kontron logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized. Specifications are subject to change without notice. COMe-cAP6-20221129- bmy CARRIER COOLING ˆˆ ARTICLE PART NO. DESCRIPTION COME EVAL CARRIER2 T6 38116-0000-00-5 COM Express® Evaluation Carrier Type 6 ARTICLE PART NO. DESCRIPTION HSP COME-CAP6 CU-CORE THREADED 36035-0000-99-0 Heatspreader for COMe-cAP6, Cu-core, threaded mounting holes HSP COME-CAP6 CU-CORE THROUGH 36035-0000-99-1 Heatspreader for COMe-cAP6, Cu-core, through mounting holes COME ACTIVE UNI COOLER2 (W/O HSP) 36099-0000-99-4 COM Express® Universal Active Cooler for Heatspreader Mounting (95 x 95 x 14.3) - 90° turnable COME PASSIVE UNI COOLER2 (W/O HSP) 36099-0000-99-5 COM Express® Universal Passive Cooler for Heatspreader Mounting (95 x 95 x 14.3) - 90° turnable VARIANTSˆ PART NO. CPU PCH MEM. DOWN SO-DIMM FLASH OP. TEMPERATURE 36035-6400-18-7 i7-12800HE - 64 GByte - - 0 °C - 60 °C 36035-3200-18-7 i7-12800HE - 32 GByte - - 0 °C - 60 °C 36035-3200-18-5 i5-12600HE - 32 GByte - - 0 °C - 60 °C 36035-1600-18-5 i5-12600HE - 16 GByte - - 0 °C - 60 °C 36035-1600-15-3 i3-12300HE - 16 GByte - - 0 °C - 60 °C 36035-3200-12-7 i7-1270PE - 32 GByte - - 0 °C - 60 °C 36035-1600-12-5 i5-1250PE - 16 GByte - - 0 °C - 60 °C 36035-1600-11-3 i3-1220PE - 16 GByte - - 0 °C - 60 °C 36035-1600-12-7 i7-1265UE - 16 GByte - - 0 °C - 60 °C 36035-1600-11-5 i5-1245UE - 16 GByte - - 0 °C - 60 °C 36035-8000-09-3 i3-1215UE - 8 GByte - - 0 °C - 60 °C 36035-8000-09-1 7305E - 8 GByte - - 0 °C - 60 °C