HMC253QS24_07 HITTITE | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

Features

Low Insertion Loss (2 GHz): 1.3dB Single Positive Supply: Vdd = +5V Integrated 3:8 TTL Decoder

24 Lead QSOP Package

Electrical Specifi cations, TA = +25° C, For TTL Control and Vdd = +5V in a 50 Ohm system Typical Applications The HMC253QS24 / HMC253QS24E is ideal for DC - 2.5 GHz applications:

  • CATV/DBS
  • CDMA
  • Cellular/PCS The HMC253QS24 & HMC253QS24E are low-cost n o n - r e fl e c t i v e S P 8 T s w i t c h e s i n 2 4 - l e a d Q S O P packages featuring wideband operation from DC to 2.5 GHz. The switch offers a single positive bias and true TTL/CMOS compatibility. A 3:8 decoder is integrated on the switch requiring only 3 control lines and a positive bias to select each path. The HMC253QS24 & HMC253QS24E SP8T will replace multiple confi gurations of SP4T and SPDT MMIC switches. Parameter Frequency Min. Typ. Max. Units Insertion Loss DC - 1.0 GHz DC - 2.0 GHz DC - 2.5 GHz 1.1 1.3 1.8 1.5 1.7 2.4 dB dB dB Isolation DC - 1.0 GHz DC - 2.0 GHz DC - 2.5 GHz dB dB dB Return Loss “On State” DC - 1.0 GHz DC - 2.0 GHz DC - 2.5 GHz dB dB dB Return Loss (RF1-8) “Off State” 0.3 - 2.5 GHz 0.5 - 2.5 GHz dB dB Input Power for 1 dB Compression 0.3 - 2.5 GHz 20 23 dBm Input Third Order Intercept (Two-Tone Input Power = +7 dBm Each Tone) 0.3 - 2.5 GHz 40 43 dBm Switching Characteristics 0.3 - 2.5 GHz tRISE, tFALL (10/90% RF) tON, tOFF (50% CTL to 10/90% RF) 100 ns ns

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com Return Loss Insertion Loss Isolation TTL/CMOS Control Voltages Bias Voltage & Current Vdd Range = +5.0 Vdc ± 10% Vdd (Vdc) Idd (Typ.) (mA) Idd (Max.) (mA) +5.0 6.0 9.0 State Bias Condition Low 0 to +0.8 Vdc @ 5 uA Typ. High +2.0 to +5.0 Vdc @ 70 uA Typ. Truth Table Control Input Signal Path State ABC R F C O M t o : Low Low Low RF1 High Low Low RF2 Low High Low RF3 High High Low RF4 Low Low High RF5 High Low High RF6 Low High High RF7 High High High RF8 NOTE: DC Blocking capacitors are required at ports RFC and RF1, 2, 3, 4, 5, 6, 7, 8. HMC253QS24 / 253QS24E GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 2.5 GHz v04.0805 -2.5 -1.5 -0.5 0123 +25 C +85 C -40 C INSERTION LOSS (dB) FREQUENCY (GHz) -30 -25 -20 -15 -10 0123 RFC RFC 1-6 On RFC 1-6 Off RETURN LOSS (dB) FREQUENCY (GHz) -70 -60 -50 -40 -30 -20 -10 0123 ISOLATION (dB) FREQUENCY (GHz) RF6, RF3 RF1, RF2, RF4, RF5, RF7, RF8

For price, delivery, and to place orders, please contact Hittite Microwave Corporation: Order On-line at www.hittite.com Absolute Maximum Ratings Outline Drawing Bias Voltage Range (Port Vdd) +7.0 Vdc Control Voltage Range (A, B, C) -0.5V to Vdd +1Vdc Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C Maximum Input Power Vdd = +5V +20 dBm (0.05 - 0.5 GHz) +24 dBm (0.5 - 2.5 GHz) ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS HMC253QS24 / 253QS24E GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 2.5 GHz v04.0805 NOTES: 1 . LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Part Number Package Body Material Leadframe Plating MSL Rating Package Marking [3] HMC253QS24 Low Stress Injection Molded Plastic Silica and Silicon Impregnated Sn/Pb Solder MSL1 [1] HMC253 XXXX HMC253QS24E RoHS-compliant Low Stress Injection Molded Plastic Silica and Silicon Impregnated 100% Matte Tin MSL1 [2] HMC253 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX

Package Information

For price, delivery, and to place orders, please contact Hittite Microwave Corporation: Order On-line at www.hittite.com Evaluation Circuit Board The circuit board used in the fi nal application should be generated with proper RF circuit design tech- niques. Signal lines at the RF ports should have 50 ohm impedance while the package ground leads should be connected directly to the ground plane similar to that shown above. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown above is available from Hittite Microwave Corporation upon request. Item Description J1 - J9 PCB Mount SMA Connector J10 - J14 DC Pin C1 - C9 100 pF Capacitor, 0402 Pkg. C10 0.01 uF Capacitor, 0603 Pkg. U1 HMC253QS24 / HMC253QS24E SP8T Switch PCB [2] 103704 Eval Board [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 HMC253QS24 / 253QS24E GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 2.5 GHz v04.0805 List of Materials for Evaluation PCB 103706 [1]